TWI314878B - Dispensing head unit for a paste dispenser - Google Patents

Dispensing head unit for a paste dispenser Download PDF

Info

Publication number
TWI314878B
TWI314878B TW096123222A TW96123222A TWI314878B TW I314878 B TWI314878 B TW I314878B TW 096123222 A TW096123222 A TW 096123222A TW 96123222 A TW96123222 A TW 96123222A TW I314878 B TWI314878 B TW I314878B
Authority
TW
Taiwan
Prior art keywords
nozzle
substrate
distance
unit
sensor
Prior art date
Application number
TW096123222A
Other languages
Chinese (zh)
Other versions
TW200808456A (en
Inventor
Hee-Keun Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200808456A publication Critical patent/TW200808456A/en
Application granted granted Critical
Publication of TWI314878B publication Critical patent/TWI314878B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)

Description

,1314878 九、發明說明： 【發明所屬之技術領域】 本發明關於點膠機之塗佈頭單元，尤其是關於具有快速地 移動之簡化配置之點膠機之塗佈頭單元。 【先前技術】 ‘點賴用以粘著兩基板以製造液晶顯示面板（LCD)，其 φ 係、藉由塗佈給疋圖案的膠體至兩基板其中之-上。點膠機包含 設，基板的平台，配置喷嘴塗佈膠體之塗佈頭單元，設置塗佈 頭單7L之頭支撐框，控制移動頭支樓框之馬達及移動塗佈頭單 元之馬達的控制單元。 點膠機依給疋圖案塗佈膠體於基板時’必須維持喷嘴與基 板間之距離為-峡_。鱗韻由上下騎_頭單元來BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating head unit of a dispenser, and more particularly to a coating head unit of a dispenser having a simplified configuration for rapid movement. [Prior Art] ‘Relaying to adhere two substrates to fabricate a liquid crystal display panel (LCD), which is φ-based, by coating a colloid of a given pattern onto the two substrates. The dispenser includes a platform for the substrate, a coating head unit for dispensing the nozzle coating gel, a support frame for the head of the coating head 7L, a motor for controlling the movement of the head frame and a motor for moving the coating head unit. unit. When the dispenser applies the glue to the substrate according to the 疋 pattern, the distance between the nozzle and the substrate must be maintained as the gorge_. The rhyme is drawn by the upper and lower _ head unit

f寺^距離’亦即於z軸方向移動，或者藉由分別地以水 平X軸及/或Y財向’移驗佈解元及/或基板。 然而’置於塗佈頭單元之一z轴移動單元須較多動力， 以移動包対嘴、膠财狀❹旧之 軸移動單元須有足夠移動容量以負荷塗佈二 之，增力，動單元之重量。施：里 其不易快速調整料錢機早70的負载使 線因頻繁移動可能產^粒。 ，連接至感測器之繞 1314878 尤其是，z軸移動單元包含第一與第二致動器(揭露於韓 國專利申請案2003-0001338號）。第一致動器用以低速大幅度 凋整喷嘴及基板間之距離，第二致動器用以高速微調噴嘴及基 板間之距離。塗佈頭單元配置二個2軸移動單元之重量較配 置一個Z軸移動單元沉重。 第二致動器上下移動喷嘴、膠體容器及感測器，使得加速 調整喷嘴與基板間之距離很因難。第一致動器移動第二致動器 上下移動，此增加施於第一致動器的負載。因此，當移動塗佈 頭於X軸方向及/或Υϋ方向’以預定圖案塗佈膠體於基板上 ，，因為加上兩個致動器之塗佈頭單元重量增加，對於塗佈頭 單元移動的速度及穩定度有顯著的影響。 【發明内容】 因此，本發明之一目的在於減少Ζ軸移動單元可移動之 裝置的數量’以快速調整喷嘴與基板間之距離。 m本發明之又一目的在於使塗佈頭單元配置有一個ζ軸移 動單元，以快速並穩定地操作塗佈頭單元。 根據本發明之一面向，提供一種點膠機 包含其上提供噴嘴之塗俩；-Ζ軸軸單元方向其 上下移動塗佈頭，以調整喷嘴與基板間之距離 感測噴嘴之垂直位置；第二感測器，於ζ軸移 •1314878 邛刀上，感測第二感測器與基板間之距離；以及2軸控制單 兀i依據第—感測器與第二感測器所感測之距離控制z軸移 =單元，其包含第-調整單元，於塗佈膠體至基板冑，調整喷 嘴與基板間之距離至預定值；以及第二調整單元，於塗佈該體 至基板時，調整喷嘴與基板間之距離至該預定值。 本發明前述及其他多個目的、面向、特色及優點，將可於 本發明其後之詳述並結合伴隨的圖式顯而易見。 【實施方法】 本發明之健具體實麵詳述如下，例舉之示 於 伴隨的圖式。 、 、本㈣之麵鮮元係㈣於—轉射，以默圖案置 塗佈膠體於基板上，使噴嘴與基板間轉固定距離。 第1圖係本㈣—實施例之點軸之塗細單元之透視 时如第1圖所示，塗佈頭單元觸包含塗佈頭則、z轴移 動單元120、第-感測器130、第二感測器14〇及2轴控制單 喷嘴in及連接至噴嘴⑴之賴容器112，其内含膠體 .1314878 供給至塗饰頭no。膠體經喷嘴ill塗佈於基板10上，如第2 圖所不。由置於塗佈頭110上之支撐塊113支撐膠體容器112, 以供給膠體至噴嘴ln。可提供一固定壓力供給單元(未緣 不）’以供給固定壓力至膠體容器112，使喷嘴ln塗佈膠體。 軸移動單元120於z軸方向上下移動塗佈頭no，因而 於Z轴方向上下移動喷嘴lu。依本發明之一具體實施例，提 供一個z軸移動單元120於點賴。如下敘述，Z軸控制單元 =依第-感測器13〇及第二感測器⑽所感測之距離 喷嘴ill及基板10間之距離。 於動板可糾z細達121(毅_馬達魏性馬達） ⑽7 f動’並與塗佈頭11㈣定地結合。Z轴移動單元 移動z軸移動板，如此於2轴方向上下移動塗佈頭⑽。 旋轉馬達°滾珠螺桿於Z轴方向與旋轉馬達之 帽=:達插入與Z軸移動板搞合之滾珠螺 •I卜7紅做達（）¥件，沿著Z軸移動板的移動設置。因 動，。轴移動板於Z軸方向由滾珠螺桿之旋轉運動產生線性運 於涂軸移動單元⑽及X軸移動單元講 於土佈頭100上’以分別地於丫 120私之塗佈頭⑽，因而於γ軸方向移_嘴1動= 1314878 撐框20及γ軸移動單元16〇間之χ轴移動單元請，於 軸方向移_單元励，因而於方向調整喷嘴⑴之垂 直位置。像是雜馬達之致魅可實施為動單元16〇 及X軸移動單元170。 日第一感測器130感測噴嘴之垂直位置。帛一感測器13〇 提供垂直位置的資料給Ζ軸控制單元15〇。第一感測器13〇可 包3任何旎感測喷嘴HI與基板位置的元件。第一感測器 可包含一線性編碼器(linear enc〇der)，以精確的控制喷嘴⑴ 之位置。線性編碼器置於z軸移動單元πο，以偵測2轴移動 板的移動距離量及ζ轴移動板移動的方向。線性編碼器提供 距離量及方向之資料給Ζ軸控制單元15(^ ζ軸控制單元15〇 依距離量及方向之資料，計算噴嘴111之垂直位置。可提供另 一感測器，其感測Ζ軸移動單元120移動的參考點。於設定 時，喷嘴111移動至參考點。 第二感測器140固定於Ζ軸移動單元120之固定部分， 用以感測第二感測器140與基板1〇間之距離。也就是，當噴 嘴111相對於基板10移動，塗佈預定圖案之膠體於基板10上 時’第二感測器14〇即時地感測第二感測器140及基板1〇間 之距離。此舉可偵測第二感測器140及基板10間距離的改變， 因此間接地偵測喷嘴111及基板10間距離的改變。提供量測 到的改變資料給Ζ軸控制單元150。 .1314878 z軸移動單（12G並不上下移動第二制器⑽，係固定 於z軸移動單几120之固定部分。此舉不僅減少z軸移動單 =120之負載，也可使z軸移動單元12〇較輕，因此當塗佈 >體於基板11上時，有祕快速地調㈣嘴⑴與基板U間 =距離。备喷嘴1U上下移動時，連接至第二感測器⑽之纔 ”亦不會上下移動。此舉能防止_線鑛產生之微粒。The f temple distance 'is moved in the z-axis direction, or the solution and/or the substrate are removed by horizontal X-axis and/or Y-finance, respectively. However, 'the z-axis moving unit placed in one of the coating head units requires more power, and the moving shaft of the old shaft must be moved enough to load the coating. The weight of the unit. Shi: It is not easy to quickly adjust the load of the cash machine 70, so that the line may be produced due to frequent movement. , the connection to the sensor 1314878 In particular, the z-axis moving unit includes first and second actuators (exposure to Korean Patent Application No. 2003-0001338). The first actuator is used to greatly reduce the distance between the nozzle and the substrate at a low speed, and the second actuator is used to finely adjust the distance between the nozzle and the substrate at a high speed. The coating head unit is configured to have two 2-axis moving units that are heavier than a Z-axis moving unit. The second actuator moves the nozzle, the colloidal container, and the sensor up and down, making it difficult to adjust the distance between the nozzle and the substrate. The first actuator moves the second actuator up and down, which increases the load applied to the first actuator. Therefore, when the moving coating head coats the colloid on the substrate in a predetermined pattern in the X-axis direction and/or the Υϋ direction, the weight of the coating head unit is increased by the application of the two actuators, and the coating head unit is moved. The speed and stability have a significant impact. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to reduce the number of devices that can be moved by a reel movement unit to quickly adjust the distance between the nozzle and the substrate. Another object of the present invention is to provide the coating head unit with a spindle moving unit for operating the coating head unit quickly and stably. According to one aspect of the present invention, a dispenser is provided comprising a coating device for providing a nozzle thereon; a shaft axis unit moving the coating head up and down to adjust a distance between the nozzle and the substrate to sense a vertical position of the nozzle; The second sensor senses the distance between the second sensor and the substrate on the axis shift 1314878; and the 2-axis control unit i senses according to the first sensor and the second sensor The distance control z-axis shift=unit includes a first-adjusting unit that adjusts a distance between the nozzle and the substrate to a predetermined value after coating the colloid to the substrate ;; and a second adjusting unit that adjusts when the body is coated to the substrate The distance between the nozzle and the substrate is to the predetermined value. The foregoing and other objects, aspects, features and advantages of the invention will be apparent from the [Embodiment] The specific embodiments of the present invention are described in detail below, and are exemplified in the accompanying drawings. , (4) The fresh element system (4) is transferred to the substrate, and the gel is applied on the substrate in a silent pattern to make the nozzle and the substrate rotate a fixed distance. 1 is a perspective view of the thin unit of the point axis of the embodiment (4), as shown in FIG. 1 , the coating head unit includes a coating head, a z-axis moving unit 120, a first sensor 130, The second sensor 14A and the 2-axis control single nozzle in and the container 112 connected to the nozzle (1), which contains a colloid. 1314878, is supplied to the finishing head no. The colloid is applied to the substrate 10 via the nozzle ill as shown in Fig. 2. The colloidal container 112 is supported by a support block 113 placed on the coating head 110 to supply the colloid to the nozzle ln. A fixed pressure supply unit (not edged) can be provided to supply a fixed pressure to the colloidal container 112 to cause the nozzle ln to be coated with a colloid. The shaft moving unit 120 moves the coating head no up and down in the z-axis direction, thereby moving the nozzle lu up and down in the Z-axis direction. In accordance with an embodiment of the present invention, a z-axis moving unit 120 is provided. As described below, the Z-axis control unit = the distance between the nozzle ill and the substrate 10 according to the distance sensed by the first-sensor 13A and the second sensor (10). The moving plate can be adjusted to a fineness of 121 (Yi_motor Wei motor) (10) 7 f moving ' and is combined with the coating head 11 (four). Z-axis moving unit Move the z-axis moving plate so that the coating head (10) is moved up and down in the 2-axis direction. Rotary motor °The ball screw in the Z-axis direction and the cap of the rotating motor =: Insert the ball screw with the Z-axis moving plate. • I b 7 red to make () ¥, move the plate along the Z axis. Due to action. The shaft moving plate is linearly driven by the rotary motion of the ball screw in the Z-axis direction, and is applied to the coating shaft moving unit (10) and the X-axis moving unit on the soil cloth head 100 to separate the coating heads (10) respectively from the 丫120, thus γ Axis direction shift _ mouth 1 motion = 1314878 The χ axis movement unit between the struts 20 and the γ-axis moving unit 16 请 is moved in the axial direction _ unit excitation, so the vertical position of the nozzle (1) is adjusted in the direction. The enchantment of a hybrid motor can be implemented as a moving unit 16A and an X-axis moving unit 170. The first sensor 130 senses the vertical position of the nozzle. The first sensor 13 〇 provides the vertical position information to the spindle control unit 15A. The first sensor 13 can pack any element that senses the position of the nozzle HI and the substrate. The first sensor can include a linear encoder to precisely control the position of the nozzle (1). The linear encoder is placed in the z-axis moving unit πο to detect the moving distance of the 2-axis moving plate and the direction in which the x-axis moving plate moves. The linear encoder provides the distance quantity and the direction information to the 控制 axis control unit 15 (the ζ axis control unit 15 calculates the vertical position of the nozzle 111 according to the distance quantity and direction data. Another sensor can be provided, the sensing is provided The reference point moved by the boring axis moving unit 120. When set, the nozzle 111 moves to the reference point. The second sensor 140 is fixed to the fixed portion of the boring axis moving unit 120 for sensing the second sensor 140 and the substrate The distance between the turns 1 . That is, when the nozzle 111 moves relative to the substrate 10 and the predetermined pattern of the glue is applied on the substrate 10, the second sensor 14 〇 instantly senses the second sensor 140 and the substrate 1 The distance between the dice 140 detects the change in the distance between the second sensor 140 and the substrate 10, thereby indirectly detecting the change in the distance between the nozzle 111 and the substrate 10. Providing the measured change data to the x-axis control Unit 150. .1314878 z-axis moving single (12G does not move the second controller (10) up and down, fixed to the fixed part of the z-axis moving single 120. This not only reduces the load of the z-axis moving single = 120, but also The z-axis moving unit 12 is lighter, so when coating > When the body 11 is placed on the substrate 11, there is a secret to quickly adjust the distance between the mouth (1) and the substrate U. When the nozzle 1U moves up and down, the connection to the second sensor (10) does not move up and down. This can prevent _ Line produced by the mine.

f 一感測器140可以下列方式設置：當塗佈時，第二感測 必須感測之距離係在第二感測器⑽涵蓋的範圍。也就 感測器140必須感測的距離之中點與第二感測器14〇 涵蓋砘圍的中點對準。 ^軸控制單元150接收第一感測器13〇與第二感測器14〇 料。Z她辟元⑽控制z縛鮮元，以調 、嘴Π1與基板10間之距離。z軸控制單元15〇包 調整單元151及第二調整單元152。 在塗佈膠體於基板10前，第一調整單元151調整噴嘴ηι 1G間之距離至預定值。也就是，第—調整單元i5i依 ηΪ夕30感測當喷嘴111接觸基板10然後離開基板 \时，以偵測喷嘴111接觸基板10之接觸點。並且，第 151自接觸點往上移動喷嘴111至維持喷嘴111及 I扳10間之預定距離的點。 11 1314878 此接觸點為第一感測器130感測喷嘴111接觸及離開基板 10之距離停止改變或恢復改變之處。也就是，當噴嘴111向 下朝基板10移動時，第一感測器130感測之距離改變。然而， 當喷嘴111接觸基板10時，第一感測器130感測之距離無變 化。當喷嘴111從基板10離開，第一感測器130感測之距離 開始變4匕。 如此’第一感測器130所感測之距離於接觸點停止變動， 亦即’喷嘴111接觸基板10之處’以及喷嘴111離開基板1〇 開始變動之點，也就是，喷嘴111離開接觸點。 接觸點作為設定喷嘴111及基板10間之距離至預定值之 參考點。也就是’噴嘴U1從接觸點向上移動，以使噴嘴ηι 及基板10間之距離達到預定值。f A sensor 140 can be arranged in such a way that when applied, the distance that the second sensing must sense is within the range covered by the second sensor (10). That is, the midpoint of the distance that the sensor 140 must sense is aligned with the midpoint of the second sensor 14's coverage. The axis control unit 150 receives the first sensor 13A and the second sensor 14 to feed. Z Sheyuan (10) controls the z-bound fresh element to adjust the distance between the mouth 1 and the substrate 10. The z-axis control unit 15 packs the adjustment unit 151 and the second adjustment unit 152. Before applying the colloid to the substrate 10, the first adjusting unit 151 adjusts the distance between the nozzles η1 1G to a predetermined value. That is, the first adjusting unit i5i senses when the nozzle 111 contacts the substrate 10 and then leaves the substrate, to detect the contact point of the nozzle 111 contacting the substrate 10. Further, the 151th self-contact point moves the nozzle 111 upward to a point which maintains a predetermined distance between the nozzles 111 and I. 11 1314878 This contact point is where the first sensor 130 senses that the nozzle 111 contacts and leaves the substrate 10 to stop changing or to recover. That is, as the nozzle 111 moves downward toward the substrate 10, the distance sensed by the first sensor 130 changes. However, when the nozzle 111 contacts the substrate 10, the distance sensed by the first sensor 130 does not change. When the nozzle 111 is separated from the substrate 10, the distance sensed by the first sensor 130 starts to change. Thus, the distance sensed by the first sensor 130 stops changing at the contact point, that is, the point where the nozzle 111 contacts the substrate 10 and the point at which the nozzle 111 starts to change away from the substrate 1 , that is, the nozzle 111 leaves the contact point. The contact point serves as a reference point for setting the distance between the nozzle 111 and the substrate 10 to a predetermined value. That is, the nozzle U1 is moved upward from the contact point so that the distance between the nozzle ηι and the substrate 10 reaches a predetermined value.

當預定距離因基板10之不平整表面改變時，第二調敕 嘴111及基板10間之距離至職，以維ί喷 嘴及基板10之固定距離。此舉使膠體圖案以均句古产 寬度形成於基板1〇上。 」间没汉 第二調整單元152比較於塗佈時即時感測 器H0及基板10間之距離，以及當開始塗佈膠體於 ，所感測到的第二感測器140及基板1〇間之距離j 整單元152補償喷嘴111及基板10間兩距離的差里。也就一是°， 12 1314878 第二調整單元152上下移動麵⑴該兩距離之差異，以調整 贺嘴111及基板10間之距離至預定距離，係第一調整單元⑸ 於塗佈則將噴嘴111及基板1G間之距離。第二調整單元m 依第一感測器130感測之距離上下移動喷嘴lu。 參考第1圖、第2圖及第3圖，現將描述調整喷嘴⑴及 基Ϊ㈣之距離之步驟。第2 _塗佈頭單元之正視圖，顯 =喷嘴m置於參考點之狀態。第3圖為塗佈頭單元之正視 圖，顯示定位喷嘴111之狀態，其中 調整至歉值。 ill及紐間之距離 第-輕單元m自參考點向下㈣倾⑴，以允 2接觸基板⑹並向上移動噴嘴111以允許噴嘴111離開 基板10。此舉係用以偵測喷嘴ill接觸基板10之接觸點。 ^觸點係藉由第-感測器所偵測之距 =續變動，感測喷嘴m之位置來_。於^ ，第一感細。所感測之距離二^ 到出，其恢復變動。此舉可重複地操作，以正雜則 —調整單元151依第—感測器-距離’從接觸點向上移動喷嘴lu該預定距離，以調整 mi絲板ίο間之距離至預定值。轉可穩定維持喷嘴 13 ,1314878 111及基板10間之距離於預定值。 在調整喷嘴111及基板10間之距離至預定值後，達成於 塗佈時喷嘴111及基板間之距離調整，如第3圖所示。當喷嘴 111及基板10間之距離已調整至預定值，而塗佈時因基板u 之不平整表面改變時，第二調整單元152調整喷嘴ln與基板 10改變的距離至預定值。 在第-調整單7L 1M調整喷嘴111及基板1〇間之距離至 預疋值後’就在塗佈剞，第二調整單元152接吹並儲存第二烕 測器140感測之距離資料。第二調整單元152於塗佈時接 二感測器140感測之距離資料。第二調整單元152比較塗佈時 所感測之距離與塗佈前感測之距離，以計算 二調整單元丨52依計算之差異向上移動喷嘴⑴ 111及基板10間之距離至預定值。 假設第二感測器140於塗佈前感測之距離為“A”，而第 ;感測器140於塗佈時感測之距離為“B”。 在B大於A的狀況下，噴嘴⑴及基板10間目前的距較 嗔嘴111及基板1〇之預定距離大。因此，第二調整單元152 以差值（=輯A)向下移動噴嘴⑴，以調整喷嘴ηι及基板 10間之距離至預定值。 14 '1314878 疋部分，移除了 負載。 將第二感測器固定於2轴 移動第二感·的需求，因： = 且可以 防止加快調整噴嘴及基板間之距離， 接至之_於移動時產生微粒。 輕，上下移树射餘麵之重量較 於塗料穩定及加速塗佈頭於X轴方向之移動。 明，並非之較佳實補而已’除非另有特別說 之申請專·2 纽改魏修飾，均應包含在下述 【圖式簡單說明】 之一對本發蚊進—步的了解，並結合為說明書 树=原Γ之實糊’且與詳細說明—酬以說明 圖 第1圖係本發明—實施例之點膠機之塗佈頭單元之透視 置 =2圖餘麵單凡之正簡，顯㈣嘴置 位 之狀態。 3圖Ϊ讀頭單70之正視圖 '齡當喷嘴與基板間之距 離调正至預定值時，定位喷嘴U1之狀態。 15 1314878When the predetermined distance is changed due to the uneven surface of the substrate 10, the distance between the second nozzle 111 and the substrate 10 is attained to maintain a fixed distance between the nozzle and the substrate 10. This causes the colloidal pattern to be formed on the substrate 1 in a uniform width. The second adjusting unit 152 compares the distance between the instant sensor H0 and the substrate 10 at the time of coating, and when the coating of the colloid is started, the sensed second sensor 140 and the substrate 1 are The distance j unit 152 compensates for the difference between the two distances between the nozzle 111 and the substrate 10. In other words, 12 1314878 second adjustment unit 152 moves the surface up and down (1) the difference between the two distances to adjust the distance between the mouthpiece 111 and the substrate 10 to a predetermined distance, and the first adjustment unit (5) applies the nozzle after coating. The distance between 111 and substrate 1G. The second adjusting unit m moves the nozzle lu up and down according to the distance sensed by the first sensor 130. Referring to Figures 1, 2 and 3, the steps of adjusting the distance between the nozzle (1) and the base (4) will now be described. Front view of the 2nd _ coating head unit, display = the state where the nozzle m is placed at the reference point. Figure 3 is a front elevational view of the coating head unit showing the state of the positioning nozzle 111, wherein the adjustment is made to an apology. Distance between ill and the new unit The first light unit m is tilted downward (four) from the reference point (1) to allow the substrate 2 to be contacted (6) and the nozzle 111 to be moved upward to allow the nozzle 111 to move away from the substrate 10. This is used to detect the contact point where the nozzle ill contacts the substrate 10. ^The contact is sensed by the position detected by the first sensor = continuous change, sensing the position of the nozzle m. In ^, the first feeling. The sensed distance is 2^, and it recovers. This operation can be repeated, in order to adjust the distance between the mi-plates to a predetermined value by moving the nozzles 15 upward from the contact points in accordance with the first-sensor-distance. The rotation can stably maintain the distance between the nozzles 13, 1314878 111 and the substrate 10 at a predetermined value. After adjusting the distance between the nozzle 111 and the substrate 10 to a predetermined value, the distance between the nozzle 111 and the substrate during coating is adjusted, as shown in Fig. 3. When the distance between the nozzle 111 and the substrate 10 has been adjusted to a predetermined value, and the uneven surface of the substrate u is changed during coating, the second adjusting unit 152 adjusts the changed distance of the nozzle ln from the substrate 10 to a predetermined value. After the first adjustment sheet 7L 1M adjusts the distance between the nozzle 111 and the substrate 1 to the predetermined value, the second adjustment unit 152 blows and stores the distance data sensed by the second detector 140. The second adjusting unit 152 is connected to the distance data sensed by the second sensor 140 during coating. The second adjusting unit 152 compares the distance sensed by the coating with the distance sensed before coating to calculate that the two adjusting unit 丨52 moves the distance between the nozzle (1) 111 and the substrate 10 upward to a predetermined value according to the calculated difference. It is assumed that the distance sensed by the second sensor 140 before coating is "A", and the distance sensed by the sensor 140 at the time of coating is "B". In the case where B is larger than A, the current distance between the nozzle (1) and the substrate 10 is larger than the predetermined distance between the nozzle 111 and the substrate 1〇. Therefore, the second adjusting unit 152 moves the nozzle (1) downward by the difference (= A) to adjust the distance between the nozzle ηι and the substrate 10 to a predetermined value. 14 '1314878 疋 section, removed the load. The second sensor is fixed to the 2nd axis to move the second sense. Because: = and it can prevent the adjustment of the distance between the nozzle and the substrate, and the particles are generated when moving. Light, the weight of the beam surface is higher than the coating stability and accelerates the movement of the coating head in the X-axis direction. Ming, it is not the best to make up. 'Unless specifically mentioned, the application for special 2 new reform Wei decoration, should be included in the following [simplified description of the diagram] one of the understanding of this mosquito step, and combined The specification tree = the original paste of the original 'and the detailed description - the description of the Figure 1 is the perspective of the present invention - the coating head unit of the dispensing machine of the embodiment = 2 picture of the face of the simple Show (four) the state of the mouth set. 3Fig. Front view of the reading head sheet 70 'When the distance between the nozzle and the substrate is adjusted to a predetermined value, the state of the nozzle U1 is positioned. 15 1314878

【主要元件符號說明】 10 基板 20 頭支撐框 100 塗佈頭單元 110 塗佈頭 111 喷嘴 112 膠體容器 113 支撐塊 120 Z軸移動單元 121 Z轴馬達 130 第一感測器 140 第二感測器 150 Z軸控制單元 151 第一調整單元 152 第二調整單元 160 Y軸移動單元 170 X軸移動單元[Main component symbol description] 10 substrate 20 head support frame 100 coating head unit 110 coating head 111 nozzle 112 colloid container 113 support block 120 Z-axis moving unit 121 Z-axis motor 130 first sensor 140 second sensor 150 Z-axis control unit 151 first adjustment unit 152 second adjustment unit 160 Y-axis movement unit 170 X-axis movement unit

Claims (1)

,1314878 十、申請專利範圍·· L 一種點膠機之塗佈頭單元，包含·· 一塗佈頭，其上提供一噴嘴； 一z軸移動單元，於該z軸方向上下移動一塗佈頭， _整嘴嘴與—基板間之一距離； 一第一感測器，感測該喷嘴之一垂直位置； . 、一第二感測器，於該Z軸移動單元之一固定部分上， • 感測該第二感測器與該基板間之-距離；以及 、z轴控制單元，依據該第一感測器與該第二感測器 所感測之距離控制該Z軸移動單元，包含： 一第一調整單元，於塗佈膠體至該基板前，調整該噴 嘴與該基板間之該距離至一預定值；以及 一第二調整單元’於塗佈該膠體至該基板時，調整該 噴嘴與該基板間之該距離至該預定值。 2. 如申請專利範圍第丨項之點膠機之塗佈頭單元其中該第 • —調整單元藉由自—接觸點向上移動該噴嘴-預定距離， 來調整該喷嘴及該基板間之該距離，係在偵測到該喷嘴接 觸該基板之該細點後’基於該第—_减測到該喷嘴 接觸該基板然後離開該基板之該距離。 3. 如申請專利範圍第2項之點膠機之塗佈頭單元，其中該第 一調整單元重複執行允許該噴嘴接觸並且離開該基板之步 驟，以偵測精確的接觸點。 17 1314878 4.如^專利範圍第丨項至第3項之任—項之點機之塗佈 頭單疋’其中藉由比較當開始塗佈時該第二感測器感測之 -距離與該第二感;聽於塗佈綱感測之-距離的兩距離 之差異結果’該第二調整單元上下移動該喷嘴來調整該嘴 嘴與該基板之該距離。 5. 如申請f利範圍第4項之點膠機之塗佈頭單元，其中該第 感下述方式配置m聰彡賊測的距離的 中點與該第二感測n涵蓋細的巾點對準。 6. 如申請翻範圍第1項之轉機之塗佈頭單元，其中該第 -感測器是-線性編碼器’係提供於該z軸移動單元：。 7. 如申請專利範圍第i項之點膠機之塗佈頭單^， 供於職佈頭上，轉體容器含有触該喷嘴^ 18, 1314878 X. Patent Application Scope L · A coating head unit of a dispensing machine, comprising: a coating head on which a nozzle is provided; a z-axis moving unit that moves up and down in the z-axis direction a distance between the head, the mouthpiece and the substrate; a first sensor sensing a vertical position of the nozzle; and a second sensor on a fixed portion of the Z-axis moving unit Sensing the distance between the second sensor and the substrate; and the z-axis control unit controls the Z-axis moving unit according to the distance sensed by the first sensor and the second sensor, The method includes: a first adjusting unit, adjusting the distance between the nozzle and the substrate to a predetermined value before applying the glue to the substrate; and adjusting a second adjusting unit to apply the gel to the substrate The distance between the nozzle and the substrate is to the predetermined value. 2. The coating head unit of the dispenser of the invention of claim </ RTI> wherein the first adjustment unit adjusts the distance between the nozzle and the substrate by moving the nozzle from the contact point upward by a predetermined distance After detecting that the nozzle contacts the fine point of the substrate, the distance from the nozzle contacting the substrate and then leaving the substrate is determined based on the first---subtraction. 3. The coating head unit of the dispensing machine of claim 2, wherein the first adjusting unit repeatedly performs the step of allowing the nozzle to contact and leave the substrate to detect an accurate contact point. 17 1314878 4. The coating head unit of the point machine of the third to the third paragraph of the patent range, wherein the second sensor senses the distance and distance when the coating is started. The second sense; the difference between the two distances of the distance sensed by the coating technique. The second adjustment unit moves the nozzle up and down to adjust the distance between the nozzle and the substrate. 5. The application of the coating head unit of the dispensing machine according to item 4 of the scope of interest, wherein the first point of the configuration is the midpoint of the distance measured by the squirrel and the second sensing n covers the fine towel point alignment. 6. The coating head unit of the transfer machine of the first item, wherein the first sensor is a linear encoder, is provided in the z-axis moving unit: 7. If the coating head of the dispensing machine of the scope of the patent application item i is applied to the cloth head, the rotating container contains the nozzle.
TW096123222A 2006-06-28 2007-06-27 Dispensing head unit for a paste dispenser TWI314878B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060058751A KR100649962B1 (en) 2006-06-28 2006-06-28 Head unit of paste dispenser

Publications (2)

Publication Number Publication Date
TW200808456A TW200808456A (en) 2008-02-16
TWI314878B true TWI314878B (en) 2009-09-21

Family

ID=37713608

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123222A TWI314878B (en) 2006-06-28 2007-06-27 Dispensing head unit for a paste dispenser

Country Status (4)

Country Link
JP (1) JP2008006439A (en)
KR (1) KR100649962B1 (en)
CN (1) CN100470337C (en)
TW (1) TWI314878B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462780B (en) * 2009-11-27 2014-12-01 Ap Systems Inc Dispenser apparatus and method for controlling the same

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100919622B1 (en) * 2007-12-05 2009-09-30 주식회사 탑 엔지니어링 Distance sensor of paste dispenser
KR100999929B1 (en) * 2008-08-08 2010-12-13 주식회사 탑 엔지니어링 Paste dispenser
KR101069371B1 (en) * 2008-08-08 2011-10-04 주식회사 탑 엔지니어링 Dispenser with head-units arranged as mirror type
KR101026426B1 (en) 2008-08-27 2011-04-07 주식회사 탑 엔지니어링 Dispenser and method for dispensing sealant, etc. using the same
JP5459833B2 (en) * 2009-07-17 2014-04-02 芝浦メカトロニクス株式会社 Paste applicator
KR20110028778A (en) * 2009-09-14 2011-03-22 주식회사 탑 엔지니어링 Method for applying paste
KR101175284B1 (en) 2009-09-15 2012-08-21 주식회사 탑 엔지니어링 Paste dispenser and method for controlling the same
KR101089748B1 (en) 2009-10-19 2011-12-07 에이피시스템 주식회사 Method for controlling despenser appratus
KR101115916B1 (en) 2009-10-20 2012-02-22 주식회사 탑 엔지니어링 Paste dispenser and method for controlling the same
CN102059200A (en) * 2009-11-13 2011-05-18 塔工程有限公司 Liquid crystal supplying device and method of supplying liquid crystal by means of the device
KR101723376B1 (en) * 2010-07-14 2017-04-05 주식회사 탑 엔지니어링 Head unit of fluid discharge apparatus
EP3235489A1 (en) 2010-08-25 2017-10-25 Baxalta GmbH Assembly to facilitate user reconstitution
KR20120069139A (en) * 2010-12-20 2012-06-28 주식회사 탑 엔지니어링 Paste dispenser
KR101949120B1 (en) * 2011-09-09 2019-02-19 주식회사 탑 엔지니어링 Apparatus of dispensing-head-unit
KR101254707B1 (en) * 2011-10-12 2013-04-15 전북대학교산학협력단 Nano-fiber coating apparatus and method
CN102580892B (en) * 2012-03-16 2014-10-08 俞华 Three-dimensional adjusting clamp of tabletop type adhesive dispenser
CN103721911A (en) * 2013-12-20 2014-04-16 吴江市震宇缝制设备有限公司 Automatic spraying device of sintering medium
CN103752461A (en) * 2013-12-26 2014-04-30 镇江晶鑫电子科技有限公司 Automatic adhesive dispensing device of microdevice
KR101570845B1 (en) * 2015-04-15 2015-11-23 주식회사 모베이스 Dispensing method for water-proof
CN109807010A (en) * 2019-03-07 2019-05-28 广东震仪智能装备股份有限公司 Plasma spraying compensation system and compensation method
KR102218403B1 (en) * 2019-05-14 2021-02-23 주식회사 탑 엔지니어링 calibration system and calibrating method using the same
KR102190482B1 (en) * 2019-05-14 2020-12-15 주식회사 탑 엔지니어링 Array Tester
KR102190485B1 (en) * 2019-05-14 2020-12-15 주식회사 탑 엔지니어링 Array Tester
KR102235475B1 (en) * 2019-05-14 2021-04-05 주식회사 탑 엔지니어링 Array Tester
CN111994407A (en) * 2020-08-06 2020-11-27 大连华冶联自动化有限公司 End effector of robot for code spraying and labeling of steel coil
CN112427264A (en) * 2020-11-20 2021-03-02 广东芯聚能半导体有限公司 Heat conduction paste coating method and system, semiconductor packaging structure and preparation method thereof
KR102635840B1 (en) * 2021-05-14 2024-02-13 에이피시스템 주식회사 Method for dispensing and dispenser
CN113634446A (en) * 2021-08-16 2021-11-12 上汽通用五菱汽车股份有限公司 Automatic gluing device
KR20230032483A (en) 2021-08-31 2023-03-07 주식회사 에프에스티 Device for measuring three-dimensional coordinates and shape of needles
CN116518147B (en) * 2023-07-03 2023-09-05 常州科德水处理成套设备股份有限公司 Water treatment filter valve

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2809588B2 (en) * 1994-04-06 1998-10-08 日立テクノエンジニアリング株式会社 Paste coating machine
JP3372671B2 (en) * 1994-09-14 2003-02-04 キヤノン株式会社 Method and apparatus for manufacturing color filter
JPH11123359A (en) * 1997-10-23 1999-05-11 Toppan Printing Co Ltd Slot type fluid applicator
JP4073990B2 (en) * 1997-12-01 2008-04-09 大日本印刷株式会社 Coating film forming method and coating apparatus
JPH11333348A (en) * 1998-05-27 1999-12-07 Three Bond Co Ltd Material coating applicator
JP3431613B2 (en) * 1998-07-08 2003-07-28 松下電器産業株式会社 Plasma display panel manufacturing method and phosphor ink coating apparatus
JP2001246299A (en) * 2000-03-07 2001-09-11 Toshiba Corp Paste applying method and mounting device
JP3619791B2 (en) 2001-06-26 2005-02-16 株式会社 日立インダストリイズ Paste applicator
JP3889347B2 (en) * 2002-11-18 2007-03-07 芝浦メカトロニクス株式会社 Sealing agent coating apparatus and coating method
KR100700176B1 (en) * 2002-12-18 2007-03-27 엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and method for controlling gap between substrate and nozzle using the same
JP2004303549A (en) * 2003-03-31 2004-10-28 Toray Ind Inc Manufacturing method and manufacturing device of substrate for plasma display
JP2005058830A (en) 2003-08-18 2005-03-10 Shibaura Mechatronics Corp Paste applying device and paste applying method
JP4372606B2 (en) * 2004-04-16 2009-11-25 東京エレクトロン株式会社 Coating film forming device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462780B (en) * 2009-11-27 2014-12-01 Ap Systems Inc Dispenser apparatus and method for controlling the same

Also Published As

Publication number Publication date
CN101067700A (en) 2007-11-07
TW200808456A (en) 2008-02-16
JP2008006439A (en) 2008-01-17
CN100470337C (en) 2009-03-18
KR100649962B1 (en) 2006-11-29

Similar Documents

Publication Publication Date Title
TWI314878B (en) Dispensing head unit for a paste dispenser
CN109791912A (en) Dynamic leveling process heaters are promoted
JP3701882B2 (en) Paste applicator
JP2798503B2 (en) Liquid coating method and coating device
TWI768011B (en) Grinding method and grinding device
TW201008664A (en) Dispenser and method for dispensing sealant, etc. using the same
TW576760B (en) Device for coating paste
JP2009034568A (en) Slit coating-type coating device and its controlling method
JPH0899265A (en) Polishing device
TW201102177A (en) Paste coating device and paste coating method
JP2005334754A (en) Coating film forming apparatus
KR100840730B1 (en) A coating apparatus
JP3811740B2 (en) Coating equipment
TW201143902A (en) Paste applying device and paste applying method
JP4639719B2 (en) Application method
JPH10270533A (en) Water centering device and wafer attaching device using the same
CN107390473B (en) Positioning device, lithographic apparatus and method of manufacturing an article
JP4179718B2 (en) Paste film forming method and film forming apparatus
JPH09326378A (en) Method and equipment for cleaning substrate
JP2004276390A (en) Flexographic printing apparatus and manufacturing method for liquid crystal display using the apparatus
JP2008147292A (en) Substrate supporting apparatus, substrate supporting method, substrate working apparatus, substrate working method, and manufacturing method of display device component
JP3565671B2 (en) Recording device
JPH04300670A (en) Applicator for coating solution
JP6803120B2 (en) Origin detector and coating device
JP3490283B2 (en) Thick film forming apparatus and thick film forming method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees