TWI333815B - - Google Patents

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Publication number
TWI333815B
TWI333815B TW093114561A TW93114561A TWI333815B TW I333815 B TWI333815 B TW I333815B TW 093114561 A TW093114561 A TW 093114561A TW 93114561 A TW93114561 A TW 93114561A TW I333815 B TWI333815 B TW I333815B
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TW
Taiwan
Prior art keywords
electronic component
solder resist
conductive film
anisotropic conductive
mounting module
Prior art date
Application number
TW093114561A
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English (en)
Other versions
TW200511916A (en
Inventor
Misao Konishi
Jyunji Shinozaki
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Sony Chemicals Corp
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Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200511916A publication Critical patent/TW200511916A/zh
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Publication of TWI333815B publication Critical patent/TWI333815B/zh

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Description

上之接著片的外側，所以在接著片 部份有效排出道外部，所間μ氣會透過這個 元件在屋著時的加敎作=二被:封:内的空氣即使因為電子 露的問題。脹時，也不會發生縫隙或配線電路外 為讓树明之上述目的、特徵、和優職更明顯易懂，下文 乂貫施例，並配合所附圖式，作詳細說明如下： 【實施方式】 以下參照圖面說明本發明之電子元件安裝模組。 請參照第2Α及2Β圖，第2Α圖為本發明之電子元件安裝 、：之-例的概略平面圖，第2Β圖為第2Α圖中α·α，線的概略 圖如第2Β圖所不，適用於本發明之電子元件安裝模組係 在Ρ刷基板’例如是可撓性基板1，上有多個配線電路2與電子 =3的隆起部（bump) 4 ’透過接著片—異方性導電膜$壓附 σ在可撓性基板1上搭載電子元件3,以所謂的C〇F(Chip〇n film)的安裝方式構成。 、在可撓性基板1上，為了確保配線電路2彼此之間的絕緣參 性’並且為了保護配線電路2,所以讓銲料保護層（s。^ res⑻ 6露出欲與電子元件3連接之部份配線電路2，且銲料保護層6 包住另一部份之配線電路2。此外，銲料保護層6在電子元件3 的安裝區域有一個包起來的開口部。 異方性導電膜5是含有分散的導電性粒子的接著劑形成一 層薄膜狀，如異方性導電膠膜，將之與電子元件3 '可撓性基板 1壓者在起就能確保電源連接效果。異方性導電膜$的外型尺 寸與知料保護層6的内緣邊緣重叠，異方性導電膜$覆蓋住電子 1333815 使用前述的可撓性基板1 ’也可使用所謂的硬板等、可適用於所 有的配線基板。 電子元件3例如是半導體製成的1C晶片，表面有金屬等端 子構成隆起部4。 構成異方性導電膜5的接著劑可使用各種熱硬化性樹脂、熱 可塑性樹脂、橡膠等。其中從連接後穩定度的角度來看，最好使 用熱硬化性樹脂。熱硬化性書有環氧樹脂、美耐皿樹脂、酚樹脂 (phenolic resin)、酸二烯丙酯樹脂（DiaUyl
Phthalate resin)、 BT樹脂、聚酯樹脂、尿烷樹脂、苯氧樹脂（phen〇xy resin)、聚 酿胺樹脂（Polyamide resin)或是聚乙醯胺（P〇iyamideresin)等 的合成樹脂$及含Hydroxil羥基（hydroxyl )、羧基（carb〇xyl )、 乙烯基（Vinyl)、胺基或環氧基等官能基乂橡膠或人造橡膠等。 其中尤其以％氧樹脂等的各種特性為佳。環氧樹脂可使用雙苯基 (Bis Phenyl)型環氧樹脂、環氧酚醛樹脂或是分子内有2個以 上環氧乙烷（Οχ丨rane )基的環氧化合物等。這類環氧樹脂最好採 用不純物離子、尤其是氣離子在5〇ppm以下的高純度品。 此外，異方性導電膜5所使用的導電性粒子可使用如鎳（Ni)， 銀（Ag)，銅（Cu)或是這類物質的合金等的金屬粉、將球狀樹 脂粒子表面以導電材料包覆的導電包覆粒子施加金屬電鍍之製 品、在表面加上絕緣性樹脂包膜之具有良好導電性的粒子等等， 以及各種過去之異方性導電性接著劑所使用的導電性粒子皆 可。導電性粒子的直徑最好在0.2# m〜2〇" m之間。 由以上構成材料所形成的異方性導電膜5的融化黏度最好 在1.0xl05mPa · s〜i.ox^mpa ^的範圍内。異方性導電膜5的 融化黏度若太大則無法發揮充足的效果。 、 此外銲料保護層6可使用絕緣性保護材料等，或是使用一般 1333815 模組。 首先準備有配線電路的可撓性基板，形成—個有開口部包圍 住ic晶片安裝區域的銲料保護層。銲料保護層如圖2所示在 對角的2角形成分分隔的形狀。然後貼上異方性導電膜蓋=鲜料 保護層的開峰此處所用之異方性導電膜為以德國公司 製黏度計RSISO測定融化黏度（1〇〇t)為丨〇χΐ〇νρ3· s的 ACF-卜然後在異方性導電膜上的一定位置排列好冗晶片，經過 加熱、加壓將1C晶片安裝到可撓性基板上，成為電子元件安裝 模組。 另外以德國Harch公司製黏度計RS15〇測定融化黏度（1〇〇 °C)為4.〇xl〇SnPa. s的ACF_2,其餘以相同步驟製作了與前述 相同的電子元件安裝模組。 <比較例> 在比較例中，異方性導電膜採用相對高黏度材料 (ACF-1 )以及低黏度材料（acF-2 )，同時將銲料保護層的形狀 改為如第1A〜1C圖所示、完全包圍住1C晶片的安裝區域外，其 餘步驟與前述實施例同樣地製作電子元件安裝模組。 將前述方法製作的電子元件安裝模組異方性導電膜破裂露 出配線電路的部位以顯微鏡計算之後，結果如表1所示。 表1 比較例 實施例 ACF-1 3 0 ACF-2 20 2 11
1719PA 1333815 如表1所示，若採用高黏度異方性導電膜，由於銲料保護層 的開口部-部份延伸到不與異方性導電膜重疊的區域，因而能完 全防止配線電路外露。此外，制低減異枝導電膜，也能大 幅減少配線電路外露的情形，在比較射從20處減少到2處。 由以上結果得知’不論異方性導電膜的黏度高低，只要調整辉料 保護層的形狀’顧纽去除被封閉在異方性導電❹ 板之間的空氣。 ^ ^ 本發明上述實施例所揭露之電子元件安⑽組，其銲料保護 層開口 4有-部份的結構延伸到疊在鋅料保護層i之接著片的 外側，所以在接著片貼附工程中被密封在接著片與印刷基板之間 =空氣會透過這個部份有效排出道外部，所以即使被密封在内的 空乳即使因為電子元件在壓著時的加熱作㈣脹時，也不會發生 f隙或配線電路外露的問題。如以上料說明所示，採用本發明 :可輕易去除封閉在接著片與印刷基板之關空氣，㈣避免發 與配線電料露的問題，提供品質穩定性很高的電子 女裝模組。 綜上所述’雖然本發明已以一較佳實施例揭露如上U並 ^以限定本發明，任何熟習此技藝者，衫脫離本發明之精神 和乾圍内’當可作各種之更動與潤飾，因此本發明之保護範圍心 視後附之中請專利範圍所界定者為準。 蔓乾圍田 Ϊ719ΡΑ 12 I333815 【圓式簡單說明】 第1A圖為舊有的電子元件安裝方法^ 工程的截面圖。 第1B圖為舊有的電子元件安裝方去 為異方性導電膜貼附 程截面圖。 第1C圖為舊有的電子元件安裝方法 為電子元件的安裝 的概略平面圖。 為電子元件安裝模組 第2A圖為本發明之電子元件安裝模組之一例的概略平面 圖。 第2B圖為第2A圖中A-A’線的概略截面圖。 第3圖為顯示本發明之電子元件安裝模組之其他粒子的概略 平面圖。 【主要元件符號說明】 1 :可撓性基板 2 :配線電路 3 :電子元件 4 :隆起部 5 :異方性導電膜 6 :銲料保護層 6a :銲料保護層之開口部的一部份 11 :配線電路 12 :銲料保護層 13 :可撓性基板 14 :異方性導電膜 15 :隆起部 Π19ΡΑ 13 1333815 16 :電子元件 17 :間隙 18 :配線電路外露部 1719PA 14

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  1. I 1333815 I罗辟/明/日修(更)正替換頁 * 一丨 --------- 十、申請專利範圍： 1. 一種電子元件安裝模組，其特徵在於： 在-印刷基板上安裝—電子元件的—電子元件安裝模組對 應於該電子元件之該印刷基板上係設置複數個配線電路，一薛料 保護層在該電子元件的安裝區域上具有對應的—開口部以將該 銲料保護層分隔為不相接觸之兩部分，該鲜料保護層包覆住部^ 之該配線電路，該配線電路與該電子元件連接之處係外露； 該印刷基板貼附在該電子元件的安裝區域，該電子元件安裝 區域之外型尺寸係與該銲料保護層的内周邊緣重叠而且該電子 凡件壓著之後’該電子元件與㈣線電路係藉由—接著片電性連 接’該接著片之融化黏度在4.0xl06mpa. s〜i 0xl07mpa· 範圍内； · 、 該銲料保護層的該開口部具有一部份，延伸到不與前述 片重疊的區域去。 2·如中請專利範圍第丨項所述之電子元件 徵為： 亏 在該銲料保護層的開π部具有—區域，該區域沒有該印刷基 板的該配線電路。 籲 3.如U利圍第1或2項所述之電子元件安裝模组， 其特徵為： 該接著片為一異方性導電膜。 4·如申請專利範圍第…項所述之電子元 其特徵為： 該印刷基板為一可撓性基板。 15
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