TWI318455B - Packaged rf power transistor having rf bypassing/output matching network - Google Patents

Packaged rf power transistor having rf bypassing/output matching network

Info

Publication number
TWI318455B
TWI318455B TW092126215A TW92126215A TWI318455B TW I318455 B TWI318455 B TW I318455B TW 092126215 A TW092126215 A TW 092126215A TW 92126215 A TW92126215 A TW 92126215A TW I318455 B TWI318455 B TW I318455B
Authority
TW
Taiwan
Prior art keywords
transistor
output matching
bypassing
packaged
power transistor
Prior art date
Application number
TW092126215A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408128A (en
Inventor
Crescenzi, Jr
Original Assignee
Cree Microwave Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Microwave Llc filed Critical Cree Microwave Llc
Publication of TW200408128A publication Critical patent/TW200408128A/zh
Application granted granted Critical
Publication of TWI318455B publication Critical patent/TWI318455B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56—Modifications of input or output impedances, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H10W44/231—Arrangements for applying bias

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Amplifiers (AREA)
TW092126215A 2002-09-30 2003-09-23 Packaged rf power transistor having rf bypassing/output matching network TWI318455B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/262,217 US6822321B2 (en) 2002-09-30 2002-09-30 Packaged RF power transistor having RF bypassing/output matching network

Publications (2)

Publication Number Publication Date
TW200408128A TW200408128A (en) 2004-05-16
TWI318455B true TWI318455B (en) 2009-12-11

Family

ID=32030167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092126215A TWI318455B (en) 2002-09-30 2003-09-23 Packaged rf power transistor having rf bypassing/output matching network

Country Status (7)

Country Link
US (1) US6822321B2 (https=)
EP (1) EP1547394B1 (https=)
JP (1) JP5009500B2 (https=)
CN (1) CN1701613B (https=)
AU (1) AU2003275086A1 (https=)
TW (1) TWI318455B (https=)
WO (1) WO2004032188A2 (https=)

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US7193473B2 (en) * 2005-03-24 2007-03-20 Cree, Inc. High power Doherty amplifier using multi-stage modules
US7372334B2 (en) * 2005-07-26 2008-05-13 Infineon Technologies Ag Output match transistor
US7564303B2 (en) * 2005-07-26 2009-07-21 Infineon Technologies Ag Semiconductor power device and RF signal amplifier
US7378920B2 (en) * 2006-02-14 2008-05-27 Freescale Semiconductor, Inc. Methods and apparatus for a high-frequency output match circuit
US7898338B2 (en) 2006-04-26 2011-03-01 Nxp B.V. High power integrated RF amplifier
US20080231373A1 (en) * 2007-03-20 2008-09-25 Hafizur Rahman Output Circuit
US8592966B2 (en) * 2007-06-22 2013-11-26 Cree, Inc. RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
US8076994B2 (en) * 2007-06-22 2011-12-13 Cree, Inc. RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction
US8330265B2 (en) * 2007-06-22 2012-12-11 Cree, Inc. RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks
JP5030228B2 (ja) * 2007-11-30 2012-09-19 矢崎総業株式会社 電気接続箱
WO2009130544A1 (en) * 2008-04-22 2009-10-29 Freescale Semiconductor, Inc. Wireless communication unit and semiconductor device having a power amplifier therefor
US7948312B2 (en) * 2009-05-13 2011-05-24 Qualcomm, Incorporated Multi-bit class-D power amplifier system
US8536950B2 (en) * 2009-08-03 2013-09-17 Qualcomm Incorporated Multi-stage impedance matching
US8102205B2 (en) 2009-08-04 2012-01-24 Qualcomm, Incorporated Amplifier module with multiple operating modes
US8659359B2 (en) 2010-04-22 2014-02-25 Freescale Semiconductor, Inc. RF power transistor circuit
EP2388815A1 (en) * 2010-05-10 2011-11-23 Nxp B.V. A transistor package
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
US9281283B2 (en) 2012-09-12 2016-03-08 Freescale Semiconductor, Inc. Semiconductor devices with impedance matching-circuits
EP2802075B1 (en) 2013-05-07 2017-02-15 Ampleon Netherlands B.V. Dual-band semiconductor RF amplifier device
EP2830089B1 (en) * 2013-07-25 2017-07-12 Ampleon Netherlands B.V. RF power device
EP3066683B1 (en) 2013-11-07 2019-04-24 NXP USA, Inc. Bond wire arrangement with adjustable losses
JP6478253B2 (ja) * 2014-03-21 2019-03-06 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 電力増幅回路およびトランスミッタ
US9641163B2 (en) 2014-05-28 2017-05-02 Cree, Inc. Bandwidth limiting methods for GaN power transistors
US9515011B2 (en) 2014-05-28 2016-12-06 Cree, Inc. Over-mold plastic packaged wide band-gap power transistors and MMICS
US9472480B2 (en) 2014-05-28 2016-10-18 Cree, Inc. Over-mold packaging for wide band-gap semiconductor devices
US9438184B2 (en) 2014-06-27 2016-09-06 Freescale Semiconductor, Inc. Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof
CN105322895B (zh) * 2015-05-06 2018-11-09 苏州能讯高能半导体有限公司 一种偏置自适应内匹配功放管及基于该功放管的功放模块
US10432152B2 (en) 2015-05-22 2019-10-01 Nxp Usa, Inc. RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
US9692363B2 (en) * 2015-10-21 2017-06-27 Nxp Usa, Inc. RF power transistors with video bandwidth circuits, and methods of manufacture thereof
US9571044B1 (en) 2015-10-21 2017-02-14 Nxp Usa, Inc. RF power transistors with impedance matching circuits, and methods of manufacture thereof
CN106206524B (zh) * 2016-07-07 2019-01-22 昆山华太电子技术有限公司 一种封装管壳体
US10270402B1 (en) * 2017-11-30 2019-04-23 Nxp Usa, Inc. Broadband input matching and video bandwidth circuits for power amplifiers
US10673386B2 (en) * 2017-12-05 2020-06-02 Nxp Usa, Inc. Wideband power amplifiers with harmonic traps
US10566938B1 (en) * 2018-12-11 2020-02-18 Nxp Usa, Inc. System and method for providing isolation of bias signal from RF signal in integrated circuit
CN111510085B (zh) * 2020-05-12 2023-06-23 苏州远创达科技有限公司 一种功率放大器的输出电路
US12417966B2 (en) * 2021-12-17 2025-09-16 Macom Technology Solutions Holdings, Inc. IPD components having SiC substrates and devices and processes implementing the same
US12183669B2 (en) 2021-12-17 2024-12-31 Macom Technology Solutions Holdings, Inc. Configurable metal—insulator—metal capacitor and devices
US12230614B2 (en) 2021-12-17 2025-02-18 Macom Technology Solutions Holdings, Inc. Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
CN120934465B (zh) * 2025-10-16 2025-12-26 成都屿西半导体科技有限公司 一种扩展调制带宽的射频微波放大器

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Also Published As

Publication number Publication date
TW200408128A (en) 2004-05-16
CN1701613A (zh) 2005-11-23
JP5009500B2 (ja) 2012-08-22
WO2004032188A3 (en) 2004-06-17
EP1547394A2 (en) 2005-06-29
JP2006501678A (ja) 2006-01-12
EP1547394A4 (en) 2006-09-20
US20040061214A1 (en) 2004-04-01
US6822321B2 (en) 2004-11-23
WO2004032188A2 (en) 2004-04-15
AU2003275086A1 (en) 2004-04-23
AU2003275086A8 (en) 2004-04-23
EP1547394B1 (en) 2016-07-27
CN1701613B (zh) 2010-10-13

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