TWI768011B - Grinding method and grinding device - Google Patents

Abstract

The present application provides a polishing method that can optimize the relative angle between the substrate stage and the pressing member. The polishing method uses at least three sensors 30 to measure the heights of at least three points on the substrate holding surface 2a, respectively. The inclination of the substrate holding surface 2 a is calculated from the output signal of the sensor 30 , the heights of at least three points on the surface parallel to the pressing surface 11 a of the pressing member 11 are measured with the sensor 30 , and calculated from the output signal of the sensor 30 The inclination of the pressing surface 11a calculates the relative angle between the stage surface 2a and the pressing surface 11a, holds the substrate W on the stage surface 2a, and adjusts the relative angle of the substrate holding surface 2a or the pressing surface 11a so that the relative angle is within the allowable range. The substrate W is polished by pressing the polishing tool 7 against the substrate W with the pressing surface 11 a in the inclined state.

Description

Grinding method and grinding device

The present invention relates to a polishing method and a polishing apparatus for polishing a surface or peripheral portion of a substrate such as a wafer with a polishing tool to obtain a desired polishing profile.

In order to grind the peripheral part of a board|substrate, a grinding|polishing apparatus has been used conventionally. FIG. 42 is a schematic diagram showing a conventional polishing apparatus. The substrate W such as a wafer is held on the stage surface 200a of the substrate stage 200 as a substrate holding portion by vacuum suction or the like, and is rotated together with the substrate stage 200 around its axis. The polishing tape 205 as a polishing tool is pressed against the peripheral edge portion of the substrate W by the pressing member 208 . The pressing member 208 is connected to the air cylinder 209 , and the force for pressing the polishing tape 205 against the substrate W is applied to the pressing member 208 by the air cylinder 209 . During the polishing of the substrate W, pure water is supplied to the center of the substrate W, and the upper surface of the substrate W is covered with pure water. The polishing tape 205 polishes the peripheral portion of the substrate W in the presence of pure water, and forms recesses 210 in stages as shown in FIG. 43 in the peripheral portion of the substrate W. As shown in FIG.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-150131

[Patent Document 2] Japanese Patent Laid-Open No. 2013-172019

However, one or both of the substrate stage 200 and the pressing member 208 may be inclined due to problems such as assembly accuracy of the polishing apparatus. For example, as shown in FIG. 44 , when the pressing member 208 is inclined, the polishing tape 205 is pushed obliquely against the peripheral edge of the substrate W. As a result, an obliquely polished surface is formed on the peripheral edge of the substrate W. As shown in FIG. Similarly, as shown in FIG. 45, when the axis of the substrate stage 200 is inclined, the polishing tape 205 is pushed obliquely with respect to the peripheral edge of the substrate W. As a result, the peripheral edge of the substrate W is formed with an oblique to the ground surface.

The same problem may also occur in the polishing apparatus for polishing the surface (front side or back side) of a substrate as shown in FIG. 46 . The polishing apparatus shown in FIG. 46 includes: a substrate holding part 300 that holds and rotates the substrate W; and a polishing head 301 that polishes the surface (front side or back side) of the substrate W. The polishing head 301 holds a polishing tool 302 such as a polishing tape. The polishing head 301 includes a pressing member 303 at a lower portion thereof, and is configured to press the polishing tool 302 against the surface of the substrate W by the pressing member 303 . The polishing head 301 grinds the surface of the substrate W by pressing the polishing tool 302 against the surface of the substrate W rotated by the substrate holding portion 300 while rotating the polishing head 301 around its axis.

In the polishing apparatus shown in FIG. 46, if either the polishing head 301 or the substrate holding portion 300 is inclined relative to the other, the polishing tool 302 cannot properly contact the surface of the substrate W, and as a result, the desired polishing cannot be obtained. contour.

Therefore, the objective of this invention is to provide the grinding|polishing method and the grinding|polishing apparatus which can optimize the relative angle of a board|substrate holding part and the pressing member which presses a grinding|polishing tool to a board|substrate.

One aspect of the present invention is a polishing method, characterized in that: at least three sensors are used to measure the heights of at least three points on the holding surface of the substrate, respectively, and based on the output signals of the aforementioned sensors, the For the inclination of the substrate holding surface, the sensor measures the heights of at least three points on the surface parallel to the pressing surface of the pressing member, and calculates the inclination of the pressing surface based on the output signal of the sensor. The relative angle between the substrate holding surface and the pressing surface holds the substrate on the substrate holding surface, and in a state where the inclination of the substrate holding surface or the pressing surface is adjusted so that the relative angle falls within the allowable range, the The pressing surface pushes the polishing tool against the substrate, thereby polishing the substrate.

In a preferred aspect of the present invention, in a state where the inclination of the substrate holding surface or the pressing surface is adjusted so that the relative angle falls within the allowable range, the pressing surface presses the polishing tool against the substrate, thereby This step of polishing the substrate is characterized by a step of pressing the polishing tool against the peripheral edge of the substrate using the pressing surface whose inclination is adjusted so that the relative angle falls within the allowable range.

In a preferred aspect of the present invention, the step of holding the substrate on the substrate holding surface is a step of holding the substrate on the substrate holding surface whose inclination is adjusted so that the relative angle is within an allowable range. .

In a preferred aspect of the present invention, it is characterized that at least three points on the substrate holding surface are at least three points on the outer peripheral portion of the substrate holding surface.

In a preferred aspect of the present invention, the step of measuring the heights of at least three points on the substrate holding surface is a step of measuring the heights of at least three points in each of the plurality of regions on the substrate holding surface using at least three sensors. The step of calculating the inclination of the substrate holding surface is to calculate the inclination of each of the plurality of regions, calculate the average of the inclinations of the calculated plural regions, and designate the calculated average as the inclination of the substrate holding surface. It is characterized by the inclined process.

In a preferred aspect of the present invention, the step of measuring the heights of at least three points in each of the plurality of regions is characterized by intermittently rotating the substrate holding surface.

In a preferred aspect of the present invention, the plurality of regions are arranged at equal intervals around the center of the substrate holding surface, which is characterized by that.

In a preferred aspect of the present invention, it is characterized that the inclination of the substrate holding surface and the inclination of the pressing surface are expressed as vectors on a three-dimensional coordinate system.

One aspect of the present invention is a polishing apparatus comprising: a substrate holding portion having a substrate holding surface; a pressing member for pressing a polishing tool against a pressing surface of the substrate; and measuring the substrate holding surface At least 3 sensors with heights of at least 3 points on the surface and at least 3 points of height on the surface parallel to the pressing surface; according to the output signals of the sensors, the inclination of the substrate holding surface and the pressing force are calculated. A processing unit for calculating the relative angle between the substrate holding surface and the pressing surface, and an inclination adjusting device for adjusting the inclination of the substrate holding surface or the pressing surface.

In a preferred aspect of the present invention, the inclination adjustment device includes a first inclination mechanism and a second inclination mechanism for adjusting the inclination of the pressing surface, and the pressing member is connected to the first inclination mechanism and the second inclination. institution, its characteristics.

In a preferred aspect of the present invention, the first tilt mechanism and the second tilt mechanism are provided with a first support shaft and a second support shaft that are perpendicular to each other, respectively, and the pressing member may be the first support shaft and the first support shaft. 2 The support axis is rotated around the center, which is its characteristic.

In a preferred aspect of the present invention, the tilt adjustment device is a pressing member tilting actuator for tilting the pressing surface, and the pressing member tilting actuator is characterized by having at least two actuators.

In a preferred aspect of the present invention, the tilt adjustment device is a substrate holding surface tilt actuator for tilting the substrate holding surface, and the substrate holding surface tilt actuator is characterized by having at least two actuators. .

In a preferred aspect of the present invention, the sensor is located above the outer peripheral portion of the substrate holding surface, which is a feature.

In a preferred aspect of the present invention, the aforementioned sensor is a displacement sensor, which is a feature thereof.

In a preferred aspect of the present invention, a bracket for fixing the sensor is additionally provided, which is a feature.

According to the present invention, the inclination of the substrate holding surface or the pressing member can be adjusted according to the relative angle between the substrate holding surface and the pressing surface. The pressing member can press the polishing tool against the surface or the peripheral portion of the substrate on the stage surface at an optimum angle. As a result, the desired grinding profile can be obtained.

1: Substrate holding part

2: Substrate stage

2a: Loading table

3: Carrier motor

5: Basic surface

7: Grinding belt

10: Grinding head

11: Press the member

11a: Pressing surface

14: Unwinding reel

15: Rewinding reel

17, 18: Reel motor

20: with feeding device

21, 22: Guide rollers

25: Air cylinder

27: Piston rod

28: Press member holder

30: Sensor

33: Direct moving guide

33a: Movable part

35: Bracket

36: Fixed column

39: Base Block

39a: Through hole

40: Processing Department

40a: Memory Device

40b: Computing device

41: Grinding head moving device

42: Fixed components

43: Direct moving guide

44: Ball screw mechanism

45: Servo motor

46: Motor table

47: Bottom plate

48: Setting Blocks

51: 1st support axis

51a: Polygon part

51b: Cylindrical part

51c: Flange part

52: Fixed plate

52a: Polygonal hole

52b: Incision

55: 1st screw

57: Eccentric Cam

60: 1st tilt mechanism

62: 2nd support axis

64: 2nd screw

69: 2nd tilt mechanism

71: Target plate

71a: Above

72: Protrusion

72a: Above the protrusion

76: Support Components

80: Actuator

81: Substrate holding surface tilt actuator

82: Ball joint

84: Ball screw mechanism

85: Servo motor

86: Motion Control Department

87: Press member tilt actuator

90: Link Arm

92: Benchmark Board

92a: Datum plane

95: 2nd grinding head moving device

97: Frame

98: Reel moving mechanism

111: Substrate holding part

112: Bottom plate

114: Sucker

114a: Substrate Contact Points

116: hollow motor (suction cup motor)

118: Cleaning fluid supply nozzle

120: head shaft

122: Head Rotation Mechanism

125: Air cylinder

126: Shell

130: Abrasives

130a: Grinding surface

133: Bracket

135: Sensor lifting device

140: Swing arm

141: Arm support shaft

143: Arm Rotation Mechanism

150: Grinding head

155: Press member

155a: Pressing surface

160: Virtual substrate

160a: flat surface

170: Hydrostatic support stage

170a: Substrate support surface

172: Fluid discharge port

174: Fluid supply circuit

175: Platform lifting mechanism

180: Sensor target fixture

180a: flat side

181: Bottom Wall

182: Zhou Wall

182a: Through hole

184: screw hole

185: Screw

187: Magnet

190: Setup Desk

191: Setting Faces

200: Substrate stage

200a: Loading table

205: Grinding belt

208: Press the member

209: Air Cylinder

210: Sag

300: Substrate holding part

301: Grinding head

302: Abrasives

303: Press the member

A1: The first side

A2: The second side

CP: axis

D: 1st direction

F: 2nd direction

HP: axis

L: axis

P: Upper inclined part (upper inclined part)

Q: Lower slope part (lower slope part)

R: side

R1~R8: area

S: inclined face

T1: Flat part

T2: Flat part

W: substrate

1st (a) figure and 1st (b) figure are enlarged cross-sectional views which show the peripheral part of a board|substrate.

The second figure is a plan view schematically showing an embodiment of the polishing apparatus.

The third figure is a side view of the grinding device shown in the second figure viewed from the direction of arrow A.

The fourth figure is a side view of the grinding device shown in the second figure viewed from the direction of arrow B.

The fifth figure is an oblique view showing the sensor in mode.

FIG. 6 is a schematic view showing the configuration of the polishing head.

Fig. 7 is a view of the base block and the first support shaft viewed from the direction indicated by arrow C in Fig. 6 .

Fig. 8 is a front view showing the air cylinder, the linear motion guide, and the pressing member.

FIG. 9 is a diagram showing a sensor and a processing unit for measuring the inclination of the stage surface of the substrate stage.

FIG. 10 is a schematic diagram showing an embodiment of measuring the inclination of the stage surface in plural regions in the stage surface.

The eleventh diagram is a diagram showing three points in the reference plane measured by the sensor.

The twelfth figure is a diagram showing the coordinates of each of the three points on the reference plane before the sensor is reset to zero.

The thirteenth diagram is a diagram showing the coordinates of each of the three points on the reference plane after the sensor is reset to zero.

FIG. 14 is a diagram illustrating a process of creating three vectors orthogonal to each other from the coordinates of three points.

FIG. 15 is a diagram illustrating a process of decomposing a normal vector into an X-direction vector, a Y-direction vector, and a Z-direction vector.

FIG. 16 is a diagram showing a sensor and a processing unit for measuring the inclination of the pressing surface of the pressing member.

FIG. 17 is a flowchart illustrating the flow of the process of making the inclination of the pressing surface match the inclination of the stage surface.

FIG. 18 is a flowchart illustrating the flow of the process of matching the inclination of the pressing surface with the inclination of the stage surface.

Fig. 19 is a side view schematically showing another embodiment of the polishing apparatus.

Fig. 20 is a diagram showing a state in which the polishing head is moved until the upper surface of the protruding portion is positioned below the three sensors.

Fig. 21 is a schematic side view showing yet another embodiment of the polishing apparatus.

Fig. 22 is a diagram showing the configuration of the actuator shown in Fig. 21.

FIG. 23 is a diagram showing an example of the detailed configuration of the actuator.

FIG. 24 is a plan view showing a stage tilt actuator having two actuators and one ball joint.

Fig. 25 is a plan view of the polishing apparatus shown in Fig. 21.

FIG. 26 is a diagram showing a state in which the polishing head and the reference plate are moved until the reference surface of the reference plate is positioned below the sensor.

FIG. 27 is a flowchart illustrating the flow of the process of matching the inclination of the stage surface with the inclination of the pressing surface.

FIG. 28 is a flowchart illustrating the flow of the process of matching the inclination of the stage surface with the inclination of the pressing surface.

FIG. 29 is a diagram showing an embodiment in which an actuator is connected to the polishing head instead of the substrate holding portion.

Fig. 30 is a side view schematically showing still another embodiment of the polishing apparatus.

Figure 31 is a bottom view of the grinding head shown in Figure 30.

Figure 32 is a plan view of the grinding head in the grinding position.

Fig. 33 is a sectional view showing the hydrostatic support stage shown in Fig. 32.

34(a) and 34(b) are diagrams for explaining the substrate holding surface of the substrate holding portion.

FIG. 35 is a diagram showing a state in which the dummy substrate is held by the substrate holding portion.

FIG. 36 is a diagram showing a state in which the sensor measures the heights of three points on the lower surface of the virtual substrate.

FIG. 37 is a diagram showing a state in which the sensor measures the height of the polishing surface (lower surface) of the polishing tool.

FIG. 38 is a diagram showing a state in which a sensor target jig is attached to the bottom of the polishing head.

Fig. 39(a) is a diagram showing an example of a fastening mechanism for detachably attaching the sensor target jig to the grinding head, and Fig. 39(b) is a diagram showing the fastening mechanism Figures of other examples.

Fig. 40 is a diagram showing a state when the height of three points on the flat surface of the sensor target jig is measured by the sensor.

FIG. 41 is a diagram showing an embodiment of a polishing apparatus including a substrate holding surface tilt actuator that tilts the entire substrate holding portion.

FIG. 42 is a schematic diagram showing a conventional polishing apparatus.

FIG. 43 is a cross-sectional view showing step-shaped depressions formed in the peripheral edge portion of the substrate.

FIG. 44 is a view showing a state in which the inclined pressing member presses the polishing tape against the peripheral edge portion of the substrate.

FIG. 45 is a view showing a state in which the pressing member presses the polishing tape against the peripheral edge portion of the inclined substrate.

FIG. 46 is a schematic diagram showing another example of the conventional polishing apparatus.

1st (a) figure and 1st (b) figure are enlarged cross-sectional views which show the peripheral part of a board|substrate. More specifically, Figure 1 (a) is a cross-sectional view of a so-called linear substrate, and Figure 1 (b) is a cross-sectional view of a so-called circular substrate. As an example of a substrate, a wafer is cited. The peripheral edge portion of the substrate is formed to define a region including a sloped portion, a top edge portion, and a bottom edge portion. In the substrate W of Fig. 1 (a), the inclined portion is a substrate W composed of an upper inclined portion (upper inclined portion) P, a lower inclined portion (lower inclined portion) Q, and a side portion (apex) R The outermost peripheral surface (represented by the symbol S). In the board|substrate W of the 1st (b) figure, a slope part constitutes the part which has a curved cross section of the outermost peripheral surface of the board|substrate W (indicated by the symbol S). The top edge portion is an annular flat portion T1 located radially inward from the sloped portion S. As shown in FIG. The bottom edge portion is located on the opposite side to the top edge portion, and is an annular flat portion T2 that is located closer to the radially inner side than the slope portion S is. The top edge portion T1 also includes a region in which elements are formed. In the following description, the embodiment of grinding|polishing the top edge part T1 is demonstrated, but this invention is applicable also to the grinding|polishing of the bottom edge part T2, and the grinding|polishing of the slope part S.

The second figure is a plan view schematically showing one embodiment of the grinding device, the third figure is a side view of the grinding device shown in the second figure viewed from the direction of arrow A, and the fourth figure is the second figure viewed from the direction of arrow B A side view of the grinding device shown in the figure. The polishing apparatus includes a substrate holding portion 1 that holds and rotates a substrate (eg, wafer) W. The substrate holding unit 1 includes a substrate stage 2 capable of holding the substrate W, and a stage motor 3 that rotates the substrate stage 2 around its axis L. The upper surface of the substrate stage 2 constitutes a substrate holding surface for holding the substrate W, that is, a stage surface 2a. The substrate stage 2 is connected to the stage motor 3 , and the stage surface 2 a of the substrate stage 2 is rotated by the stage motor 3 around the axis L of the substrate stage 2 . The polished substrate W is held on the stage surface 2 a of the substrate stage 2 by vacuum suction or the like, and is rotated by the stage motor 3 together with the substrate stage 2 .

The polishing apparatus includes a polishing head 10 including a pressing member 11 that presses the polishing tape 7 against the peripheral edge portion of the substrate W. As shown in FIG. The pressing member 11 is arranged above the substrate stage 2 , and is arranged at a position deviated from the axis L of the substrate stage 2 . More specifically, the pressing member 11 is arranged above the peripheral edge portion of the substrate W held on the stage surface 2a.

The polishing tape 7 is a polishing tool for polishing the substrate W. One end of the abrasive belt 7 is fixed to the unwinding reel 14 , and the other end of the abrasive belt 7 is fixed to the take-up reel 15 . Most of the abrasive tape 7 is wound around both the unwinding reel 14 and the take-up reel 15 , and a portion of the abrasive tape 7 is extended between the unwinding reel 14 and the take-up reel 15 . The unwinding reel 14 and the winding reel 15 are applied with torques in opposite directions by the reel motors 17 and 18 , respectively, thereby imparting tension to the polishing belt 7 .

A tape feeding device 20 is arranged between the unwinding reel 14 and the winding reel 15 . The abrasive tape 7 is fed from the unwinding reel 14 to the take-up reel 15 at a constant speed by the tape feeding device 20 . The abrasive belt 7 extending between the unwinding reel 14 and the winding reel 15 is supported by two guide rollers 21 , 22 . These two guide rollers 21 and 22 are arranged between the unwinding reel 14 and the winding reel 15 . On the guide roller 21, The lower surface of the polishing tape 7 extending between 22 constitutes the polishing surface for polishing the substrate W. In terms of abrasives, fixed abrasive particles (ie, grindstones) can also be used in place of the abrasive belt 7 .

The pressing member 11 is located between the two guide rollers 21 and 22 . Guide rollers 21 and 22 are arranged at the contact point between the peripheral edge of the substrate W and the polishing belt 7 so that the polishing belt 7 between the guide rollers 21 and 22 extends in the tangential direction of the substrate W.

The polishing of the substrate W is carried out as follows. The substrate W is held on the substrate stage 2 so that the film (eg, element layer) formed on the surface thereof faces upward, and the substrate W is rotated together with the substrate stage 2 around its axis L as the center. A liquid (for example, pure water) is supplied to the center of the rotating substrate W from a liquid supply nozzle (not shown). In this state, the pressing member 11 of the polishing head 10 presses the polishing tape 7 against the peripheral edge portion of the substrate W, more specifically, the top edge portion of the substrate W (see Figs. 1(a) and 1(b). ) figure symbol T1). The substrate W is polished by the sliding contact of the rotating substrate W with the polishing tape 7 . The polishing tape 7 during polishing of the substrate W extends in the tangential direction of the substrate W at the contact point between the substrate W and the polishing tape 7 as shown in the second figure.

The polishing apparatus includes three sensors 30 capable of measuring the height of the stage surface 2 a of the substrate stage 2 . In one embodiment, the height of the stage surface 2a is the distance from a certain reference point to the stage surface 2a. These sensors 30 are located above the substrate holding surface, that is, the outer peripheral portion of the stage surface 2a, and are arranged so that the height of the outer peripheral portion of the stage surface 2a can be measured. This is for measuring the height of the region closest to the stage surface 2 a of the pressing member 11 .

The three sensors 30 are fixed to the bracket 35, and the bracket 35 is fixed to the fixing column 36 in a detachable manner. The fixed column 36 is a stationary member whose position and angle are unchanged, and is fixed to the base surface 5 . The stage motor 3 is also fixed to the base surface 5 . The relative position of the sensor 30 held by the bracket 35 and the substrate stage 2 set to fixed. On the other hand, at least the pressing member 11 of the polishing head 10 is configured to be tiltable relative to the sensor 30 and the substrate stage 2 .

The polishing apparatus further includes a processing unit 40 that calculates the inclination of the stage surface 2 a based on the output signal of the sensor 30 . As shown in FIG. 2 , the processing unit 40 includes a memory device 40a and an arithmetic device 40b therein. The memory device 40a includes a hard disk drive (HDD), a solid state drive (SSD), or the like. For the computing device 40b, a CPU (Central Processing Unit, central processing unit) is used. A program is stored in advance in the memory device 40a, and the arithmetic device 40b operates according to the program. The sensor 30 is connected to the processing unit 40 , and the output signal of the sensor 30 is sent to the processing unit 40 . The output signal of the sensor 30 is a signal representing the height of the stage surface 2a.

As shown in FIG. 4 , the grinding head 10 includes: an air cylinder 25 serving as a pressing means for supplying a pressing force to the pressing member 11 ; and a base block 39 for fixing the air cylinder 25 . In the present embodiment, the air cylinder 25 is fixed to the base block 39 through the fixing member 42 attached to the base block 39 . The base block 39 is rotatably supported by the first support shaft 51 . The pressing member 11 is connected to the air cylinder 25 .

As shown in FIG. 2 , the first support shaft 51 is connected to the polishing head moving device 41 that moves the polishing head 10 in the predetermined first direction D. As shown in FIG. The first direction D in this embodiment is a direction in which a straight line (imaginary line) connecting the axis L of the substrate stage 2 and the pressing member 11 when the substrate stage 2 is viewed from above extends. The first direction D is perpendicular to the polishing belt 7 extending between the guide rollers 21 and 22 . The polishing head moving device 41 includes: a linear guide 43 to which the first support shaft 51 is fixed; a ball screw mechanism 44 connected to the first support shaft 51 ; and a servo motor 45 connected to the ball screw mechanism 44 . The linear motion guide 43 and the ball screw mechanism 44 extend in the first direction D described above. When the servo motor 45 drives the ball screw mechanism 44, the first support shaft 51 moves in the first direction D. As shown in FIG. The air cylinder 25 and the base block 39 are connected to the first support shaft 51, so if the servo motor 45 drives the ball screw mechanism 44, together with the first support shaft 51, the polishing head 10 moves in the first direction D, that is, the direction of approaching the stage surface 2a of the substrate stage 2 and the sensor 30, and the direction of moving away from it .

As shown in FIG. 4 , the linear motion guide 43 and the motor table 46 are fixed to the base plate 47 . The servo motor 45 is fixed to the motor stand 46 . The bottom plate 47 is fixed to the base surface 5 by setting the block 48 .

The fifth figure is an oblique view showing the sensor 30 in mode. The sensors 30 are separated from each other and arranged at the same height. In the present embodiment, each sensor 30 is a contact-type displacement sensor having a probe that contacts a measurement object. The configuration of the three sensors 30 is not particularly limited as long as the sensors 30 are not arranged in a straight line. In one embodiment, four or more sensors 30 may be provided. In one embodiment, the sensor 30 can also be a non-contact displacement sensor.

FIG. 6 is a schematic diagram showing the configuration of the polishing head 10 . As shown in FIG. 6 , the polishing head 10 includes: a pressing member 11 for pressing the polishing tape 7 against the peripheral edge portion of the substrate W; a pressing member holder 28 for holding the pressing member 11 ; An air cylinder 25 serving as a pressing means supplies a pressing force to the pressing member 11 . In the sixth figure, the substrate W and the polishing tape 7 are not shown. The pressing member 11 is fixed to the end of the pressing member holder 28 . As described above, the pressing member 11 is arranged at a position away from the axis L of the substrate stage 2 .

The pressing member 11 has a pressing surface 11a parallel to the stage surface 2a. The pressing surface 111 a is a flat surface, and the pressing member 11 is configured to press the polishing tape 7 against the peripheral edge portion of the substrate W by the pressing surface 11 a. The air cylinder 25 is connected to the linear guide 33 extending parallel to the axis L of the substrate stage 2 , and the air cylinder 25 is connected to the pressing member holder 28 and the pressing member 11 through the linear guide 33 . More specifically, the piston rod 27 of the air cylinder 25 is fixed to the movable portion 33 a of the linear guide 33 , and the pressing member holder 28 is fixed to the movable portion 33 a of the linear guide 33 . Therefore, the pressing member 11 and the pressing member holder 28 move integrally with the piston rod 27 . Movement of the piston rod 27, the pressing member holder 28, and the pressing member 11 The moving direction is restricted to a direction parallel to the axis L of the substrate stage 2 , that is, a direction perpendicular to the stage surface 2 a, by the linear guide 33 . In the present embodiment, the axis L of the substrate stage 2 extends in the vertical direction.

As shown in FIG. 6 , the grinding head 10 is additionally provided with a base block 39 . The air cylinder 25 and the linear motion guide 33 are fixed to the base block 39 . In the present embodiment, the air cylinder 25 is fixed to the base block 39 through the fixing member 42 attached to the base block 39 . The base block 39 is rotatably supported by the first support shaft 51 . The fixing plate 52 is fixed to the base block 39 by a plurality of (four in the sixth figure) first screws 55 .

Fig. 7 is a view in which the base block 39 and the first support shaft 51 are viewed in the direction indicated by the arrow C in Fig. 6 . The first support shaft 51 has a cylindrical portion 51b and a flange portion 51c having a wider width than the cylindrical portion 51b. The base block 39 is rotatably supported by the cylindrical portion 51 b of the first support shaft 51 . More specifically, a circular through hole 39 a through which the cylindrical portion 51 b of the first support shaft 51 penetrates is formed in the base block 39 . The outer peripheral surface of the cylindrical portion 51 b of the first support shaft 51 is in contact with the through hole 39 a of the base block 39 , and the base block 39 is rotatably supported by the first support shaft 51 .

Through holes (not shown) through which the first screws 55 are inserted are formed in the fixing plate 52 and the base block 39 . The first screws 55 extend through the through holes of the fixing plate 52 and the base block 39 , and are screwed into screw holes (not shown) formed in the flange portion 51 c of the first support shaft 51 . The diameter of each through hole formed in the base block 39 is larger than the diameter of the first screw 55 , and there is a certain gap between the first screw 55 and the through hole of the base block 39 . Therefore, the base block 39 can be rotated within a certain range around the first support shaft 51 . When the first screw 55 is fastened, the base block 39 is sandwiched between the fixing plate 52 and the flange portion 51c of the first support shaft 51, thereby preventing the base block 39 from rotating.

The first support shaft 51 has a polygonal portion 51a at its end. The polygonal portion 51a is connected to the end portion of the cylindrical portion 51b. As shown in FIG. 6 , a polygonal shape for the first support shaft 51 is formed on the fixing plate 52 . The polygonal hole 52a through which the portion 51a penetrates. The polygonal hole 52 a is formed of a polygonal surface that contacts the outer surface of the polygonal portion 51 a of the first support shaft 51 . The polygonal portions 51a are fitted into the polygonal holes 52a, and the fixing plate 52 cannot rotate relative to the first support shaft 51 due to the engagement of the polygonal portions 51a and the polygonal holes 52a.

The fixing plate 52 is formed with a cutout 52b. The notch 52b is arranged at a position away from the axis of the first support shaft 51 . The eccentric cam 57 is arrange|positioned in the notch 52b, and this eccentric cam 57 is attached to the base block 39 so that rotation is possible.

The pressing member 11 is connected to the first support shaft 51 via the pressing member holder 28 , the linear motion guide 33 , and the base block 39 . During the polishing of the substrate W, the first screw 55 is maintained in a fastened state. Therefore, the posture of the grinding head 10 including the base block 39, the pressing member 11, the linear motion guide 33, and the air cylinder 25 is fixed. When the first screw 55 is loosened, the polishing head 10 is allowed to rotate around the axis of the first support shaft 51 . When the eccentric cam 57 is rotated while the first screw 55 is loosened, the polishing head 10 rotates in the direction indicated by the arrow in FIG. 6 around the axis of the first support shaft 51 .

The rotation angle of the grinding head 10 depends on the rotation angle of the eccentric cam 57 . In other words, the inclination of the pressing surface 11 a of the pressing member 11 is adjusted by the rotation of the eccentric cam 57 . In the present embodiment, the first support shaft 51, the fixing plate 52, the eccentric cam 57, and the first screw 55 are configured to adjust the inclination of the pressing surface 11a by rotating the pressing member 11 around the first supporting shaft 51. The first tilt mechanism 60 .

As shown in FIG. 6 , the second support shaft 62 is fixed to the movable portion 33 a of the linear guide 33 . The second support shaft 62 extends in a direction perpendicular to the first support shaft 51 . The pressing member holder 28 holding the pressing member 11 is rotatably supported by the second support shaft 62 . The pressing member holder 28 is fixed to the movable portion 33 a of the linear motion guide 33 by a plurality of (two in the present embodiment) second screws 64 . More specifically, a through hole (not shown) through which the second screw 64 is inserted is formed in the pressing member holder 28 , The second screw 64 is screwed into a screw hole (not shown) of the movable portion 33 a of the linear motion guide 33 through a through hole. The diameter of the through hole formed in the pressing member holder 28 is larger than the diameter of the second screw 64 , and there is a certain gap between the second screw 64 and the through hole. Therefore, the pressing member holder 28 is rotatable within a range to the extent that the second support shaft 62 is positioned at the center.

FIG. 8 is a front view showing the air cylinder 25 , the linear motion guide 33 , and the pressing member 11 . The pressing member holder 28 and the pressing member 11 are rotatably supported by the second support shaft 62 , and the pressing member holder 28 is fixed to the movable portion 33 a of the linear guide 33 by the second screw 64 . As long as the second screw 64 is fastened, the rotation around the second support shaft 62 of the pressing member holder 28 and the pressing member 11 is not allowed. In one embodiment, the number of the second screw 64 may be one.

The pressing member 11 is connected to the second support shaft 62 via the pressing member holder 28 . During the polishing of the substrate W, the second screw 64 is maintained in a fastened state. Therefore, the postures of the pressing member 11 and the pressing member holder 28 are fixed. When the second screw 64 is loosened, the pressing member 11 and the pressing member holder 28 are allowed to rotate in the direction indicated by the arrow around the second support shaft 62 . The inclination of the pressing surface 11 a of the pressing member 11 can be adjusted by manually tilting the pressing member 11 and the pressing member holder 28 with the second screw 64 loosened, and then tightening the second screw 64 . In the present embodiment, the second support shaft 62 and the second screw 64 are configured such that the pressing member 11 can be rotated around the second support shaft 62 perpendicular to the first support shaft 51, thereby adjusting the inclination of the pressing surface 11a. The second tilt mechanism 69 .

The pressing surface 11 a of the pressing member 11 is preferably parallel to the stage surface 2 a of the substrate stage 2 . However, as described with reference to FIGS. 44 and 45, there are cases in which the pressing surface 11a of the pressing member 11 and/or the stage surface 2a of the substrate stage 2 are inclined due to the assembly accuracy of the polishing apparatus and the like. situation. Therefore, in the present embodiment, the pressing surface 11a of the pressing member 11 and the stage surface 2a are parallel to each other. The inclination of the pressing surface 11 a is adjusted by the first inclination mechanism 60 and the second inclination mechanism 69 as inclination adjustment means.

The three sensors 30 measure the heights of three points on the stage surface 2a required to calculate the inclination of the stage surface 2a. The positions of the three points correspond to the positions of the three sensors 30 . In the present embodiment, the three points are points on the outer peripheral portion of the stage surface 2a. FIG. 9 is a diagram showing the sensor 30 and the processing unit 40 that measure the inclination of the stage surface 2 a of the substrate stage 2 . The three sensors 30 measure the heights of three points on the stage surface 2a, and send three output signals each indicating the measured heights to the processing unit 40.

The processing unit 40 specifies the positions of the three points on the stage surface 2 a from the relative positions of the three received output signals and the three sensors 30 . The relative positions of the three sensors 30 are fixed, and the relative positions of the respective sensors 30 are known. The position system of the three points on the stage surface 2a can be expressed as coordinates on a three-dimensional coordinate system defined by the X axis, the Y axis, and the Z axis that are orthogonal to each other. Hereinafter, the three-dimensional coordinate system defined by the X axis, the Y axis, and the Z axis is referred to as the XYZ coordinate system.

Fig. 10 is a schematic diagram showing an embodiment of measuring the inclination of the stage surface 2a in a plurality of regions in the stage surface 2a. In this embodiment, the substrate stage 2 is rotated intermittently at a scale of 45 degrees, and the inclination of the stage surface 2a is measured in eight regions R1 to R8 of the stage surface 2a. Initially, when the substrate stage 2 is stationary, as shown in FIG. 11 , the sensor 30 measures the heights of three points S1 , S2 , and S3 in the region R1 serving as the reference plane. The three points S1 , S2 and S3 in the region R1 are points that are determined unequivocally according to the positions of the three sensors 30 . The positions of the three sensors 30 are not particularly limited as long as the corresponding three points S1 , S2 and S3 are not arranged on a straight line. However, when the sensors 30 are arranged such that the area of the surface formed by the three sensors 30 is larger than the contact area of the pressing member 11, for example, sensors are arranged at intervals of 120 degrees on the outer periphery of the substrate. In the case of the measuring device 30, there is a possibility that the inclination of the pressing surface 11a of the pressing member 11 when polishing the peripheral portion of the substrate cannot be accurately measured. In addition, if three sensors 30 are arranged near the center of the substrate, the accuracy may not be good. The possibility of the inclination of the pressing surface 11a of the pressing member 11 is measured in a precise manner. Therefore, in order to measure more accurately, it is preferable that all the three sensors 30 are located in the vicinity of the pressing surface 11 a of the pressing member 11 .

The processing unit 40 defines the first straight line L1 connecting the point S2 and the point S3 as the Y axis of the XYZ coordinate system. When viewed from above the substrate stage 2 , the three sensors 30 are provided so that the first straight line L1 and the axis of the first support shaft 51 (see FIG. 7 ) are parallel. The processing unit 40 defines, as the X axis of the XYZ coordinate system, a second straight line L2 extending from the point S1 and intersecting the Y axis perpendicularly. The second straight line L2 is parallel to the axis of the second support shaft 62 (see FIG. 6 ) when viewed from above the substrate stage 2 . The intersection O of the X axis and the Y axis is the origin of the XYZ coordinate system. A line system perpendicular to both the X-axis and the Y-axis and passing through the origin O is defined as the Z-axis of the XYZ coordinate system. As described above, the XYZ coordinate system is determined by the positions of the three points S1, S2, and S3 in the region R1 serving as the reference plane.

Next, the zero position reset of the sensor 30 is performed. The zero position reset of the sensor 30 is an operation of calibrating the sensor 30 and resetting the measured values of the heights of three points on the reference plane (region R1 ) to 0. The coordinate system of each of the three points S1 , S2 , and S3 in the region R1 before the sensor 30 is reset to zero is as follows (see FIG. 12 ).

Coordinates of S1: (-d1,0,α)

Coordinates of S2: (0,-d2,β)

Coordinates of S3: (0, d3, γ)

d1 (absolute value) is the distance from the origin O to the point S1, d2 (absolute value) is the distance from the origin O to the point S2, and d3 (absolute value) is the distance from the origin O to the point S3. d1 , d2 , and d3 can be calculated from the relative positions of the three sensors 30 . The coordinates of the α, β, γ system points S1, S2, and S3 on the Z axis are the measured values obtained by the sensor 30 on the reference plane R1 (ie, the output signal of the sensor 30).

Next, the processing unit 40 performs zero reset of the sensor 30 . Specifically, the coordinates on the Z-axis of the points S1, S2, and S3 (ie, the output signals of the three sensors 30) are reset to zero. If the coordinates of the three points S1, S2, and S3 in the region R1 after the zero reset of the sensor 30 is performed are set as S1 _R1 , S2 _R1 , and S3 _R1 respectively, the coordinates S1 _R1 , S2 _R1 , and S3 _R1 represent As follows (refer to Figure 13).

S1 _R1 : (-d1,0,0)

S2 _R1 : (0,-d2,0)

S3 _R1 : (0,d3,0)

Next, the processing unit 40 obtains the normal vector of the region R1 indicating the inclination of the region R1 as follows. First, the processing unit 40 creates three vectors that are orthogonal to each other from the coordinates S1 _R1 , S2 _R1 , and S3 _R1 of the three points (see FIG. 14 ).

Vector V1 _R1 =S2 _R1 -S1 _R1 =(d1,-d2,0)

Vector V2 _R1 =S3 _R1 -S2 _R1 =(0,d3+d2,0)

Vector V3 _R1 =V1 _R1 ×V2 _R1 , (× is the product)

Vector V1 _R1 is a vector from point S1 to point S2, and vector V2 _R1 is a vector from point S2 to point S3. The vector V3 _R1 is a vector orthogonal to both the vector V1 _R1 and the vector V2 _R1 . That is, the vector V3 _R1 is the normal vector of the region R1. In the fourteenth figure, the starting points of the three V1 _R1 , V2 _R1 , and V3 _R1 are placed on the point S1, but other points may also be used.

Next, as shown in FIG. 15, the processing unit 40 decomposes the normal vector V3 _R1 of the region R1 into the X-direction vector V3 _R1,X on the X-axis, the Y-direction vector V3 _R1, Y on the Y-axis, and the Z-pointing vector V3 _R1,Z on the Z axis. The normal vector V3 _R1 is the sum of the X-direction vector V3 _R1,X , the Y-direction vector V3 _R1,Y , and the Z-direction vector V3 _R1,Z , and is expressed as follows.

Normal vector V3 _R1 =V3 _R1,X +V3 _R1,Y +V3 _R1,Z

Here, the X-direction vector system is defined as a vector that forms components projected on the X-axis when a certain vector is decomposed into the X-axis, the Y-axis, and the Z-axis. Similarly, the Y-axis pointing vector system is defined as a vector that forms components that are projected on the Y-axis when a vector is decomposed into X-axis, Y-axis, and Z-axis, and the Z-axis pointing vector system is defined as forming a vector that decomposes a certain vector. The vector of the component projected on the Z axis when it is the X axis, Y axis, and Z axis.

Among them, in the fifteenth figure, for the sake of illustration, the normal vector V3 _R1 of the region R1 is inclined with respect to the Z axis, but in the region R1 as the reference plane, the sensor 30 is reset to zero, so the region R1 The normal vector of V3 _R1 is actually parallel to the Z axis. Therefore, the X-pointing vector V3 _{R1, X} and Y of the region R1 point to the X component, the Y component, and the Z component of each of the vector V3 _{R1, Y} being zero.

Next, the substrate stage 2 is rotated by 45 degrees, and then stands still. Next, similarly, in the area R2, the sensor 30 measures the heights of three points on the stage surface 2a, and the processing unit 40 calculates a normal vector indicating the inclination of the area R2. By repeating the above operations, the processing unit 40 creates eight normal vectors V3 _R1 , V3 _R2 , V3 _R3 , V3 _R4 , V3 _R5 , V3 _R6 , V3 _R7 , and V3 that represent the inclinations of the eight regions R1 to R8 , respectively. _R8 . Each normal vector system is represented on the XYZ coordinate system. The normal vector is composed of a set of an X-direction vector on the X-axis, a Y-direction vector on the Y-axis, and a Z-direction vector on the Z-axis. More specifically, the normal vector is the sum of the X-direction vector, the Y-direction vector, and the Z-direction vector.

The processing unit 40 calculates the average of 8 normal vectors (that is, 8 X-direction vectors, 8 Y-direction vectors, and 8 Z-direction vectors), and designates the average of the calculated normal vectors as a representation vector. The normal vector of the inclination of the table top 2 a is stored in the memory device 40 a of the processing unit 40 . In order to accurately obtain the inclination of the stage surface 2a, a plurality of regions (for example, regions R1 to R8) in the stage surface 2a are located on the outer peripheral portion of the stage surface 2a, and are located at the axis L of the substrate stage 2, that is, the stage surface 2a. It is better to distribute at equal intervals around the center of the .

In the above-described embodiment, in order to obtain a more accurate inclination of the stage surface 2a, the inclination of the stage surface 2a is measured in the plural regions R1 to R8 in the stage surface 2a. That is, the sensor 30 and the processing unit 40 measure the inclination of the stage surface 2a in a plurality of regions within the stage surface 2a while the substrate stage 2 is intermittently rotated about its axis L. The processing unit 40 calculates the average of the inclinations obtained in the respective regions (that is, the average of the normal vectors), and designates the average as the normal vector representing the inclination of the entire stage surface 2a. In one embodiment, the inclination of the stage surface 2a may be obtained only in one region within the stage surface 2a. For example, the processing unit 40 may set the normal vector V3 _R1 in the above-mentioned region R1 as the inclination of the stage surface 2a.

After the inclination of the stage surface 2a is determined, the inclination of the pressing surface 11a of the pressing member 11 is measured. FIG. 16 is a diagram showing the sensor 30 and the processing unit 40 that measure the inclination of the pressing surface 11 a of the pressing member 11 . As shown in FIG. 16, before the measurement, the target plate 71 is attached to the lower surface of the pressing member 11, that is, the pressing surface 11a. The target plate 71 is fixed to the pressing surface 11a of the detachable pressing member 11 by fasteners (not shown) such as screws. The target plate 71 is made of a metal such as stainless steel or a hard material such as ceramics. The target plate 71 has a flat upper surface 71 a with a larger area than the pressing surface 11 a , and the sensor 30 is located above the target plate 71 . Since the upper surface 71a of the target plate 71 contacts the pressing surface 11a of the pressing member 11, the upper surface 71a of the target plate 71 is parallel to the pressing surface 11a. That is, the inclination of the upper surface 71a of the target plate 71 is the same as the inclination of the pressing surface 11a.

The three sensors 30 measure the heights of three points on the target plate 71 required to calculate the inclination of the pressing surface 11a. The positions of the three points correspond to the positions of the three sensors 30 . As shown in FIG. 16, the three sensors 30 measure the heights of three points on the upper surface 71a of the target plate 71, and send three output signals respectively indicating the measured heights to the processing unit 40 . The processing unit 40 calculates the inclination of the pressing surface 11 a based on the output signal of the sensor 30 . That is, the processing unit 40 specifies the positions of the three points on the target plate 71 from the three received output signals and the relative positions of the three sensors 30, and calculates the position of the plane including the three points. normal vector. This normal vector is a vector indicating the inclination of the target plate 71, that is, the inclination of the pressing surface 11a. After the inclination of the pressing surface 11 a is calculated, the target plate 71 is maintained in a state of being attached to the pressing member 11 .

The processing part 40 is comprised so that the relative angle of the stage surface 2a and the pressing surface 11a may be calculated based on the inclination of the stage surface 2a and the inclination of the pressing surface 11a. In the following description, the normal vector representing the inclination of the stage surface 2a is referred to as a first normal vector, and the normal vector representing the inclination of the pressing surface 11a is referred to as a second normal vector. The first normal vector and the second normal vector are vectors on the three-dimensional XYZ coordinate system defined by the above-mentioned X axis, Y axis, and Z axis. Like the first normal vector, the second normal vector is composed of a set of an X-direction vector on the X-axis, a Y-direction vector on the Y-axis, and a Z-direction vector on the Z-axis. That is, the second normal vector is the sum of the X-direction vector, the Y-direction vector, and the Z-direction vector.

The processing unit 40 calculates the relative angle between the pressing surface 11 a and the stage surface 2 a based on the first normal vector and the second normal vector. The relative angle is composed of the X-axis angle and the Y-axis angle. More specifically, the processing unit 40 calculates the relative angle between the stage surface 2a and the pressing surface 11a, that is, the angle formed by the first normal vector and the second normal vector, and decomposes the calculated angle into the X axis. Angle and Y-axis angle. The X-axis angle is the angle of the rotation direction centered on the X-axis of the XYZ coordinate system, and the Y-axis angle is the angle of the rotation direction centered on the Y-axis of the XYZ coordinate system. The X-axis angle and the Y-axis angle correspond to the correction angle of the pressing member 11 required to make the pressing surface 11a and the stage surface 2a parallel.

The inclination of the pressing surface 11a is adjusted based on the calculated X-axis angle and Y-axis angle. Specifically, by loosening the first screw 55 and rotating the eccentric cam 57 , the entire polishing head 10 including the pressing member 11 is rotated at the Y-axis angle around the first support shaft 51 . While the polishing head 10 is rotated around the first support shaft 51 , the sensor 30 continues to measure the heights of three points on the target plate 71 . The sensor 30 is fixed to the bracket 35, so even when the grinding head 10 is tilted, the posture of the sensor 30 is not changed. will not change. Since the target plate 71 is fixed to the pressing surface 11 a of the polishing head 10 , as the polishing head 10 is rotated around the first support shaft 51 , the output signal of the sensor 30 changes. The change of the output signal of the sensor 30 corresponds to the change of the inclination of the pressing surface 11a. While the polishing head 10 is rotated around the first support shaft 51, the processing unit 40 continues to calculate the Y-axis angle. The operator rotates the polishing head 10 around the first support shaft 51 until the Y-axis angle becomes zero. After that, the first screw 55 is fastened.

Next, the second screw 64 is loosened, and the pressing member holder 28 and the pressing member 11 are rotated around the second support shaft 62 . While the pressing member holder 28 and the pressing member 11 are rotated around the second support shaft 62, the sensor 30 continues to measure the heights of three points on the target plate 71, and the processing unit 40 continues to calculate the X-axis angle. The operator rotates the pressing member 11 around the second support shaft 62 until the X-axis angle becomes zero. After that, the second screw 64 is fastened. The relative angle between the stage surface 2a and the pressing surface 11a is substantially 0, that is, both the X-axis angle and the Y-axis angle are substantially 0, which means that the pressing surface 11a and the stage surface 2a are substantially parallel. Here, substantially 0 means that the relative angle (absolute value) between the stage surface 2a and the pressing surface 11a is within the allowable range (the same applies hereinafter). The allowable range is a preset angle range, and is, for example, 0 to 2 degrees. The inclination of the pressing surface 11a of the pressing member 11 can be adjusted as described above. The adjusted pressing surface 11a is substantially parallel to the stage surface 2a. In one embodiment, the pressing member 11 may be initially rotated around the second support shaft 62 , and then the polishing head 10 may be rotated around the first support shaft 51 .

After the inclination of the pressing surface 11 a is adjusted, the target plate 71 is removed by the pressing member 11 . In addition, the sensor 30 and the bracket 35 are removed by the polishing apparatus. The polished substrate W is held on the stage surface 2 a in a state in which the center thereof coincides with the axis L of the substrate stage 2 . The substrate W is rotated about the axis L of the substrate stage 2 by the stage motor 3 . While supplying a liquid (eg, pure water) to the center of the substrate W, the polishing head 10 presses the polishing tape 7 against the peripheral edge portion of the substrate W on the pressing surface 11 a of the pressing member 11 to polish the peripheral edge portion. According to this embodiment, the pressing of the stage surface 2a of the substrate stage 2 and the pressing member 11 Since the pressing surfaces 11a are parallel to each other, the polishing tape 7 is pressed parallel to the top edge portion of the substrate W (refer to the symbol T1 in the first (a) and first (b) drawings).

The flow of the step of making the inclination of the pressing surface 11a match the inclination of the stage surface 2a will be described below with reference to the flowcharts of FIGS. 17 and 18 . In step 1, the three sensors 30 measure the heights of three points in the region R1 of the stage surface 2a serving as the reference plane, and the processing unit 40 measures the heights of the three points and the three sensors 30 as described above. The relative position of , determines the XYZ coordinate system. In step 2, the processing unit 40 resets the sensor 30 to zero. In Step 3, the processing unit 40 calculates the inclination of the region R1 from the positions (coordinates) of the three points in the region R1.

In step 4, the three sensors 30 measure the heights of three points in other regions (eg, region R2) in the stage surface 2a. In step 5, the processing unit 40 calculates the inclination of the other area from the positions (coordinates) of the three points in the other area. In step 6, steps 4 and 5 are repeated until all the inclinations of the predefined complex regions R1 to R8 are calculated. In step 7 , the processing unit 40 calculates the average of the inclinations of the plurality of regions R1 to R8 , designates the average of the inclinations as the inclination of the stage surface 2 a , and stores it in the memory device 40 a of the processing unit 40 .

As shown in FIG. 18 , in step 8 , the target plate 71 is attached to the pressing surface 11 a of the pressing member 11 . In step 9 , the sensor 30 measures the heights of three points on the target plate 71 . In step 10 , the processing unit 40 calculates the inclination of the pressing surface 11 a from the positions (coordinates) of three points on the target plate 71 . In step 11, the processing unit 40 calculates the relative angle (ie, the X-axis angle and the Y-axis angle) between the stage surface 2a and the pressing surface 11a from the inclination of the stage surface 2a and the inclination of the pressing surface 11a.

In step 12, the inclination of the pressing surface 11a of the pressing member 11 is adjusted while the sensor 30 measures the heights of three points on the target plate 71. The processing unit 40 can calculate the relative angle (ie the X-axis angle and the Y-axis angle) between the stage surface 2a and the pressing surface 11a in real time according to the output signal of the sensor 30, The calculated X-axis angle and Y-axis angle are displayed on a display (not shown). The operator rotates the polishing head 10 including the pressing member 11 around the first support shaft 51 until the Y-axis angle becomes substantially zero. Similarly, the operator rotates the pressing member holder 28 and the pressing member 11 around the second support shaft 62 until the X-axis angle becomes substantially 0 (step 13).

In step 14, the target plate 71 is removed from the pressing surface 11a, and the bracket 35 is removed from the fixing column 36 together with the sensor 30. In step 15, the substrate W to be polished is placed on the stage surface 2a in a state where the center thereof coincides with the axis L of the substrate stage 2. As shown in FIG. In step 16, the substrate W is held on the stage surface 2a by vacuum suction or the like, and the stage surface 2a and the substrate W are rotated about the axis L of the substrate stage 2 as a center. A liquid such as pure water is supplied to the center of the rotating substrate W. In step 17, in a state where the pressing surface 11a and the stage surface 2a are parallel, the pressing member 11 presses the polishing tape 7 against the peripheral edge portion (in this embodiment, the top edge portion) of the substrate W, and the polishing tape 7 Tie in the presence of liquid and grind the peripheral portion.

According to the present embodiment, the substrate W is polished by the polishing tape 7 in a state where the stage surface 2 a and the pressing surface 11 a are parallel. As a result, the recesses 210 in stages as shown in FIG. 43 can be formed in the peripheral portion of the substrate W. As shown in FIG.

Fig. 19 is a side view schematically showing another embodiment of the polishing apparatus. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment shown in FIGS. 1 to 18, so repeated descriptions thereof are omitted. As shown in FIG. 19 , the pressing member 11 has a protruding portion 72 that protrudes toward the axis L of the substrate stage 2 and the sensor 30 . The protruding portion 72 has an upper surface 72 a parallel to the pressing surface 11 a of the pressing member 11 . Therefore, the inclination of the upper surface 72a of the protruding portion 72 is the same as the inclination of the pressing surface 11a. The upper surface 72a has a larger area than that of the triangle formed by the three sensors 30 .

Before the three sensors 30 measure the height of the stage surface 2 a of the substrate stage 2 , the polishing head 10 including the protruding portion 72 is moved in a direction away from the substrate stage 2 by the polishing head moving device 41 . While the three sensors 30 are measuring the height of the stage surface 2 a of the substrate stage 2 , the polishing head 10 including the protruding portion 72 is kept away from the stage surface 2 a of the substrate stage 2 . Next, after the measurement of the height of the stage surface 2a is completed, as shown in FIG. 20, the polishing head 10 is moved by the polishing head moving device 41 until the upper surface 72a of the protruding portion 72 is positioned below the three sensors 30. Move toward the substrate stage 2 . The three sensors 30 measure the heights at three points on the upper surface 72a of the protruding portion 72 parallel to the pressing surface 11a, and send three output signals representing the measured heights to the processing unit 40, respectively. The processing unit 40 calculates the inclination of the pressing surface 11 a based on the relative position of the sensor 30 and the output signal of the sensor 30 . In this embodiment, the above-mentioned target plate 71 is not required.

Fig. 21 is a side view schematically showing still another embodiment of the polishing apparatus. In the twenty-first figure, the illustration of the polishing belt 7 is omitted. The configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in FIGS. 1 to 16, so repeated descriptions thereof are omitted. In this embodiment, instead of the polishing head 10 , the relative angle between the stage surface 2 a and the pressing surface 11 a is substantially 0 by inclining the substrate stage 2 , that is, the pressing surface 11 a and the stage surface 2 a are They are substantially parallel to each other, and differ from the above-described embodiment in this point. In the present embodiment, the first tilt mechanism 60 and the second tilt mechanism 69 may be omitted.

As shown in FIG. 21 , three actuators 80 for tilting the entirety of the substrate stage 2 and the stage motor 3 are connected to the stage motor 3 . These three actuators 80 constitute the substrate holding surface tilt actuator 81 that tilts the entire substrate stage 2 including the substrate holding surface 2a, which is the substrate holding surface. The substrate holding surface tilt actuator 81 is a tilt adjustment device that adjusts the tilt of the stage surface 2a. Fig. 22 is a diagram showing the configuration of the actuator 80 shown in Fig. 21. As shown in Fig. 22, the three actuators 80 are connected by They are arranged around the axis L of the substrate stage 2 at equal intervals. Each stage motor 3 can be constituted by a combination of a ball screw mechanism and a servo motor. Each actuator 80 is configured to move the stage motor 3 up and down. Therefore, the three actuators 80 can tilt the substrate stage 2 at a desired angle in a desired direction.

FIG. 23 is a diagram showing an example of the detailed configuration of the actuator 80 . The three actuators 80 are connected to the stage motor 3 through the support member 76 . The stage motor 3 is fixed to the support member 76 . The three actuators 80 are connected to the support member 76 so as to be tiltable. Each actuator 80 is constituted by a combination of a ball screw mechanism 84 and a servo motor 85 .

The three actuators 80 are connected to the motion control unit 86 , and the motions of the actuators 80 are controlled by the motion control unit 86 . The processing unit 40 is connected to the motion control unit 86 , and information on the relative angle between the stage surface 2 a and the pressing surface 11 a calculated by the processing unit 40 is sent to the motion control unit 86 . The operation control unit 86 operates the three actuators 80 to adjust the inclination of the substrate stage 2 until the calculated relative angle becomes substantially zero.

The sensor 30 measures the heights of three points on the stage surface (substrate holding surface) 2a of the substrate stage 2, and the three actuators 80 are operated while the relative angle between the stage surface 2a and the pressing surface 11a is substantially The inclination of the substrate stage 2 is adjusted so that the top becomes 0.

In one embodiment, four or more actuators 80 may be arranged around the axis L of the substrate stage 2 . In addition, in one embodiment, as shown in FIG. 24 , two actuators 80 and one ball joint 82 may be arranged around the axis L of the substrate stage 2 . The ball joint 82 is a device capable of tilting the supported object in all directions while supporting a load. In the example shown in FIG. 24, two actuators 80 and one ball joint 82 constitute a substrate holding surface tilting actuator for tilting the entire substrate stage 2 including the substrate holding surface 2a including the substrate holding surface. Actuator 81.

Fig. 25 is a plan view of the polishing apparatus shown in Fig. 21. A reference plate 92 is fixed to the first support shaft 51 through a connecting arm 90 . More specifically, one end of the connection arm 90 is fixed to the first support shaft 51 , and the other end of the connection arm 90 is fixed to the reference plate 92 . The reference plate 92 is located outside the stage surface 2a. The reference plate 92 has a flat upper surface, and the upper surface constitutes a reference surface 92a used for calibration of the sensor 30 , ie, the above-mentioned zero reset of the sensor 30 . In the present embodiment, the reference plane 92a is a horizontal plane.

In addition to the polishing head moving device 41 (hereinafter referred to as the first polishing head moving device 41 ) that moves the polishing head 10 and the reference plate 92 in the first direction D, the polishing apparatus is provided with the polishing head 10 and the reference plate 92 for moving the polishing head 10 and the reference plate 92 . The second polishing head moving device 95 that moves in the second direction F perpendicular to the first direction D. In the present embodiment, the second polishing head moving device 95 is constituted by a combination of a ball screw mechanism and a servo motor, but other structures may be provided.

The reel motors 17 and 18 , the tape feeding device 20 (see FIG. 3 ), and the guide rollers 21 and 22 are held by a frame 97 which is fixed to the base plate 47 . The first polishing head moving device 41 is also fixed to the base plate 47 . The bottom plate 47 is connected to the second polishing head moving device 95 , and the bottom plate 47 is moved in the second direction F by the second polishing head moving device 95 . Therefore, the grinding head 10 , the reference plate 92 , the unwinding reel 14 , the winding reel 15 , the reel motors 17 and 18 , the tape feeding device 20 , and the guide rollers 21 and 22 connected to the common bottom plate 47 The system is moved in the second direction F by the second polishing head moving device 95 .

When the sensor 30 is reset to the zero position, as shown in FIG. 26, the second grinding head moving device 95 makes the grinding head 10, the reference plate 92, the unwinding reel 14, the rewinding reel 15, The reel motors 17 and 18 , the tape feeding device 20 , and the guide rollers 21 and 22 move until the reference surface 92 a of the reference plate 92 is positioned below the three sensors 30 . The sensor 30 measures the heights of three points on the reference plane 92 a and sends the measured values of the heights to the processing unit 40 . The processing unit 40 resets the measured values of the heights of the three points on the reference plane 92a to zero. detect After the zero position reset of the device 30 is completed, as shown in FIG. 25, the reference plate 92 is positioned outside the stage surface 2a, and the second polishing head moving device 95 is used until the polishing head 10 returns to the original polishing position. The grinding head 10 , the reference plate 92 , the unwinding reel 14 , the winding reel 15 , the reel motors 17 , 18 , the tape feeding device 20 , and the guide rollers 21 , 22 are moved.

Hereinafter, the flow of the step of making the inclination of the stage surface 2a and the inclination of the pressing surface 11a match will be described with reference to the flowcharts of FIGS. 27 and 28. FIG. In step 1 , the second polishing head moving device 95 moves the polishing head 10 and the reference plate 92 until the reference surface 92 a of the reference plate 92 is positioned below the three sensors 30 . In step 2, the three sensors 30 measure the heights of three points on the reference surface 92a of the reference plate 92, and the processing unit 40 measures the relative positions of the three sensors 30 based on the heights of the three points as described above, Determine the XYZ coordinate system. In step 3, the processing unit 40 resets the sensor 30 to zero. In step 4, the second polishing head moving device 95 moves the polishing head 10 and the reference plate 92 until the reference plate 92 is positioned outside the stage surface 2a.

In step 5, the three sensors 30 measure the heights of three points in the area (for example, refer to R1 in FIG. 10) in the stage surface 2a. In step 6, the processing unit 40 calculates the inclination of the area from the positions (coordinates) of the three points in the area. In step 7, steps 5 and 6 are repeated until all the inclinations of the predefined complex regions R1 to R8 (see FIG. 10) are calculated. In step 8 , the processing unit 40 calculates the average of the inclinations of the plurality of regions R1 to R8 , designates the average of the inclinations as the inclination of the stage surface 2 a , and stores it in the memory device 40 a of the processing unit 40 .

As shown in FIG. 28 , in Step 9 , the target plate 71 is attached to the pressing surface 11 a of the pressing member 11 . In step 10 , the sensor 30 measures the heights of three points on the target plate 71 . In step 11 , the processing unit 40 calculates the inclination of the pressing surface 11 a from the positions (coordinates) of three points on the target plate 71 . in step 12, the target plate 71 is removed by the pressing member 11. In step 13, the processing unit 40 calculates the relative angle between the stage surface 2a and the pressing surface 11a from the inclination of the stage surface 2a and the inclination of the pressing surface 11a.

In step 14, while the sensor 30 measures the heights of three points on the stage surface 2a, the three actuators 80 are actuated so that the relative angle between the stage surface 2a and the pressing surface 11a becomes substantially zero. Adjust the inclination of the stage surface 2a. In step 15, the bracket 35 is removed together with the sensor 30 from the fixing post 36. In step 16, the substrate W to be polished is placed on the stage surface 2a in a state in which the center thereof coincides with the axis L of the substrate stage 2. As shown in FIG. In step 17, the substrate W is held on the stage surface 2a by vacuum suction or the like, and the stage surface 2a and the substrate W are rotated about the axis L of the substrate stage 2 as a center. A liquid such as pure water is supplied to the center of the rotating substrate W. In step 18, in a state where the pressing surface 11a and the stage surface 2a are parallel, the pressing member 11 presses the polishing tape 7 against the peripheral edge (in this embodiment, the top edge portion) of the substrate W, and the polishing tape 7 The tie grinds the peripheral portion in the presence of a liquid.

The protrusion 72 having the upper surface 72a parallel to the pressing surface 11a shown in Fig. 19 can also be applied to the embodiment shown in Fig. 21.

FIG. 29 is a diagram showing an embodiment in which the actuator 80 is connected to the polishing head 10 instead of the substrate holding portion 1 . The configuration of the present embodiment which is not particularly described is the same as the configuration shown in FIG. 19, and thus the repeated description is omitted. The three actuators 80 for tilting the entire polishing head 10 are connected to the installation block 48 through the support member 76 . The setting block 48 is fixed to the support member 76 . The three actuators 80 are connected to the support member 76 so as to be tiltable. The arrangement of the actuators 80 is the same as that shown in FIG. 22 , and the configuration of each actuator 80 is the same as that shown in FIG. 23 . In the present embodiment, the first tilt mechanism 60 and the second tilt mechanism 69 may be omitted.

The three actuators 80 are connected to the motion control unit 86 , and the motions of the actuators 80 are controlled by the motion control unit 86 . The above-mentioned processing unit 40 is connected to the motion control unit 86 , and the processing unit 40 Information on the calculated relative angle between the stage surface 2 a and the pressing surface 11 a is sent to the operation control unit 86 . The operation control unit 86 operates the three actuators 80 to adjust the inclination of the pressing member 11 until the calculated relative angle becomes substantially zero.

The sensor 30 measures the heights of three points on the upper surface 72a of the protruding portion 72, and operates the three actuators 80 to adjust the pressing so that the relative angle between the stage surface 2a and the pressing surface 11a becomes substantially zero. The inclination of the pressing surface 11a of the member 11. In the present embodiment, the three actuators 80 constitute the pressing member tilting actuator 87 that tilts the entire grinding head 10 including the pressing member 11 . The pressing member tilting actuator 87 constitutes an inclination adjustment device that adjusts the inclination of the pressing surface 11 a of the pressing member 11 . Similar to the embodiment shown in FIG. 24 , the pressing member tilting actuator 87 may include two actuators 80 and one ball joint 82 .

The pressing member tilting actuator 87 shown in FIG. 29 can also be applied to the embodiment described with reference to the second to fourth figures.

Fig. 30 is a side view schematically showing still another embodiment of the polishing apparatus. The polishing apparatus of the present embodiment is an apparatus for polishing the surface (front side or back side) of a substrate such as a wafer. A substrate holding portion 111 , and a polishing head 150 for polishing the first surface A1 of the substrate W held by the substrate holding portion 111 are provided. The polishing head 150 is arranged on the upper side of the substrate W held by the substrate holding portion 111 .

In one embodiment, the first surface A1 of the substrate W is the back side of the substrate W on which no element is formed, or where no element is to be formed, that is, a non-element surface. The surface on the opposite side, that is, the second surface A2 of the substrate W, is the surface side of the substrate W on which the element is formed or the element is to be formed, that is, the element surface. In one embodiment, the first surface A1 of the substrate W is the front surface (device surface) of the substrate W, and the second surface A2 of the substrate W is the back surface (non-device surface) of the substrate W. As an example of the non-device surface, that is, the back surface, the silicon surface is cited. exist In the present embodiment, the substrate W is held horizontally by the substrate holding portion 111 in a state where the first surface A1 thereof faces upward. The first surface A1 is the surface to be polished that is polished by the polishing device.

The board holding portion 111 is fixed to the upper surface of the bottom plate 112 . The substrate holding portion 111 includes a plurality of suction pads 114 that hold the peripheral portion of the substrate W, and an annular hollow motor (suction pad motor) 116 that rotates the substrate W through the suction pads 114 . The suction cup 114 is fixed to the hollow motor 116 , and is rotated by the hollow motor 116 around the axis CP of the substrate holding portion 111 . The substrate W is held horizontally by the suction pads 114 . The plurality of chucks 114 are arranged around the axis CP of the substrate holding portion 111 , and are located at the same distance from the axis CP of the substrate holding portion 111 . When the substrate W is held by the plurality of chucks 114 , the center point of the substrate W is positioned on the axis CP of the substrate holding portion 111 .

All the chucks 114 holding the substrate W are integrally rotated around the axis CP of the substrate holding portion 111 , that is, the axis of the substrate W, by the hollow motor 116 . In one embodiment, the substrate holding portion 111 may be provided with a plurality of rollers that can rotate around its own axis instead of the suction cup 114 . By the substrate holding part 111 including the plurality of rollers, the peripheral edge of the substrate is held by the rollers, and each roller rotates around its own axis, whereby the substrate rotates around its axis.

Above the substrate W held by the substrate holding portion 111 , a cleaning liquid supply nozzle 118 for supplying a cleaning liquid (for example, pure water) to the first surface A1 of the substrate W is arranged. The cleaning liquid supply nozzle 118 is connected to a cleaning liquid supply source (not shown). The cleaning liquid supply nozzle 118 is disposed toward the center of the substrate W. As shown in FIG. The cleaning liquid is supplied to the center of the substrate W by the cleaning liquid supply nozzle 118 , and the cleaning liquid is spread on the first surface A1 of the substrate W by centrifugal force.

The grinding head 150 is connected with the head shaft 120 . The head shaft 120 is connected to a head rotation mechanism 122 that rotates the polishing head 150 around its axis HP. In addition, an air cylinder 125 serving as a load applying means for applying a downward load to the grinding head 150 is connected to the head shaft 120 . Grinding head 150 series has There are a plurality of pressing members 155 for pressing the plurality of polishing tools 130 against the first surface A1 of the substrate W. The polishing head 150 is provided with a housing 126 , and the pressing member 155 is accommodated in the housing 126 . The plurality of grinding tools 130 are held by the grinding head 150 , and the back side of the grinding tools 130 is in contact with the pressing surface 155 a of the pressing member 155 . In the thirtieth drawing, only two grinding tools 130 and two pressing members 155 are drawn, but in this embodiment, three grinding tools 130 and three pressing members 155 are provided.

FIG. 31 is a bottom view of the grinding head 150 shown in FIG. 30 . The lower surface of the polishing tool 130 constitutes a polishing surface 130a for polishing the substrate W. The polishing surface 130 a extends in the radial direction of the polishing head 150 . The polishing tools 130 are arranged at equal intervals around the axis HP of the polishing head 150 .

Returning to FIG. 30, the grinding tool 130 protrudes downward from the grinding head 150 . When the polishing head 150 is rotated around the axis HP, the three polishing tools 130 are similarly rotated around the axis HP. The polishing head 150 polishes the first surface A1 by sliding the polishing surface 130a of the polishing tool 130 on the first surface A1 of the substrate W while rotating about the axis HP. In one embodiment, the polishing head 150 may hold two abrasives 130 or four or more abrasives 130 . In addition, in one embodiment, the polishing head 150 may hold only one polishing tool 130 .

In the present embodiment, the polishing tool 130 is constituted by a polishing tape having a polishing layer containing abrasive grains formed on one side thereof. Both ends of the polishing tape are held by two reels (not shown), and the lower surface (polishing surface 130 a ) of the polishing tape extending between the two reels is pressed against the pressing surface 155 a of the pressing member 155 . The first surface A1 of the substrate W. In one embodiment, the abrasive tool 130 can also be sponge, non-woven fabric, foamed polyurethane, or fixed abrasive particles.

Three sensors 30 are arranged inside the substrate holding portion 111 . The structure and arrangement of the sensor 30 are the same as those of the sensor 30 described in the above-mentioned embodiment, so the repeated description is omitted. sensor 30 It is set to measure the height of the grinding|polishing surface 130a of the grinding|polishing tool 130, and the height of the board|substrate holding surface of the board|substrate holding part 111 so that it may mention later.

The three sensors 30 are fixed to the bracket 133 . The bracket 133 is fixed to the sensor lifting device 135 , and the sensor lifting device 135 is fixed to the bottom plate 112 . The three sensors 30 are connected to the sensor lifting device 135 through the bracket 133 . The sensor lifting device 135 is configured to raise and lower the three sensors 30 and the bracket 133 integrally. The sensor lifting device 135 is constituted by, for example, an air cylinder. FIG. 30 shows a state in which the sensor 30 and the bracket 133 are located in the lowered position. The sensor 30 is electrically connected to the processing unit 40 , and the output signal of the sensor 30 is sent to the processing unit 40 . The processing unit 40 includes a memory device 40a and an arithmetic device 40b therein. The detailed configuration and operation of the processing unit 40 are the same as those of the above-described embodiment, and thus the repeated description thereof is omitted.

The head rotation mechanism 122 and the air cylinder 125 are fixed to the swing arm 140 extending horizontally. The head shaft 120 and the grinding head 150 are rotatably supported on one end of the swing arm 140 . The other end of the swing arm 140 is fixed to the arm support shaft 141 . The arm support shaft 141 extends vertically, and the lower part of the arm support shaft 141 is connected to the arm rotation mechanism 143 . The arm rotation mechanism 143 is composed of a motor, a speed reduction mechanism, and the like, and is configured to rotate the arm support shaft 141 at a predetermined angle around its axis SP. When the arm rotation mechanism 143 rotates the arm support shaft 141 , the polishing head 150 and the turning arm 140 turn around the arm support shaft 141 . More specifically, the polishing head 150 moves between a polishing position (described later) for polishing the substrate W, a position above the sensor 30 , and a retracted position outside the substrate holding portion 111 . FIG. 30 shows a state in which the grinding head 150 is positioned above the sensor 30 .

The polishing head 150 has a size smaller than that of the substrate W. As shown in FIG. The axis HP of the polishing head 150 is deviated from the axis CP of the substrate holding portion 111 . Therefore, the polishing head 150 is eccentric to the substrate W held by the substrate holding portion 111 . The polishing head 150 is positioned on the axis CP of the substrate holding portion 111 .

As shown in FIG. 30, the polishing apparatus includes a pressing member tilting actuator 87 that inclines the entirety of the polishing head 150 including the pressing member 155. The pressing member tilting actuator 87 includes three actuators 80 , and each actuator 80 is constituted by a combination of a ball screw mechanism 84 and a servo motor 85 . The three actuators 80 are connected to the motion control unit 86 , and the motions of the actuators 80 are controlled by the motion control unit 86 . The processing unit 40 is connected to the operation control unit 86, and the information of the relative angle between the substrate holding surface of the substrate holding unit 111 and the pressing surface 155a of the pressing member 155 calculated by the processing unit 40 is sent to the operation control unit. 86. The operation control unit 86 operates the three actuators 80 to adjust the inclination of the pressing member 155 until the relative angle calculated above becomes substantially zero.

As in the embodiment shown in FIG. 22 , three actuators 80 are arranged around the axis SP of the arm support shaft 141 . In one embodiment, four or more actuators 80 may be arranged around the axis SP of the arm support shaft 141 . In addition, in one embodiment, similarly to the embodiment shown in FIG. 24 , the pressing member tilting actuator 87 may include two actuators arranged around the axis SP of the arm support shaft 141 . actuator 80 and a ball joint 82.

In the present embodiment, the pressing member tilt actuator 87 is connected to the polishing head 150 via the head shaft 120 , the swing arm 140 , the arm support shaft 141 , the arm rotation mechanism 143 , and the support member 76 . The arm rotation mechanism 143 is fixed to the support member 76 . The three actuators 80 are connected to the support member 76 so as to be tiltable.

The relative position of the sensor 30 held by the bracket 133 and the substrate holding portion 111 is fixed. On the other hand, the pressing member 155 of the polishing head 150 is configured to be able to tilt with respect to the sensor 30 and the substrate holding portion 111 .

The thirty-second figure is a plan view of the grinding head 150 in the grinding position. A hydrostatic support stage 170 is arranged below the polishing head 150 at the polishing position. Hydrostatic support stage 170 series and sensor Similarly, the sensor 30 is disposed inside the substrate holding portion 111 and adjacent to the sensor 30 . The static pressure support stage 170 is arranged on the lower side of the substrate W held by the substrate holding portion 111 .

FIG. 33 is a cross-sectional view showing the hydrostatic support stage 170 shown in FIG. 32 . The grinding head 150 is located at the grinding position, and the hydrostatic support stage 170 is located below the grinding head 150 . The hydrostatic support stage 170 is configured to support the substrate W with the fluid by bringing the fluid into contact with the second surface A2 (surface opposite to the first surface A1 ) of the substrate W held by the chuck 114 . The static pressure support stage 170 has a substrate support surface 170 a close to the second surface A2 of the substrate W held by the chuck 114 . The substrate support surface 170a of the present embodiment is circular, but may have a quadrangle or other shapes.

The static pressure support stage 170 is further provided with a plurality of fluid discharge ports 172 formed on the substrate support surface 170a, and a plurality of fluid supply passages 174 connected to the plurality of fluid discharge ports 172, respectively. The fluid supply path 174 is connected to an unillustrated fluid supply source. The flow rate of the fluid passing through each fluid supply passage 174 is adjusted by a flow rate control valve (not shown). In this embodiment, three fluid discharge ports 172 are provided. In one embodiment, the plurality of fluid discharge ports 172 may be a plurality of openings uniformly distributed over the entire substrate support surface 170a.

As shown in FIG. 33 , the static pressure support stage 170 is connected to the stage elevating mechanism 175 . The stage elevating mechanism 175 is fixed to the upper surface of the bottom plate 112 . By the stage raising and lowering mechanism 175, the static pressure support stage 170 is raised to the position where the substrate support surface (upper surface) 170a thereof is close to the lower surface (second surface A2) of the substrate W. As shown in FIG. The static pressure support stage 170 is arranged below the substrate W held by the substrate holding portion 111 , and the substrate support surface 170 a is slightly distant from the second surface A2 of the substrate W. As shown in FIG.

A fluid (eg, a liquid such as pure water) is supplied to the plurality of fluid discharge ports 172 through the fluid supply passage 174, and the space between the substrate support surface 170a and the second surface A2 of the substrate W is filled with the fluid. The substrate W is supported by the fluid existing between the substrate support surface 170a and the second surface A2 of the substrate W hold. The substrate W and the static pressure support stage 170 are kept in non-contact. In one embodiment, the clearance between the substrate W and the static pressure support stage 170 is set to 50 μm to 500 μm.

The static pressure support stage 170 is supported on the second surface A2 of the substrate W through a fluid in a non-contact manner. Therefore, when elements are formed on the second surface A2 of the substrate W, the static pressure support stage 170 can support the substrate W without destroying the elements. As the fluid used in the hydrostatic support stage 170, a liquid such as pure water as an incompressible fluid, or a gas such as air or nitrogen as a compressible fluid may be used. When pure water is used, as a fluid supply source connected to the fluid supply path 174, a pure water supply line installed in a factory where a polishing apparatus is installed can be used.

The lower surface of the polishing head 150 and the substrate support surface 170a of the static pressure support stage 170 are arranged concentrically. In addition, the lower surface of the polishing head 150 and the substrate support surface 170a of the static pressure support stage 170 are arranged symmetrically with respect to the substrate W. As shown in FIG. That is, the lower surface of the polishing head 150 and the substrate supporting surface 170 a of the static pressure support stage 170 are arranged to sandwich the substrate W, and the load applied to the substrate W by the polishing head 150 is directly below the polishing head 150 . It is supported by the hydrostatic support stage 170 . Therefore, the polishing head 150 can apply a large load to the first surface A1 of the substrate W.

Next, the operation of the polishing apparatus will be described. The polished substrate W is delivered to the substrate holding unit 111 by a transfer robot (not shown). The substrate W is held by the suction cup 114 of the substrate holding portion 111 with the first surface A1 facing upward, and is rotated around the axis of the substrate W by the hollow motor 116 . A fluid (for example, a liquid such as pure water) is supplied to the plurality of fluid discharge ports 172 through the fluid supply passage 174, and the space between the substrate support surface 170a of the hydrostatic support stage 170 and the second surface A2 of the substrate W is filled with fluid. be filled. The substrate W is supported by the fluid flowing between the substrate support surface 170a and the second surface A2 of the substrate W. As shown in FIG.

The cleaning liquid supply nozzle 118 supplies the cleaning liquid to the center of the substrate W, and the cleaning liquid spreads on the first surface A1 of the substrate W by centrifugal force. The head rotation mechanism 122 rotates the polishing head 150 around its axis HP. Next, the air cylinder 125 moves the rotating polishing head 150 toward the first surface A1 of the substrate W, and the pressing surface 155a of the pressing member 155 presses the polishing surface 130a of the polishing tool 130 against the first surface A1 of the substrate W. In a state where the cleaning liquid exists on the first surface A1 of the substrate W, the polishing tool 130 is slidably attached to the first surface A1 of the substrate W to polish the first surface A1.

As in the above-described embodiment, before the substrate W is polished, the pressing surface 155a of the pressing member 155 is adjusted to be pressed by the pressing member tilting actuator 87 so that the pressing surface 155a of the pressing member 155 is parallel to the substrate holding surface of the substrate holding portion 111. The inclination of the face 155a. More specifically, the sensor 30 measures the heights of three points on the substrate holding surface of the substrate holding portion 111 and the heights of three points on the pressing surface 155 a of the pressing member 155 , and the processing portion 40 calculates the substrate holding portion 111 The inclination of the substrate holding surface of the substrate holding portion 111 and the inclination of the pressing surface 155a of the pressing member 155 are calculated based on the inclination of the substrate holding surface of the substrate holding portion 111 and the inclination of the pressing surface 155a of the pressing member 155, and the substrate holding surface of the substrate holding portion 111 is calculated. The relative angle to the pressing surface 155a. The processing unit 40 transmits the calculated relative angle to the motion control unit 86 . Next, the operation control unit 86 instructs the pressing member tilting actuator 87 to actuate the pressing member tilting actuator 87 so that the relative angle becomes substantially 0, and adjust the inclination of the polishing head 150 including the pressing member 155 .

Here, the substrate holding surface of the substrate holding portion 111 will be described with reference to Fig. 34(a) and Fig. 34(b). The substrate W is held on the substrate holding surface of the substrate holding portion 111 . The substrate holding surface of the substrate holding portion 111 is a plane formed by a plurality of substrate contact points of the substrate holding portion 111 that determine the inclination (posture) of the substrate W when held in the substrate holding portion 111 . In the embodiment shown in FIG. 34(a), the tilt of the substrate W is determined by the substrate contact points 114a of the plurality of suction cups 114. FIG. Therefore, as shown in Fig. 34(b), the substrate holding surface of the substrate holding portion 111 is composed of plural bases including plural suction pads 114. The plane (imaginary plane) of the board contact point 114a. In the above-described embodiment shown in FIGS. 2 to 4 , the substrate holding surface of the substrate holding portion 1 is the stage surface 2 a of the substrate stage 2 .

The heights of three points on the substrate holding surface were measured by the sensor 30 as follows. As shown in FIG. 35 , the arm rotation mechanism 143 moves the polishing head 150 to a retracted position outside the substrate holding portion 111 . Next, a dummy substrate 160 simulating the polished substrate W is held on the plurality of chucks 114 . The dummy substrate 160 is a dummy structure having an outer edge of the same shape and size as the substrate W, and has a flat surface 160a. Cuts such as notches or orientation planes may not be formed in the dummy substrate 160 . The dummy substrate 160 may be formed of metal or hard resin, or may be another substrate having the same shape and size as the substrate W to be polished.

The peripheral portion of the dummy substrate 160 is supported by the plurality of substrate contact points 114 a of the plurality of suction cups 114 . The lower surface of the dummy substrate 160 is a flat surface 160a, and the flat surface 160a is consistent with the substrate holding surface including the plurality of substrate contact points 114a.

As shown in FIG. 36, the sensor lifting device 135 raises the three sensors 30 to a predetermined measurement position. The three sensors 30 measure the heights of three points on the flat surface 160a of the dummy substrate 160, that is, on the substrate holding surface. The positions of the three points correspond to the positions of the three sensors 30 . The three sensors 30 send three output signals respectively indicating the measured heights to the processing unit 40 . The processing unit 40 specifies the positions of the three points on the substrate holding surface from the relative positions of the three received output signals and the three sensors 30 . The processing unit 40 calculates the inclination of the substrate holding surface from the positions (coordinates) of three points on the substrate holding surface. The calculated inclination of the substrate holding surface is stored in the memory device 40 a of the processing unit 40 . After the heights of three points on the substrate holding surface are measured, the dummy substrate 160 is removed from the substrate holding portion 111 .

The inclination of the substrate holding surface is calculated in the same manner as in the measurement of the inclination of the stage surface 2a in the above-described embodiment. The processing unit 40 can also perform zero reset of the three sensors 30 . that is, The measured values of the heights of three points on the flat surface 160 a (ie, the substrate holding surface) of the dummy substrate 160 obtained by the three sensors 30 can also be reset to zero.

As in the above-described embodiment, the heights of three points on the substrate holding surface can also be measured in plural areas within the flat surface 160 a of the dummy substrate 160 . Specifically, while intermittently rotating the dummy substrate 160 on the substrate holding portion 111 , the heights of three points on the substrate holding surface are measured in plural areas within the flat surface 160 a of the dummy substrate 160 , and the plural areas are calculated. The inclination of the flat surface 160a of the virtual substrate 160 is calculated, the average of the inclinations of the calculated plural regions is calculated, and the calculated average is determined as the inclination of the substrate holding surface. The plurality of regions in the flat surface 160a of the dummy substrate 160 are preferably arranged around the center of the flat surface 160a (that is, the center of the substrate holding surface) at equal intervals.

Next, the height of the polishing surface (lower surface) 130 a of the polishing tool 130 is measured by the sensor 30 . FIG. 37 is a diagram showing a state in which the sensor 30 measures the height of the polishing surface (lower surface) 130 a of the polishing tool 130 . The arm rotation mechanism 143 moves the polishing head 150 to a position above the three sensors 30 . Next, the sensor 30 is raised to a predetermined measurement position by the sensor lifting device 135 , and the three sensors 30 measure the heights of three points on the polishing surface 130 a of the three polishing tools 130 , respectively. The back side of the grinding tool 130 is supported by the pressing surface 155a of the pressing member 155 , so the grinding surface 130a of the grinding tool 130 is parallel to the pressing surface 155a of the pressing member 155 . The three sensors 30 measure the heights of three points on the polishing surfaces 130a of the three abrasives 130, respectively, and send three output signals representing the measured heights to the processing unit 40, respectively.

The processing unit 40 calculates the inclination of the polishing surfaces 130a of the three polishing tools 130 from the relative positions of the three received output signals and the three sensors 30, as in the above-described embodiment. The inclination of the polishing surfaces 130 a of the three polishing tools 130 corresponds to the inclination of the pressing surfaces 155 a of the three pressing members 155 .

Next, the processing unit 40 calculates the base from the inclination of the substrate holding surface of the substrate holding unit 111 and the inclination of the polishing surface 130 a of the polishing tool 130 (that is, the inclination of the pressing surface 155 a of the pressing member 155 ). The relative angle between the board holding surface of the board holding portion 111 and the pressing surface 155 a of the pressing member 155 . The processing unit 40 transmits the calculated relative angle to the motion control unit 86 . Next, the operation control unit 86 instructs the pressing member tilting actuator 87 to actuate the pressing member tilting actuator 87 so that the relative angle becomes substantially 0, and adjust the inclination of the polishing head 150 including the pressing member 155 . The polishing surface 130 a of the polishing tool 130 held by the tilt-adjusted polishing head 150 is substantially parallel to the substrate holding surface of the substrate holding portion 111 .

Next, the arm rotation mechanism 143 moves the polishing head 150 to a retracted position outside the substrate holding portion 111 again. The substrate W is held by the suction pads 114 of the substrate holding portion 111 , and is rotated around the axis of the substrate W by the hollow motor 116 . The arm rotation mechanism 143 moves the polishing head 150 to a polishing position above the hydrostatic support stage 170 . A fluid (for example, a liquid such as pure water) is supplied to the plurality of fluid discharge ports 172 through the fluid supply passage 174, and the space between the substrate support surface 170a of the hydrostatic support stage 170 and the second surface A2 of the substrate W is filled with fluid. full. The substrate W is supported by the fluid flowing between the substrate support surface 170a and the second surface A2 of the substrate W. As shown in FIG.

The cleaning liquid supply nozzle 118 supplies the cleaning liquid to the center of the substrate W, and the cleaning liquid spreads on the first surface A1 of the substrate W by centrifugal force. The head rotation mechanism 122 rotates the polishing head 150 around its axis HP. Next, the air cylinder 125 moves the rotating polishing head 150 toward the first surface A1 of the substrate W, and the pressing surface 155a of the pressing member 155 presses the polishing surface 130a of the polishing tool 130 against the first surface A1 of the substrate W. In a state where the cleaning liquid exists on the first surface A1 of the substrate W, the polishing tool 130 is slidably attached to the first surface A1 of the substrate W to polish the first surface A1.

According to this embodiment, the polishing surface 130 a of the polishing tool 130 is substantially parallel to the substrate holding surface of the substrate holding portion 111 . Therefore, the polishing surface 130a of the polishing tool 130 is slidably attached to the first surface A1 of the substrate W in a state of being substantially parallel to the first surface A1 of the substrate W.

The inclination of the polishing surface 130 a of the polishing tool 130 corresponds to the inclination of the pressing surface 155 a of the pressing member 155 . Therefore, the inclination of the pressing surface 155a of the pressing member 155 can be calculated from the heights of three points on the grinding surface 130a of the polishing tool 130 as described above. In one embodiment, as shown in FIG. 38, a sensor target jig 180 can also be installed on the bottom of the polishing head 150, instead of the height of three points on the polishing surface 130a of the polishing tool 130, and the The inclination of the pressing surface 155 a of the pressing member 155 is calculated from the heights of three points on the flat surface 180 a of the sensor target jig 180 .

The sensor target fixture 180 shown in FIG. 38 is detachably mounted on the bottom of the grinding head 150 . The lower surface of the sensor target jig 180 forms a flat surface 180 a, and the flat surface 180 a is parallel to the pressing surface 155 a of the pressing member 155 . The sensor target jig 180 has a bottom wall 181 covering the entirety of the three grinders 130 of the grinders 130 a , and a peripheral wall 182 connected to the edge of the bottom wall 181 . The peripheral wall 182 extends upward from the bottom wall 181 and surrounds the side surface of the grinding head 150 . The inner surface of the peripheral wall 182 has substantially the same shape and size as the side surface of the polishing head 150 , and the side surface of the polishing head 150 is fitted into the inner surface of the peripheral wall 182 . The lower surface of the bottom wall 181 is a flat surface 180 a that is parallel to the pressing surface 155 a of the pressing member 155 . The sensor target jig 180 can be made of metal, hard resin or the like.

Fig. 39(a) is a diagram showing an example of a fastening mechanism for attaching and detaching the sensor target jig 180 to the grinding head 150, and Fig. 39(b) is a diagram showing an example of a fastening mechanism. A diagram of another example of a solid mechanism. In the example shown in Fig. 39(a), a through hole 182a is formed in the peripheral wall 182 of the sensor target jig 180 . A screw hole 184 is formed on the side surface of the grinding head 150 . The screw 185 is screwed into the screw hole 184 of the grinding head 150 through the through hole 182 a of the sensor target fixture 180 , whereby the sensor target fixture 180 is fixed to the grinding head 150 . By removing the screw 185 from the grinding head 150 , the sensor target fixture 180 can be removed from the grinding head 150 . In the example shown in Figure 39(a), it is used to jig the sensor target The fastening mechanism 180 , which is detachably mounted on the grinding head 150 , is constituted by a through hole 182 a , a screw 185 , and a screw hole 184 .

In the example shown in Figure 39(b), a magnet 187 is fixed on the bottom surface of the grinding head 150 , and a magnet 188 is also fixed on the upper surface of the bottom wall 181 of the sensor target jig 180 . If the side surface of the grinding head 150 is fitted to the inner surface of the peripheral wall 182 of the sensor target jig 180, the magnet 187 on the grinding head 150 will be drawn closer to the magnet 188 on the sensor target jig 180, thereby The sensor target jig 180 is fixed to the grinding head 150 . In the example shown in FIG. 39(b), the fastening mechanism for attaching and detaching the sensor target jig 180 to the grinding head 150 is a magnet 187 fixed to the grinding head 150. , and a magnet 188 fixed on the sensor target fixture 180 . If the sensor target jig 180 is made of magnetic material, the magnet 188 fixed on the sensor target jig 180 can also be omitted. At this time, the fastening mechanism is constituted by the magnet 187 fixed to the polishing head 150 .

The fastening mechanism is not limited to the example shown in Fig. 39(a) and Fig. 39(b). For example, the fastening mechanism may also be constituted by a latch such as a snap lock. Either the magnet 187 or the magnet 188 shown in Figure 39(b) can also be replaced with a magnetic material.

FIG. 40 is a diagram showing a state when the heights of three points on the flat surface 180 a of the sensor target jig 180 are measured by the sensor 30 . The sensor lifting device 135 raises the three sensors 30 to a predetermined measurement position. The three sensors 30 measure the heights of three points on the flat surface 180 a of the sensor target jig 180 . The positions of the three points correspond to the positions of the three sensors 30 . The three sensors 30 send three output signals respectively indicating the measured heights to the processing unit 40 .

The processing unit 40 specifies the positions of the three points on the flat surface 180 a of the sensor target jig 180 based on the received three output signals and the relative positions of the three sensors 30 . The processing unit 40 calculates the sensor target jig 180 from the positions (coordinates) of three points on the flat surface 180 a of the sensor target jig 180 The inclination of the flat surface 180a. The inclination of the flat surface 180 a of the sensor target jig 180 corresponds to the pressing surface 155 a of the pressing member 155 . The calculated inclination of the flat surface 180 a of the sensor target jig 180 , that is, the inclination of the pressing surface 155 a of the pressing member 155 is stored in the memory device 40 a of the processing unit 40 . After the heights of three points on the flat surface 180 a of the sensor target jig 180 are measured, the sensor target jig 180 is removed from the polishing head 150 .

In the embodiment described with reference to FIGS. 30 to 40, in order to tilt the entire grinding head 150 including the pressing member 155, the pressing member tilting actuator 87 is provided. In one embodiment, as shown in FIG. 41 , a substrate holding surface tilt actuator 81 that tilts the entire substrate holding portion 111 may be provided instead of the pressing member tilt actuator 87 . The configuration of the substrate holding surface tilting actuator 81 is the same as that of the substrate holding surface tilting actuator 81 described with reference to FIGS. 22 to 24, and thus repeated description thereof is omitted. The three actuators 80 of the substrate holding surface tilt actuator 81 are tiltably coupled to the base plate 112 . The three actuators 80 are arranged around the axis CP of the substrate holding portion 111 .

The sensor lifting device 135 supporting the sensor 30 is not fixed to the bottom plate 112 and is not in contact with the substrate holding portion 111 . In the present embodiment, the sensor lifter 135 is fixed to an installation table 190 extending through a hole formed in the bottom plate 112 , and the installation table 190 is fixed to the installation surface 191 . The entire system of the substrate holding portion 111 is tilted independently of the sensor 30 and the sensor lifting device 135 . That is, the entire system of the substrate holding portion 111 can be tilted by the substrate holding surface tilting actuator 81, while the postures of the sensor 30 and the sensor lifting device 135 remain unchanged.

Before polishing the substrate W, the substrate holding surface tilt actuator 81 is used to adjust the inclination of the substrate holding portion 111 so that the substrate holding surface of the substrate holding portion 111 and the pressing surface 155a of the pressing member 155 are parallel. More specifically, the sensor 30 measures the height of the substrate holding surface of the substrate holding portion 111 and the height of the pressing surface 155 a of the pressing member 155 , and the processing unit 40 calculates the substrate holding surface of the substrate holding portion 111 . and the inclination of the pressing surface 155a of the pressing member 155, and the substrate holding surface and pressing surface 155a of the substrate holding portion 111 are calculated from the inclination of the substrate holding surface of the substrate holding portion 111 and the inclination of the pressing surface 155a of the pressing member 155 relative angle. The processing unit 40 sends the calculated relative angle to the motion control unit 86 . Next, the operation control unit 86 instructs the substrate holding surface inclination actuator 81 to actuate the substrate holding surface inclination actuator 81 so that the relative angle becomes substantially zero, and adjust the inclination of the substrate holding surface 111 . The substrate holding surface of the substrate holding portion 111 whose inclination has been adjusted is parallel to the polishing surface 130 a of the polishing tool 130 held by the polishing head 150 .

In the embodiments described so far, the polishing head 150 is arranged above the substrate holding surface of the substrate holding portion 111, and the sensor 30 is arranged below the substrate holding surface of the substrate holding portion 111, but the present invention is not limited to in these embodiments. In one embodiment, the sensor 30 may be disposed above the substrate holding surface of the substrate holding portion 111 , and the polishing head 150 may be disposed below the substrate holding surface of the substrate holding portion 111 .

The present invention is not only a polishing device for polishing the top edge of a circular substrate, but can also be applied to a polishing device for polishing the top edge of a quadrangular substrate. In addition, in this specification, "substrate" includes not only semiconductor substrates, glass substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements or micromechanical elements, or partially fabricated integrated circuit. In addition, the substrate may have, for example, a layer containing nickel or cobalt on the surface.

The above-described embodiments are described so that the present invention can be implemented by those skilled in the technical field to which the present invention pertains. The various modifications of the above-described embodiments can be considered by those skilled in the art in this field, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be construed as being within the broadest scope of the technical idea defined by the scope of the claims.

2: Substrate stage

2a: Loading table

11: Press the member

11a: Pressing surface

25: Air cylinder

27: Piston rod

28: Press member holder

30: Sensor

33: Direct moving guide

33a: Movable part

35: Bracket

39: Base Block

40: Processing Department

42: Fixed components

51: 1st support axis

51a: Polygon part

52: Fixed plate

52a: Polygonal hole

52b: Incision

55: 1st screw

57: Eccentric Cam

60: 1st tilt mechanism

62: 2nd support axis

64: 2nd screw

69: 2nd tilt mechanism

Claims (16)

A grinding method, characterized in that: at least three sensors are used to measure the heights of at least three points on a substrate holding surface respectively, and the inclination of the substrate holding surface is calculated according to the output signals of the sensors, and the sensing The device measures the heights of at least three points on the surface parallel to the pressing surface of the pressing member, calculates the inclination of the pressing surface based on the output signal of the sensor, and calculates the relative angle between the substrate holding surface and the pressing surface, After that, the substrate is held on the substrate holding surface, and the inclination of the substrate holding surface or the pressing surface is adjusted so that the relative angle falls within the allowable range, and then the inclination of the substrate holding surface or the pressing surface is adjusted. In the adjusted state, the polishing tool is pressed against the substrate by the pressing surface, thereby starting the polishing of the substrate. A grinding method, characterized in that: at least three sensors are used to measure the heights of at least three points on a substrate holding surface respectively, and the inclination of the substrate holding surface is calculated according to the output signals of the sensors, and the sensing The device measures the heights of at least three points on the surface parallel to the pressing surface of the pressing member, calculates the inclination of the pressing surface based on the output signal of the sensor, and calculates the relative angle between the substrate holding surface and the pressing surface, After that, holding the substrate on the aforementioned substrate holding surface, Here, the polishing tool is pressed against the peripheral edge portion of the substrate using the pressing surface whose inclination is adjusted so that the relative angle falls within the allowable range. The polishing method of claim 1, wherein the step of holding the substrate on the substrate holding surface is a step of holding the substrate on the substrate holding surface whose inclination is adjusted so that the relative angle is within an allowable range . The polishing method according to claim 1, wherein at least three points on the substrate holding surface are at least three points on the outer peripheral portion of the substrate holding surface. A polishing method characterized by: measuring the heights of at least three points in each of a plurality of regions in a substrate holding surface with at least three sensors, calculating the inclination of each of the plurality of regions, and calculating the calculated The average of the inclinations of the plurality of regions, the calculated average is designated as the inclination of the substrate holding surface, and the heights of at least three points on the surface parallel to the pressing surface of the pressing member are measured by the sensors, respectively, according to The output signal of the sensor calculates the inclination of the pressing surface, calculates the relative angle between the substrate holding surface and the pressing surface, and then holds the substrate on the substrate holding surface within the allowable range of the relative angle. In a state in which the inclination of the substrate holding surface or the pressing surface is adjusted, the substrate is polished by pressing a polishing tool against the substrate with the pressing surface. The polishing method according to claim 5, wherein the step of measuring the heights of at least three points in each of the plurality of regions is performed while intermittently rotating the substrate holding surface. The polishing method according to claim 5, wherein the plurality of regions are arranged around the center of the substrate holding surface at equal intervals. The polishing method according to any one of claims 1 to 7, wherein the inclination of the substrate holding surface and the inclination of the pressing surface are represented as vectors on a 3-dimensional coordinate system. A polishing apparatus comprising: a substrate holding part having a substrate holding surface; a pressing member having a pressing member for pressing a polishing tool against a pressing surface of a substrate; measuring the height of at least three points on the substrate holding surface, and the At least 3 sensors with heights of at least 3 points on a surface that is parallel to the surface; based on the output signals of the sensors, calculate the inclination of the substrate holding surface and the inclination of the pressing surface, and calculate the substrate holding surface and the a processing unit for a relative angle of the pressing surface; an inclination adjusting device for adjusting the inclination of the substrate holding surface or the pressing surface; and applying a pressing force to the pressing force in a state where the inclination of the substrate holding surface or the pressing surface is adjusted A pressing device for pressing a member to press the grinding tool against the substrate on the substrate holding surface; the pressing device pushes the grinding tool after adjusting the inclination of the substrate holding surface or the pressing surface by the tilt adjusting device. Press the substrate on the substrate holding surface to start grinding of the substrate. The polishing apparatus according to claim 9, wherein the inclination adjustment device includes a first inclination mechanism and a second inclination mechanism for adjusting the inclination of the pressing surface, and the pressing member is connected to the first inclination mechanism and the second inclination mechanism. The aforementioned second tilt mechanism. A grinding device comprising: A substrate holding part having a substrate holding surface; a pressing member for pressing a polishing tool against a pressing surface of the substrate; measuring the height of at least three points on the substrate holding surface and the surface parallel to the pressing surface At least three sensors with a height of at least three points; based on the output signals of the sensors, the inclination of the substrate holding surface and the inclination of the pressing surface are calculated, and the relative angle between the substrate holding surface and the pressing surface is calculated. a processing unit; an inclination adjustment device for adjusting the inclination of the substrate holding surface or the pressing surface; and after the relative angle is calculated and the inclination of the substrate holding surface or the pressing surface is adjusted, a pressing force is applied to the pressing member to A pressing device for pressing the substrate on the substrate holding surface by the polishing tool; the inclination adjustment device includes a first inclination mechanism and a second inclination mechanism for adjusting the inclination of the pressing surface, and the pressing member is connected to the first inclination Mechanism and said second tilting mechanism; said first tilting mechanism and said second tilting mechanism are respectively provided with a first support shaft and a second support shaft which are perpendicular to each other, and said pressing member can be said first support shaft and said second support shaft Rotation is supported around the axis. The polishing apparatus according to claim 9, wherein the inclination adjusting device is a pressing member tilting actuator for tilting the pressing surface, and the pressing member tilting actuator includes at least two actuators. The polishing apparatus according to claim 9, wherein the tilt adjustment device is a substrate holding surface tilt actuator for tilting the substrate holding surface, and the substrate holding surface tilt actuator includes at least two actuators . The polishing apparatus according to claim 9, wherein the sensor is located above the outer peripheral portion of the substrate holding surface. The polishing apparatus according to claim 9, wherein the sensor is a displacement sensor. The polishing apparatus according to claim 9 of the claimed scope further comprises a bracket for fixing the sensor.

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