TWI333405B - - Google Patents

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Publication number
TWI333405B
TWI333405B TW96136308A TW96136308A TWI333405B TW I333405 B TWI333405 B TW I333405B TW 96136308 A TW96136308 A TW 96136308A TW 96136308 A TW96136308 A TW 96136308A TW I333405 B TWI333405 B TW I333405B
Authority
TW
Taiwan
Prior art keywords
solder
pads
layer
solder resist
circuit board
Prior art date
Application number
TW96136308A
Other languages
English (en)
Chinese (zh)
Other versions
TW200915943A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW96136308A priority Critical patent/TW200915943A/zh
Publication of TW200915943A publication Critical patent/TW200915943A/zh
Application granted granted Critical
Publication of TWI333405B publication Critical patent/TWI333405B/zh

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW96136308A 2007-09-28 2007-09-28 Method to form opening on solder mask layer with high precision of alignment TW200915943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96136308A TW200915943A (en) 2007-09-28 2007-09-28 Method to form opening on solder mask layer with high precision of alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96136308A TW200915943A (en) 2007-09-28 2007-09-28 Method to form opening on solder mask layer with high precision of alignment

Publications (2)

Publication Number Publication Date
TW200915943A TW200915943A (en) 2009-04-01
TWI333405B true TWI333405B (ja) 2010-11-11

Family

ID=44725882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96136308A TW200915943A (en) 2007-09-28 2007-09-28 Method to form opening on solder mask layer with high precision of alignment

Country Status (1)

Country Link
TW (1) TW200915943A (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927878B2 (en) 2011-10-31 2015-01-06 Mediatek Singapore Pte. Ltd Printed circuit board and electronic apparatus thereof
CN103096618B (zh) * 2011-10-31 2016-03-30 联发科技（新加坡）私人有限公司 印刷电路板以及电子设备
TWI551201B (zh) * 2015-11-27 2016-09-21 達方電子股份有限公司 光源裝置
CN108419378B (zh) * 2018-05-09 2019-12-20 深圳市百柔新材料技术有限公司 印刷线路板保护层的制作方法
CN113556883B (zh) * 2020-04-23 2022-11-15 鹏鼎控股(深圳)股份有限公司 电路板封装结构的制备方法及电路板封装结构
CN111565519B (zh) * 2020-06-02 2021-08-17 锡凡半导体无锡有限公司 一种印刷无感光蚀工艺
CN115038253B (zh) * 2022-06-15 2023-07-14 江门崇达电路技术有限公司 一种线路板上多种类型的pad精准等大的制作方法

Also Published As

Publication number Publication date
TW200915943A (en) 2009-04-01

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