TWI331207B - - Google Patents

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Publication number
TWI331207B
TWI331207B TW96132201A TW96132201A TWI331207B TW I331207 B TWI331207 B TW I331207B TW 96132201 A TW96132201 A TW 96132201A TW 96132201 A TW96132201 A TW 96132201A TW I331207 B TWI331207 B TW I331207B
Authority
TW
Taiwan
Prior art keywords
heat
heat pipe
pipe
plane
accommodating groove
Prior art date
Application number
TW96132201A
Other languages
English (en)
Chinese (zh)
Other versions
TW200909760A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW96132201A priority Critical patent/TW200909760A/zh
Priority to JP2008097891A priority patent/JP4974949B2/ja
Publication of TW200909760A publication Critical patent/TW200909760A/zh
Application granted granted Critical
Publication of TWI331207B publication Critical patent/TWI331207B/zh

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW96132201A 2007-08-30 2007-08-30 Manufacturing method and product of heat-pipe type heat sink TW200909760A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW96132201A TW200909760A (en) 2007-08-30 2007-08-30 Manufacturing method and product of heat-pipe type heat sink
JP2008097891A JP4974949B2 (ja) 2007-08-30 2008-04-04 ヒートパイプを有する熱放散器の製造方法及びその製品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96132201A TW200909760A (en) 2007-08-30 2007-08-30 Manufacturing method and product of heat-pipe type heat sink

Publications (2)

Publication Number Publication Date
TW200909760A TW200909760A (en) 2009-03-01
TWI331207B true TWI331207B (ja) 2010-10-01

Family

ID=40554106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96132201A TW200909760A (en) 2007-08-30 2007-08-30 Manufacturing method and product of heat-pipe type heat sink

Country Status (2)

Country Link
JP (1) JP4974949B2 (ja)
TW (1) TW200909760A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012141082A (ja) * 2010-12-28 2012-07-26 Fujitsu Ltd 冷却装置及び電子機器
JP7217792B1 (ja) * 2021-10-20 2023-02-03 レノボ・シンガポール・プライベート・リミテッド 電子機器の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001248982A (ja) * 2000-03-03 2001-09-14 Fujikura Ltd ヒートパイプ構造体およびその成形工具
JP4324367B2 (ja) * 2002-11-06 2009-09-02 ナブテスコ株式会社 素子放熱器

Also Published As

Publication number Publication date
JP2009058213A (ja) 2009-03-19
JP4974949B2 (ja) 2012-07-11
TW200909760A (en) 2009-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees
MM4A Annulment or lapse of patent due to non-payment of fees