TW200504111A - Method for making a heat resistant epoxy resin having an excellent transparency - Google Patents

Method for making a heat resistant epoxy resin having an excellent transparency

Info

Publication number
TW200504111A
TW200504111A TW093117455A TW93117455A TW200504111A TW 200504111 A TW200504111 A TW 200504111A TW 093117455 A TW093117455 A TW 093117455A TW 93117455 A TW93117455 A TW 93117455A TW 200504111 A TW200504111 A TW 200504111A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
fluorene
making
heat resistant
excellent transparency
Prior art date
Application number
TW093117455A
Other languages
Chinese (zh)
Other versions
TWI341846B (en
Inventor
Koichi Fujishiro
Motozumi Mitani
Yukuo Akimaru
Kazunori Matsugaki
Hirotoshi Manago
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200504111A publication Critical patent/TW200504111A/en
Application granted granted Critical
Publication of TWI341846B publication Critical patent/TWI341846B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)

Abstract

This invention provides a method for making a heat resistant epoxy resin having an excellent transparency and is adapted for use in the field of display material or optical elements and optical modulation elements which require a transparency and heat resistance. The epoxy resin is made by reacting bis(hydroxy phenyl) fluorene(BHPF) represented by the following formula (1), and epichlorohydrine, wherein, as a bis(hydroxy phenyl) fluorene, a solution of (A) having 4g of bis(hydroxyphenyl) fluorene resolved in 100ml of methyl ethyl setone and having an yellow index (YI value) of less than 6, and (B) containing less than 100ppm of fluorene is used in order to obtain an epoxy resin having a Hue of less than APHA 120.
TW093117455A 2003-06-27 2004-06-17 Method for making a heat resistant epoxy resin having an excellent transpancy TWI341846B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003184821A JP5009486B2 (en) 2003-06-27 2003-06-27 Manufacturing method of heat-resistant epoxy resin with excellent transparency

Publications (2)

Publication Number Publication Date
TW200504111A true TW200504111A (en) 2005-02-01
TWI341846B TWI341846B (en) 2011-05-11

Family

ID=34184470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117455A TWI341846B (en) 2003-06-27 2004-06-17 Method for making a heat resistant epoxy resin having an excellent transpancy

Country Status (3)

Country Link
JP (1) JP5009486B2 (en)
KR (1) KR100996601B1 (en)
TW (1) TWI341846B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4915895B2 (en) * 2005-07-07 2012-04-11 日本化薬株式会社 Production method of epoxy resin
JP4915896B2 (en) * 2005-07-07 2012-04-11 日本化薬株式会社 Production method of epoxy resin
JP5062856B2 (en) * 2009-04-17 2012-10-31 田岡化学工業株式会社 Method for producing 9,9-biscresol fluorene
KR101178725B1 (en) 2010-04-05 2012-08-31 제일모직주식회사 Transparent and highly heat resistant epoxy curing resin and preparation method thereof
JP6508921B2 (en) * 2014-02-27 2019-05-08 日鉄ケミカル＆マテリアル株式会社 Method for producing fluorene skeleton-containing epoxy resin, epoxy resin composition, and cured product
JP6739136B2 (en) * 2015-07-08 2020-08-12 田岡化学工業株式会社 Crystal of alcohol having fluorene skeleton and method for producing the same
KR101861917B1 (en) * 2016-04-14 2018-05-28 삼성에스디아이 주식회사 Epoxy compound, epoxy resin composition for encapsulating semiconductor device comprising the same, and semiconductor device encapsulated by using thereof
WO2020213992A1 (en) * 2019-04-19 2020-10-22 국도화학 주식회사 Epoxy resin, preparation method thereof, and epoxy resin composition comprising same
KR102245604B1 (en) * 2019-10-10 2021-04-28 주식회사 케이씨씨 Epoxy resin composition

Also Published As

Publication number Publication date
KR20050001477A (en) 2005-01-06
TWI341846B (en) 2011-05-11
JP2005015696A (en) 2005-01-20
KR100996601B1 (en) 2010-11-25
JP5009486B2 (en) 2012-08-22

Similar Documents

Publication Publication Date Title
TW200504111A (en) Method for making a heat resistant epoxy resin having an excellent transparency
DE60131259D1 (en) PHOTOHÄRTBARE RESIN COMPOSITION AND OPTICAL PARTS
EP1818366A4 (en) Resin composition for optical material, resin film for optical material and optical waveguide using same
TW200631978A (en) Curable resin composition and interlayer insulating film
ATE141932T1 (en) PHOTOHARDABLE RESIN COMPOSITION
EP2149587A4 (en) Polycarbonate resin and method for producing the same
EP1386924A4 (en) Monomer, polymer, and ocular lens and contact lens each obtained therefrom
TW200801074A (en) Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
DE602007009437D1 (en) Highly reliable insulating solution for liquid and liquid lenses
MY135383A (en) Flame retardant resin composition and molded products thereof
EP1760068A4 (en) Polymerizable liquid crystal compound, liquid crystal composition, optically anisotropic material and optical device
DE69803644D1 (en) Diglycidylether
KR101816722B1 (en) A method of preparing epoxy acryl based optical material
MY143482A (en) Phenolic resin, process for production thereof, epoxy resin, and use thereof
NO20034048D0 (en) Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds
DE50201090D1 (en) Potting compound based on thermosetting epoxy resins
WO2003029322A1 (en) Curing agent composition for epoxy resins, epoxy resin composition and use thereof
KR101979033B1 (en) Epoxy acryl based polymerizable composition and method of preparing epoxy acryl based optical material
DE59802875D1 (en) Initiators for cationic polymerization
TW200519155A (en) A heat-curable epoxyresin composition and a transparent material
JPS5755947A (en) Stabilized halogen-containing resin composition
JPS55129293A (en) Functional group contained siloxane and its manufacture
EP1291404A4 (en) Optical adhesive composition and optical apparatus
ATE428704T1 (en) FLUORINE CONTAINING DIOXOLE COMPOUNDS AND FLUORINE CONTAINING POLYMERS
ATE371678T1 (en) METHOD FOR PRODUCING HIGHLY TRANSPARENT PLASTIC FOR OPTICAL MATERIALS