TWI341846B - Method for making a heat resistant epoxy resin having an excellent transpancy - Google Patents

Method for making a heat resistant epoxy resin having an excellent transpancy Download PDF

Info

Publication number
TWI341846B
TWI341846B TW093117455A TW93117455A TWI341846B TW I341846 B TWI341846 B TW I341846B TW 093117455 A TW093117455 A TW 093117455A TW 93117455 A TW93117455 A TW 93117455A TW I341846 B TWI341846 B TW I341846B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
less
bis
apha
hue
Prior art date
Application number
TW093117455A
Other languages
English (en)
Chinese (zh)
Other versions
TW200504111A (en
Inventor
Koichi Fujishiro
Motozumi Mitani
Yukuo Akimaru
Kazunori Matsugaki
Hirotoshi Manago
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200504111A publication Critical patent/TW200504111A/zh
Application granted granted Critical
Publication of TWI341846B publication Critical patent/TWI341846B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Epoxy Compounds (AREA)
TW093117455A 2003-06-27 2004-06-17 Method for making a heat resistant epoxy resin having an excellent transpancy TWI341846B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003184821A JP5009486B2 (ja) 2003-06-27 2003-06-27 透明性に優れた耐熱性エポキシ樹脂の製造方法

Publications (2)

Publication Number Publication Date
TW200504111A TW200504111A (en) 2005-02-01
TWI341846B true TWI341846B (en) 2011-05-11

Family

ID=34184470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117455A TWI341846B (en) 2003-06-27 2004-06-17 Method for making a heat resistant epoxy resin having an excellent transpancy

Country Status (3)

Country Link
JP (1) JP5009486B2 (ja)
KR (1) KR100996601B1 (ja)
TW (1) TWI341846B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4915896B2 (ja) * 2005-07-07 2012-04-11 日本化薬株式会社 エポキシ樹脂の製造法
JP4915895B2 (ja) * 2005-07-07 2012-04-11 日本化薬株式会社 エポキシ樹脂の製造法
JP5062856B2 (ja) * 2009-04-17 2012-10-31 田岡化学工業株式会社 ９，９−ビスクレゾールフルオレンの製造法
KR101178725B1 (ko) 2010-04-05 2012-08-31 제일모직주식회사 고내열성 투명 에폭시 경화수지 및 이의 제조방법
JP6508921B2 (ja) * 2014-02-27 2019-05-08 日鉄ケミカル＆マテリアル株式会社 フルオレン骨格含有エポキシ樹脂の製造方法、エポキシ樹脂組成物、及び硬化物
JP6739136B2 (ja) * 2015-07-08 2020-08-12 田岡化学工業株式会社 フルオレン骨格を有するアルコールの結晶およびその製造方法
KR101861917B1 (ko) * 2016-04-14 2018-05-28 삼성에스디아이 주식회사 에폭시 화합물, 이를 포함하는 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
JP7417628B2 (ja) * 2019-04-19 2024-01-18 クク・ト・ケミカル・カンパニー・リミテッド エポキシ樹脂およびその製造方法、並びにこれを含むエポキシ樹脂組成物
KR102245604B1 (ko) * 2019-10-10 2021-04-28 주식회사 케이씨씨 에폭시 수지 조성물

Also Published As

Publication number Publication date
TW200504111A (en) 2005-02-01
JP2005015696A (ja) 2005-01-20
KR100996601B1 (ko) 2010-11-25
JP5009486B2 (ja) 2012-08-22
KR20050001477A (ko) 2005-01-06

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