TWI338215B - - Google Patents
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- Publication number
- TWI338215B TWI338215B TW96136596A TW96136596A TWI338215B TW I338215 B TWI338215 B TW I338215B TW 96136596 A TW96136596 A TW 96136596A TW 96136596 A TW96136596 A TW 96136596A TW I338215 B TWI338215 B TW I338215B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- dissipating
- plate body
- unit
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 53
- 238000001816 cooling Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000004049 embossing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200915055A TW200915055A (en) | 2009-04-01 |
| TWI338215B true TWI338215B (enExample) | 2011-03-01 |
Family
ID=44725633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200915055A (enExample) |
-
2007
- 2007-09-29 TW TW96136596A patent/TW200915055A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200915055A (en) | 2009-04-01 |
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