TWI329920B - - Google Patents
Download PDFInfo
- Publication number
- TWI329920B TWI329920B TW92131569A TW92131569A TWI329920B TW I329920 B TWI329920 B TW I329920B TW 92131569 A TW92131569 A TW 92131569A TW 92131569 A TW92131569 A TW 92131569A TW I329920 B TWI329920 B TW I329920B
- Authority
- TW
- Taiwan
- Prior art keywords
- core coil
- semiconductor device
- wafer
- air
- component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 140
- 239000000758 substrate Substances 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 44
- 239000004020 conductor Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 239000011162 core material Substances 0.000 description 195
- 235000012431 wafers Nutrition 0.000 description 99
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000000463 material Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 7
- HODRFAVLXIFVTR-RKDXNWHRSA-N tevenel Chemical compound NS(=O)(=O)C1=CC=C([C@@H](O)[C@@H](CO)NC(=O)C(Cl)Cl)C=C1 HODRFAVLXIFVTR-RKDXNWHRSA-N 0.000 description 7
- 230000001939 inductive effect Effects 0.000 description 6
- 101710170231 Antimicrobial peptide 2 Proteins 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 101710170230 Antimicrobial peptide 1 Proteins 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92131569A TWI329920B (ja) | 2003-11-11 | 2003-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92131569A TWI329920B (ja) | 2003-11-11 | 2003-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI329920B true TWI329920B (ja) | 2010-09-01 |
Family
ID=45074531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92131569A TWI329920B (ja) | 2003-11-11 | 2003-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI329920B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554663A (zh) * | 2020-05-26 | 2020-08-18 | 厦门圣德斯贵电子科技有限公司 | 一种电子芯片的磁场屏蔽结构 |
-
2003
- 2003-11-11 TW TW92131569A patent/TWI329920B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554663A (zh) * | 2020-05-26 | 2020-08-18 | 厦门圣德斯贵电子科技有限公司 | 一种电子芯片的磁场屏蔽结构 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10389241B2 (en) | Power supply converter and method for manufacturing the same | |
| JP3612031B2 (ja) | 高周波モジュール | |
| JP2008160161A (ja) | 混成集積回路装置及びその製造方法並びに電子装置 | |
| US8841759B2 (en) | Semiconductor package and manufacturing method thereof | |
| US6828658B2 (en) | Package for integrated circuit with internal matching | |
| JP2007073849A (ja) | 電子回路モジュールとその製造方法 | |
| JP2008072559A (ja) | アンテナ装置及びその製造方法 | |
| US8018392B2 (en) | Antenna element and semiconductor device | |
| JP2005136360A (ja) | 受動素子チップ、高集積モジュール、受動素子チップの製造方法、及び高集積モジュールの製造方法。 | |
| TWI329920B (ja) | ||
| JP4173507B2 (ja) | 半導体装置の製造方法 | |
| JP4137059B2 (ja) | 電子装置および半導体装置 | |
| JP2007157877A (ja) | 受動素子パッケージ及びその製造方法、半導体モジュール、並びにこれらの実装構造 | |
| JP2005235825A (ja) | 電子回路モジュール | |
| JP2006049602A (ja) | 半導体装置およびその製造方法 | |
| JP2008112776A (ja) | 半導体装置 | |
| JP2008041693A (ja) | 半導体素子収納用パッケージとそれを用いた圧電発振器、通信機器及び電子機器、並びに半導体素子収納用パッケージの製造方法 | |
| JP2006237450A (ja) | 半導体パッケージ及び半導体装置 | |
| US11342260B2 (en) | Power flat no-lead package | |
| KR20040075754A (ko) | 컨덴서 장치 | |
| US20200274503A1 (en) | High-frequency front-end circuit | |
| JP2006324540A (ja) | 半導体装置 | |
| JP2009158751A (ja) | 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 | |
| JP2006332096A (ja) | 半導体装置 | |
| JP2006024744A (ja) | 半導体装置および半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |