KR102235475B1 - Array Tester - Google Patents

Abstract

An array tester according to an embodiment of the present invention includes an array tester body unit including a modulator unit and a modulator mounting unit to which the modulator unit is coupled and fixing the modulator unit, and the modulator mounting unit is the modulator unit. The modulator unit is fixed in a direction coaxial with a direction coupled to the array tester body unit.

Description

Array Tester

The present invention relates to an array tester comprising a modulator mounting unit.

As the information society develops, the demand for display devices is increasing in various forms, and in response to this, in recent years, Liquid Crystal Display (LCD), PDP (Plasma Display Panel), ELD (Electro Luminescent Display), VFD Various flat panel display devices such as (Vacuum Fluorescent Display) have been researched and developed.

Among them, the liquid crystal display device with improved performance by the rapidly developing semiconductor technology is currently excellent in image quality, replacing the existing cathode ray tube (CRT) due to its advantages such as miniaturization, weight reduction, and low power consumption. It is used a lot.

Liquid crystal display, one of the flat panel display devices, is not only small products such as portable mobile phones, personal digital assistants (PDAs), and portable multimedia players (PMPs), but also mid- to large-sized products such as TVs and computer monitors that receive and display broadcast signals. It has been used in various ways.

A liquid crystal display device is a display device capable of displaying a desired image by individually supplying data signals according to image information to liquid crystal cells arranged in a matrix form and adjusting light transmittance of the liquid crystal cells.

In such a liquid crystal display device, when an electric signal is applied between a thin film transistor (hereinafter referred to as TFT) substrate having a plurality of pixel patterns and a color filter substrate having a color filter layer, it is determined whether or not light is transmitted. And a liquid crystal layer.

Such a liquid crystal display device performs a process of testing defects such as disconnection or open circuit of a gate line or data line formed on a TFT substrate during a manufacturing process, and other defects in a circuit on the TFT substrate.

In addition, defects of electrodes formed on the substrate are inspected by an array tester. In addition, the array test apparatus includes a free body unit in which a fix body unit and a modulator unit are combined. The modulator unit includes a modulator electrode for forming an electric field between the substrate electrode and a physical property change part that changes physical properties according to the magnitude of the electric field.

After performing an array test on a portion of the substrate, the modulator unit moves to the next adjacent test position and repeats the array test.

Meanwhile, the array tester according to the prior art vacuum-adsorbs the modulator unit to couple the modulator unit to the prebody unit, and fixes the modulator unit at both sides of the prebody unit.

As the modulator unit is coupled at the side of the prebody unit in the above-described manner, a positional deviation occurs after the modulator unit is coupled to the prebody unit.

In addition, if a position deviation of the modulator unit occurs, the position of the modulator unit must be corrected through a separate additional process.

An object of the present invention is to provide an array tester capable of minimizing a positional deviation of a modulator unit.

Another object of the present invention is to provide an array tester that does not require an additional process for position correction of a modulator unit.

An array tester according to an embodiment of the present invention includes an array tester body unit including a modulator unit and a modulator mounting unit to which the modulator unit is coupled and fixing the modulator unit, and the modulator mounting unit is the modulator unit. The modulator unit is fixed in a direction coaxial with a direction coupled to the array tester body unit.

In addition, in the array tester, the array tester body unit includes a fix body unit and a prebody unit movably coupled to the fix body unit, and the modulator mounting unit is coupled to the prebody unit, and the modulator The unit may include a modulator and a body frame to which the modulator is coupled and covers an outer circumference of the modulator.

In addition, in the array tester, the modulator mounting unit includes a rotational and elevating support portion supporting a lower portion of the body frame, a vacuum absorption portion adsorbing and fixing the body frame, and the body frame is suction-coupled to the vacuum absorption portion. It includes a sensor unit to check whether the state is.

In addition, in the array tester, the rotation and elevation support unit includes a support member for supporting the body frame, and a driving device for rotating or lifting the support member.

In addition, in the array tester, the support member includes a shaft member connected to the driving device, and an extension support member connected to the shaft and extending in a perpendicular direction, and the support member may be formed in a “b” shape as a whole. .

In addition, in the array tester, one side is coupled to the fix body unit, the other side is coupled to the free body unit, further comprising a piezo gap correction unit capable of adjusting the distance between the fix body unit and the free body unit I can.

In addition, in the array tester, the piezo gap correction unit has a first coupling body coupled to the fixbody unit, a second coupling body coupled to the freebody unit, and one side coupled to the first coupling body, and the A piezo actuator coupled to the other side of the second coupling body, and a sensor for detecting a distance between the modulator and the glass panel, the piezo actuator using the information of the distance detected from the sensor, the fixed body unit and the Adjust the distance between the free body units.

In addition, in the array tester, the modulator and the sensor may be positioned on the same surface with respect to a distance direction from the glass panel.

In addition, in the array tester, a plurality of piezo gap correction units may be coupled to the prebody unit and the fix body unit.

In addition, in the array tester, a first damper member fixing part is formed in the free body unit, a second damper member fixing part is formed in the fix body, and one side of the free body unit is coupled to the first damper member fixing part. And, the other side may further include a damper member coupled to the second damper member fixing portion.

In addition, in the array tester, the damper member includes an inner damper member and an outer damper member, the first damper member fixing part includes a first inner damper member fixing part and a first outer damper member fixing part, and the first 1 An outer damper member fixing part is formed at an outer edge of the freebody unit, and the first inner damper member fixing part is formed inside the prebody unit compared to the first outer damper member fixing part, and the second damper The member fixing part includes a second inner damper member fixing part corresponding to the first inner damper member fixing part, and a second outer damper member fixing part corresponding to the first outer damper member fixing part, and the inner damper member The first inner damper member fixing portion and the second inner damper member fixing portion may be coupled, and the outer damper member may be coupled to the first outer damper member fixing portion and the second outer damper member fixing portion.

In addition, in the array tester, when the inner damper member and the outer damper member are respectively coupled to the first inner damper member fixing part and the first outer damper member fixing part, with respect to the direction in which the free body unit is raised and lowered. It can be made to have a height deviation.

In addition, in the array tester, four first outer damper member fixing portions may be formed at the corners of the freebody unit, and three first inner damper member fixing portions may be formed.

In addition, in the array tester, the damper member may be made of fluorine rubber.

Details of other embodiments are included in the detailed description and drawings.

According to the present invention, the positional deviation of the modulator unit is minimized and the test performance is improved.

In addition, according to the present invention, after mounting the modulator unit, an additional step for position correction can be omitted, thereby improving productivity.

It will be fully understood that the embodiments of the technical idea of the present invention can provide various effects not specifically mentioned.

1 is a block diagram schematically showing an array tester according to an embodiment of the present invention.
FIG. 2 is a schematic bottom view of the array tester shown in FIG. 1.
Figure 3 is a schematic exploded perspective view of the array tester shown in Figure 1;
FIG. 4 is a schematic configuration diagram of a modulator mounting unit in the array tester shown in FIG. 1.
5 is a schematic configuration diagram of an exploded state of the modulator unit in the array tester shown in FIG. 2.
6 is a schematic cross-sectional view taken along AA of the array tester shown in FIG. 2.
7 is a flowchart schematically illustrating a method of combining a modulator unit of an array tester according to an embodiment of the present invention.
Fig. 8 is a schematic configuration diagram of a piezo gap adjusting unit in the array tester shown in Fig. 7.
9 is a schematic diagram of a state of use of the piezo gap adjustment unit shown in FIG. 8.
FIG. 10 is a schematic configuration diagram showing a damper member coupled to the prebody unit of the array tester shown in FIG. 2, and FIG. 10A is a perspective view of the prebody unit, and FIG. It is a bottom view of the body unit.
11 is a block diagram schematically showing the damper member coupling structure shown in FIG. 10.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of the presence or addition.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in the present application. Does not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram schematically showing an array tester according to an embodiment of the present invention, and FIG. 2 is a schematic bottom view of the array tester shown in FIG. 1.

As shown, the array tester 1000 is for detecting electrode defects formed on the substrate of the glass panel, and the fix body unit 1100 and the pre-body unit 1200 and the gap correction unit 1300 which are array test body units. ), a modulator unit 1400, and a modulator mounting unit 1500.

More specifically, the modulator unit 1400 is coupled to the prebody unit 1200 to face the glass panel, and the prebody unit 1200 is movable by the gap correction unit 1300 to the fix body unit 1100. Are combined.

The modulator 1410 is coupled to the body frame 1420, and the body frame covers the outer periphery of the modulator. In addition, the body frame 1420 is mounted on the prebody unit 1200 so that the modulator 1410 faces the glass panel.

To this end, the modulator mounting unit 1500 is coupled to the prebody unit 1200, and the modulator unit 1400 is fixed to the prebody unit 1200 by the modulator mounting unit 1500.

Hereinafter, a detailed configuration and operation relationship of the modulator mounting unit will be described in more detail with reference to FIGS. 3 to 6.

FIG. 3 is a schematic exploded perspective view of the array tester shown in FIG. 1, FIG. 4 is a schematic diagram showing a configuration of a modulator mounting unit in the array tester shown in FIG. 1, and FIG. 5 is In the array tester, it is a schematic configuration diagram of a state in which the modulator unit is disassembled. 6 is a schematic A-A cross-sectional view of the array tester shown in FIG. 2.

As shown, the modulator mounting unit 1500 is coupled to the prebody unit 1200 of the array tester 1000, and the modulator unit 1400 is fixed to the prebody unit 1200 by the modulator mounting unit 1500. do.

More specifically, the modulator mounting unit 1500 includes a rotation and elevation support unit 1510, a vacuum adsorption unit 1520, and a sensor unit 1530.

The rotation and elevation support unit 1510 includes a driving device 1511 and a support member 1512. The support member 1512 is coupled to the driving device 1511, and the driving device 1511 rotates or lifts the support member 1512. To this end, the driving device 1511 may include a rotating motor and an elevating motor. In addition, the driving device 1511 may be implemented as a pneumatic drive unit.

The support member 1512 includes a shaft member 1512a connected to the driving device 1511, and an extension support member 1512b connected to the shaft and extending in a perpendicular direction.

In addition, the support member 1512 may have an overall “b” shape.

The vacuum adsorption unit 1520 provides an adsorption force to the body frame 1420 of the modulator unit 1400 and fixes the body frame 1420 to the prebody unit 1200.

In addition, the sensor unit 1530 is for checking whether the modulator unit 1400 is in a state of being adsorbed and coupled to the prebody unit 1200, and is mounted on the prebody unit so as to be adjacent to the vacuum adsorption unit 1520.

The modulator mounting unit according to an embodiment of the present invention is made as described above, and is primarily coupled to the freebody unit 1200 by adsorbing the modulator unit 1400, and a support member of the rotation and elevation support unit 1510 ( 1512) (shown by the arrow R), and raises to support the lower portion of the body frame 1420 of the modulator unit 1400.

At this time, the driving device 1511 rotates the support member 1512 toward the body frame 1420 and raises the support member 1512 to support the lower portion of the body frame 1420.

Accordingly, it is supported in the elevating direction of the modulator unit 1400 (shown by the Y axis in FIG. 10).

7 is a flowchart schematically illustrating a method of combining a modulator unit of an array tester according to an embodiment of the present invention.

As shown, the modulator unit coupling method (S1000) of the array tester includes a modulator unit positioning step (S1100), a modulator unit adsorption step (S1200), and a rotating and lifting support operation step (S1300).

More specifically, the positioning of the modulator unit (S1100) is a step of positioning the modulator unit so as to face the vacuum adsorption unit.

In the modulator unit adsorption step (S1200), the modulator unit is adsorbed and coupled to the prebody unit through a vacuum adsorption unit. At this time, the sensor unit checks the state in which the modulator unit is suction-coupled.

In the operation step (S1300) of the rotation and elevation support unit, when it is confirmed that the modulator unit is adsorbed to the free body unit by the sensor unit, the driving device 1511 of the rotation and elevation support unit 1510 rotates the support member 1512. And raise to support the lower part of the modulator unit.

FIG. 8 is a schematic configuration diagram of a piezo gap adjustment unit in the array tester shown in FIG. 7, and FIG. 9 is a schematic use state diagram of the piezo gap adjustment unit shown in FIG. 8.

The piezo gap correction unit 1300 includes a first coupling body 1310, a second coupling body 1320, a piezo actuator 1330, and a sensor 1340.

The first coupling body 1310 is coupled to the fix body unit 1100 (shown in FIG. 2 ), and the second coupling body 1320 is coupled to the prebody unit 1200.

The first coupling body 1310 is coupled to one side of the piezo actuator 1330, and the second coupling body 1320 is coupled to the other side of the piezo actuator 1330.

Accordingly, relative displacement of the first coupling body 1310 and the second coupling body 1320 occurs due to the displacement of the piezo actuator 1330. In addition, a relative positional displacement of the fix body unit 1100 and the free body unit 1200 occurs due to the relative displacement of the first coupling body 1310 and the second coupling body 1320.

Further, the displacement of the piezo actuator 1330 is 0 to 40 μm, and accordingly, the movable displacement of the free body unit 1200 with respect to the fix body unit 1100 may be 0 to 40 μm.

The sensor 1340 is for measuring a gap between the glass panel and the modulator 1410 and is mounted on the second coupling body 1320.

The sensor 1340 may be mounted on the prebody unit 1200 by the second coupling body 1320 so as to be positioned the same as the modulator 1410 facing the glass panel.

That is, the modulator 1410 and the sensor 1340 may be positioned on the same plane with respect to the direction of the separation distance between the glass panel and the glass panel, which is the gap direction of the modulator (shown by the Y axis in FIG. 10). have.

The piezo gap correction unit 1300 is made as described above, and the piezo actuator 1330 is displaced through the information detected by the sensor 1340, and the first coupling body 1310 and the second coupling body 1320 Is a relative displacement.

In addition, for stable and accurate position adjustment, a plurality of piezo gap correction units 1300 may be mounted on the prebody unit 1200. In addition, FIG. 3 shows an embodiment in which three piezo gap correction units 1300 are mounted on the prebody unit 1200 in a spaced apart state.

FIG. 10 is a schematic diagram illustrating a damper member coupled to the prebody unit of the array tester shown in FIG. 2, and FIG. 10A is a perspective view of the prebody unit, and FIG. 10B is a fix. It is a bottom view of the body unit, and FIG. 11 is a block diagram schematically showing the damper member coupling structure shown in FIG. 10.

As shown, the damper member 1220 is coupled to the free body unit 1200 and the fix body unit 1100 to attenuate vibrations in the elevating direction of the free body unit and the moving direction of the array tester. The damper member may be made of fluorine rubber to prevent foreign matter due to wear.

First damper member fixing parts (Figs. 1211 and 1212) are formed in the free body unit 1200, and second damper member fixing parts 1111 and 1112 are formed in the fix body unit 1100.

One side of the damper member 1220 is coupled to the first damper member fixing portions 1211 and 1212, and the other side is coupled to the second damper member fixing portions 1111 and 1112.

Further, the damper member 1220 includes an inner damper member 1221 and an outer damper member 1222.

In the damper members 1221 and 1222, the first damper member fixing parts 1211 and 1212 and the second damper member fixing parts 1111 and 1112 are respectively inserted into the first grooves 1221a and 1222a and the second groove 1221b, 1222b) is formed.

The first damper member fixing parts 1211 and 1212 include a first inner damper member fixing part 1211 and a first outer damper member fixing part 1212, and the second damper member fixing parts 1111 and 1112 2 It includes an inner damper member fixing portion 1111 and a second outer damper member fixing portion 1112.

In addition, the first inner damper member fixing portion 1211 and the first outer damper member fixing portion 1212 are formed to face each of the second inner damper member fixing portion 1111 and the second outer damper member fixing portion 1112 do.

In addition, the second outer damper member fixing part 1112 is formed on the outer edge of the fix body unit 1100, and the second inner damper member fixing part 1111 is compared to the second outer damper member fixing part 1112. It may be formed inside the fix body unit 1100.

In addition, the first outer damper member fixing part 1212 is formed on the outer edge of the freebody unit 1200, and the first inner damper member fixing part 1211 is compared to the first outer damper member fixing part 1212. It may be formed inside the prebody unit 1200.

In addition, Figure 7 (b) is an embodiment for this, the second outer damper member fixing portion 1112 is formed on the outer edge of the fix body unit 1100, four, the second inner damper member fixing portion 1111 ) Shows that three are formed on the inside of the fix body unit 1100.

And the four outer damper members 1222 coupled to the second outer damper member fixing part 1112 and the first outer damper member fixing part 1212 are outer corners of the fix body unit 1100 and the free body unit 1200. Damping the vibration for

In addition, the three inner damper members 1221 coupled to the second inner damper member fixing part 1111 and the first inner damper member fixing part 1211 can damp the positional vibration in the axial direction in which the freebody unit is elevated. I can.

In addition, the inner damper member 1221 and the outer damper member 1222 have a height difference with respect to the direction in which the free body unit is elevating, so that the inner damper member 1221 has a second inner damper member fixing part 1111 and a first It is coupled to the inner damper member fixing portion 1211, the outer damper member 1222 may be coupled to the second outer damper member fixing portion 1112 and the first outer damper member fixing portion 1212.

In addition, as described above, the array tester can perform double damping in the axial direction in which the free body unit 1200 is raised and lowered due to a height difference between the inner damper member 1221 and the outer damper member 1222.

In addition, four first outer damper member fixing portions are formed at the corners of the prebody unit, three first inner damper member fixing portions are formed, and the piezo gap correction unit 1300 is formed on one side of the prebody unit 1200. One, and two, may be mounted on the other side of the free body unit 1200.

In addition, one of the three first inner damper member fixing parts is formed between two piezo gap correction units mounted on the other side of the freebody unit, and the two first inner damper member fixing parts are on one side of the freebody unit. It is formed on both sides of one mounted piezo gap correction unit.

In addition, as the three inner damper members are each coupled to the first inner damper member fixing unit, one inner damper member is positioned between the two piezo gap correction units, and two inner damper members are located on both sides of the four piezo gap correction units. Is located.

When made as described above, and when the free body unit 1200 is movably coupled to the fix body unit 1100, the damper member 1220 includes a first damper member fixing part 1210 and a second damper member fixing part. Are combined at the same time.

Accordingly, the movement direction of the array tester 1000 facing the glass panel (shown by the Y-axis in FIG. 10) and the movement direction of the array tester 1000 with respect to the glass panel extending in the longitudinal direction (FIG. 10 (Shown by the X-axis) is attenuated by the damper member 1220.

In the above, a preferred embodiment of the present invention has been described with reference to the accompanying drawings, but those of ordinary skill in the art to which the present invention pertains, the present invention is in other specific forms without changing the technical spirit or essential features It will be appreciated that it can be implemented. Therefore, it should be understood that the exemplary embodiment described above is illustrative in all respects and is not limiting.

1000: Array tester 1100: Fixbody unit
1111: second inner damper member fixing portion 1112: second outer damper member fixing portion
1200: free body unit 1210: first damper member fixing portion
1211: first inner damper member fixing portion 1212: first outer damper member fixing portion
1220: damper member 1221: inner damper member
1222: outer damper member 1300: gap correction unit
1310: first coupling body 1320: second coupling body
1330: piezo actuator 1340: sensor
1400: modulator unit 1410: modulator
1420: body frame 1500: modulator mounting unit
1510: rotation and elevating support 1520: vacuum adsorption unit
1530: sensor unit 1511: drive device
1512: support member

Claims (14)

As an array tester for detecting electrode bonding formed on a substrate of a glass panel,
A modulator unit facing the glass panel; And
And an array tester body unit including a modulator mounting unit to which the modulator unit is coupled, and fixes the modulator unit,
The modulator mounting unit fixes the modulator unit in a direction coaxial with a direction in which the modulator unit is coupled to the array tester body unit,
The modulator mounting unit includes a rotating and elevating support portion for supporting a lower portion of the modulator unit.
Array tester.
The method of claim 1,
The array tester body unit
Including a fix body unit and a free body unit movably coupled to the fix body unit,
The modulator mounting unit is coupled to the free body unit,
The modulator unit includes a modulator and a body frame to which the modulator is coupled and covers an outer circumference of the modulator,
The body frame is supported by the rotation and elevation support
Array tester.
The method of claim 2,
The modulator mounting unit
A vacuum adsorption unit for adsorbing and fixing the body frame,
Further comprising a sensor unit that checks whether the body frame is in a state of being adsorbed and coupled to the vacuum adsorption unit.
Array tester.
The method of claim 2,
The pivoting and lifting support part
Including a support member for supporting the body frame, and a driving device for rotating or elevating the support member
Array tester.
The method of claim 4,
The support member
A shaft member connected to the driving device, and an extension support member connected to the shaft member and extending in a perpendicular direction,
The support member as a whole has a “b” shape
Array tester.
The method of claim 2,
One side is coupled to the fix body unit, the other side is coupled to the free body unit, further comprising a piezo gap correction unit capable of adjusting the distance between the fix body unit and the free body unit
Array tester.
The method of claim 6,
The piezo gap correction unit
A piezo actuator having a first coupling body coupled to the fixbody unit, a second coupling body coupled to the freebody unit, and one side coupled to the first coupling body and the other coupled to the second coupling body, Including a sensor for detecting the distance between the modulator and the glass panel,
The piezo actuator adjusts the distance between the fix body unit and the free body unit using information of the distance detected from the sensor.
Array tester.
The method of claim 7,
The modulator and the sensor are located on the same plane with respect to the distance direction from the glass panel.
Array tester.
The method of claim 7,
The piezo gap correction unit is a plurality of coupled to the free body unit and the fixed body unit
Array tester.
The method of claim 2,
A first damper member fixing part is formed in the free body unit, and a second damper member fixing part is formed in the fix body,
The free body unit further includes a damper member having one side coupled to the first damper member fixing unit and the other side coupled to the second damper member fixing unit.
Array tester.
The method of claim 10,
The damper member includes an inner damper member and an outer damper member,
The first damper member fixing part includes a first inner damper member fixing part and a first outer damper member fixing part,
The first outer damper member fixing part is formed at an outer edge of the freebody unit, and the first inner damper member fixing part is formed inside the freebody unit compared to the first outer damper member fixing part,
The second damper member fixing part includes a second inner damper member fixing part corresponding to the first inner damper member fixing part, and a second outer damper member fixing part corresponding to the first outer damper member fixing part,
The inner damper member is coupled to the first inner damper member fixing part and the second inner damper member fixing part,
The outer damper member is coupled to the first outer damper member fixing part and the second outer damper member fixing part.
Array tester.
The method of claim 11,
When the inner damper member and the outer damper member are respectively coupled to the first inner damper member fixing part and the first outer damper member fixing part, the free body unit has a height difference with respect to the elevating direction.
Array tester.
The method of claim 12,
Four first outer damper member fixing portions are formed at the corners of the free body unit, and three first inner damper member fixing portions are formed.
Array tester.
The method of claim 10,
The damper member is made of fluorine rubber
Array tester.

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