TWI348596B - Exposure apparatus and method - Google Patents
Exposure apparatus and methodInfo
- Publication number
- TWI348596B TWI348596B TW095126818A TW95126818A TWI348596B TW I348596 B TWI348596 B TW I348596B TW 095126818 A TW095126818 A TW 095126818A TW 95126818 A TW95126818 A TW 95126818A TW I348596 B TWI348596 B TW I348596B
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure apparatus
- exposure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005212254A JP4701030B2 (ja) | 2005-07-22 | 2005-07-22 | 露光装置、露光パラメータを設定する設定方法、露光方法、デバイス製造方法及びプログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717186A TW200717186A (en) | 2007-05-01 |
TWI348596B true TWI348596B (en) | 2011-09-11 |
Family
ID=37656739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095126818A TWI348596B (en) | 2005-07-22 | 2006-07-21 | Exposure apparatus and method |
Country Status (5)
Country | Link |
---|---|
US (1) | US7864296B2 (zh) |
JP (1) | JP4701030B2 (zh) |
KR (1) | KR100871505B1 (zh) |
CN (1) | CN1900828B (zh) |
TW (1) | TWI348596B (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101324402B1 (ko) * | 2005-11-03 | 2013-11-01 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래픽 프로젝션 노광 장치 및 이 장치의 교정방법 |
JP4478670B2 (ja) * | 2006-09-08 | 2010-06-09 | ソニー株式会社 | 1次元照明装置及び画像生成装置 |
DE102008003916A1 (de) * | 2007-01-23 | 2008-07-24 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie mit Messvorrichtung sowie Verfahren zum Messen einer Bestrahlungsstärkeverteilung |
KR100919578B1 (ko) * | 2007-02-15 | 2009-10-01 | 주식회사 하이닉스반도체 | 노광 장치 및 이를 이용한 반도체 소자의 형성 방법 |
JP4966724B2 (ja) | 2007-04-20 | 2012-07-04 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
US7817250B2 (en) | 2007-07-18 | 2010-10-19 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus |
JP2009025553A (ja) | 2007-07-19 | 2009-02-05 | Canon Inc | 位相シフトマスク |
JP4950795B2 (ja) * | 2007-07-30 | 2012-06-13 | キヤノン株式会社 | 露光装置、デバイス製造方法及び補正方法 |
US7999920B2 (en) * | 2007-08-22 | 2011-08-16 | Asml Netherlands B.V. | Method of performing model-based scanner tuning |
US8570489B2 (en) * | 2007-11-08 | 2013-10-29 | Asml Netherlands B.V. | Lithographic projection apparatus and method of compensating perturbation factors |
KR100945387B1 (ko) * | 2007-11-14 | 2010-03-04 | 서강대학교산학협력단 | 시료의 비선형계수의 균질성 검사 장치 |
JP5055141B2 (ja) * | 2008-01-10 | 2012-10-24 | キヤノン株式会社 | 評価方法、調整方法、露光装置、およびプログラム |
JP2009194041A (ja) | 2008-02-12 | 2009-08-27 | Canon Inc | 評価方法、調整方法、露光装置、およびコンピュータプログラム |
TW200938957A (en) * | 2008-03-05 | 2009-09-16 | Nanya Technology Corp | Feedback system and feedback method for controlling power ratio of light source |
JP4568340B2 (ja) * | 2008-03-12 | 2010-10-27 | 株式会社東芝 | 半導体装置の製造方法 |
JP5238879B2 (ja) * | 2008-05-09 | 2013-07-17 | カール・ツァイス・エスエムティー・ゲーエムベーハー | フーリエ光学系を含む照明系 |
US8806387B2 (en) * | 2008-06-03 | 2014-08-12 | Asml Netherlands B.V. | Model-based process simulation systems and methods |
JP2010034478A (ja) * | 2008-07-31 | 2010-02-12 | Toshiba Corp | 露光装置の管理方法、半導体装置の製造方法及びフォトマスク |
CN102138201B (zh) * | 2008-09-01 | 2014-12-31 | D2S公司 | 用可变形束光刻的光学邻近校正、设计和制造光刻板方法 |
JP2010114266A (ja) * | 2008-11-06 | 2010-05-20 | Canon Inc | 露光装置およびその制御方法、ならびにデバイス製造方法 |
EP2207064A1 (en) * | 2009-01-09 | 2010-07-14 | Takumi Technology Corporation | Method of selecting a set of illumination conditions of a lithographic apparatus for optimizing an integrated circuit physical layout |
JP5842808B2 (ja) * | 2010-02-20 | 2016-01-13 | 株式会社ニコン | 瞳強度分布を調整する方法 |
JP5574749B2 (ja) * | 2010-02-24 | 2014-08-20 | キヤノン株式会社 | 露光条件及びマスクパターンのうち少なくとも一方を決定する決定方法及びプログラム、情報処理装置 |
JP2011197520A (ja) * | 2010-03-23 | 2011-10-06 | Toppan Printing Co Ltd | フォトマスク製造方法 |
DE102010029651A1 (de) * | 2010-06-02 | 2011-12-08 | Carl Zeiss Smt Gmbh | Verfahren zum Betrieb einer Projektionsbelichtungsanlage für die Mikrolithographie mit Korrektur von durch rigorose Effekte der Maske induzierten Abbildungsfehlern |
JP5787382B2 (ja) * | 2011-02-28 | 2015-09-30 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィ投影露光装置の照明系 |
JP5168526B2 (ja) | 2011-05-10 | 2013-03-21 | 大日本印刷株式会社 | 投射型映像表示装置 |
DE102012203944A1 (de) * | 2012-03-14 | 2013-10-02 | Carl Zeiss Smt Gmbh | Verfahren zur Justage eines optischen Systems einer mikrolithographischen Projektionsbelichtungsanlage |
DE102012207377A1 (de) * | 2012-05-03 | 2013-11-07 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik sowie optisches System für die EUV-Projektionslithographie |
US9823075B2 (en) * | 2013-01-10 | 2017-11-21 | Xiaotian Steve Yao | Non-interferometric optical gyroscope based on polarization sensing |
US20140211175A1 (en) * | 2013-01-31 | 2014-07-31 | Globalfoundries Inc. | Enhancing resolution in lithographic processes using high refractive index fluids |
WO2014154229A1 (en) | 2013-03-28 | 2014-10-02 | Carl Zeiss Smt Gmbh | Microlithographic apparatus and method of varying a light irradiance distribution |
US9817320B2 (en) | 2013-11-20 | 2017-11-14 | Asml Netherlands B.V. | Lithographic method and apparatus |
CN103926806B (zh) * | 2014-05-05 | 2016-03-30 | 北京理工大学 | 一种实现光瞳偏振态任意分布的光刻照明系统设计方法 |
CN110618580B (zh) * | 2017-08-08 | 2021-08-24 | 广东弘景光电科技股份有限公司 | 检测方法及系统 |
DE102021202847A1 (de) * | 2021-03-24 | 2022-09-29 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik für eine Projektionsbelichtungsanlage für die Lithografie |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3330648B2 (ja) * | 1992-10-06 | 2002-09-30 | 富士通株式会社 | 光源形状の最適化方法 |
US5677757A (en) * | 1994-03-29 | 1997-10-14 | Nikon Corporation | Projection exposure apparatus |
JP3630852B2 (ja) * | 1995-05-16 | 2005-03-23 | キヤノン株式会社 | パターン形成状態検出装置及びそれを用いた投影露光装置 |
US5680588A (en) * | 1995-06-06 | 1997-10-21 | International Business Machines Corporation | Method and system for optimizing illumination in an optical photolithography projection imaging system |
KR20010023314A (ko) * | 1997-08-26 | 2001-03-26 | 오노 시게오 | 노광 장치, 노광 방법, 투영 광학계의 압력 조정 방법 및노광 장치의 조립 방법 |
US6689519B2 (en) * | 2000-05-04 | 2004-02-10 | Kla-Tencor Technologies Corp. | Methods and systems for lithography process control |
TW552561B (en) * | 2000-09-12 | 2003-09-11 | Asml Masktools Bv | Method and apparatus for fast aerial image simulation |
JP2002319539A (ja) * | 2001-02-13 | 2002-10-31 | Nikon Corp | 仕様決定方法及びコンピュータシステム |
JP4436029B2 (ja) * | 2001-02-13 | 2010-03-24 | 株式会社ニコン | 投影光学系の製造方法及び調整方法、露光装置及びその製造方法、デバイス製造方法、並びにコンピュータシステム |
TW554411B (en) * | 2001-08-23 | 2003-09-21 | Nikon Corp | Exposure apparatus |
JP4154144B2 (ja) * | 2001-11-13 | 2008-09-24 | キヤノン株式会社 | 露光装置、発光制御方法、およびデバイス製造方法 |
JP4298336B2 (ja) * | 2002-04-26 | 2009-07-15 | キヤノン株式会社 | 露光装置、光源装置及びデバイス製造方法 |
JP3689681B2 (ja) * | 2002-05-10 | 2005-08-31 | キヤノン株式会社 | 測定装置及びそれを有する装置群 |
JP2004037137A (ja) * | 2002-07-01 | 2004-02-05 | Canon Inc | 複屈折測定装置、除歪装置、偏光状態検出装置及び露光装置 |
TW200412617A (en) * | 2002-12-03 | 2004-07-16 | Nikon Corp | Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method |
EP1429190B1 (en) * | 2002-12-10 | 2012-05-09 | Canon Kabushiki Kaisha | Exposure apparatus and method |
JP4356695B2 (ja) * | 2003-05-09 | 2009-11-04 | 株式会社ニコン | 照明光学系、投影露光装置、マイクロデバイスの製造方法 |
JP2005005521A (ja) * | 2003-06-12 | 2005-01-06 | Nikon Corp | 露光装置、露光方法、および偏光状態測定装置 |
US7408616B2 (en) * | 2003-09-26 | 2008-08-05 | Carl Zeiss Smt Ag | Microlithographic exposure method as well as a projection exposure system for carrying out the method |
AU2003304487A1 (en) * | 2003-09-26 | 2005-04-14 | Carl Zeiss Smt Ag | Microlithographic projection exposure |
JP4351962B2 (ja) * | 2004-07-05 | 2009-10-28 | 株式会社東芝 | 露光システム及び半導体装置の製造方法 |
WO2006016584A1 (ja) * | 2004-08-09 | 2006-02-16 | Nikon Corporation | 光学特性計測装置及び光学特性計測方法、露光装置及び露光方法、並びにデバイス製造方法 |
US7619747B2 (en) * | 2004-12-17 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus, analyzer plate, subassembly, method of measuring a parameter of a projection system and patterning device |
US7312852B2 (en) * | 2004-12-28 | 2007-12-25 | Asml Netherlands B.V. | Polarized radiation in lithographic apparatus and device manufacturing method |
US8675176B2 (en) * | 2005-02-25 | 2014-03-18 | Asml Netherlands B.V. | Parameter control in a lithographic apparatus using polarization |
-
2005
- 2005-07-22 JP JP2005212254A patent/JP4701030B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-21 TW TW095126818A patent/TWI348596B/zh active
- 2006-07-21 KR KR1020060068255A patent/KR100871505B1/ko not_active IP Right Cessation
- 2006-07-21 US US11/459,117 patent/US7864296B2/en not_active Expired - Fee Related
- 2006-07-21 CN CN2006101059883A patent/CN1900828B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070046921A1 (en) | 2007-03-01 |
KR20070012248A (ko) | 2007-01-25 |
US7864296B2 (en) | 2011-01-04 |
KR100871505B1 (ko) | 2008-12-05 |
CN1900828B (zh) | 2011-11-02 |
CN1900828A (zh) | 2007-01-24 |
JP4701030B2 (ja) | 2011-06-15 |
JP2007035671A (ja) | 2007-02-08 |
TW200717186A (en) | 2007-05-01 |
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