KR102068034B1 - Array tester - Google Patents

Abstract

Disclosed is an array tester with the high accuracy of a test result. The array tester comprises: a fixing module disposed on top of a substrate to be tested; a modulator module disposed between the fixing module and the substrate; and a support member interposed between the fixing module and the modulator module and connecting the fixing module and the modulator module. The support member includes a first link fixed to the fixing module, a second link fixed to the modulator module, a third link connecting between the first and second links, having one side connected to the first link for rotation, and having the other side connected to the second link for rotation, and an elastic member provided at each of the connection portion between the first and third links and the connection portion between the second link and third link and providing elastic force for restoring the rotated third link to an original state.

Description

Array Test Device {ARRAY TESTER}

The present invention relates to an array test apparatus, and more particularly, to an array test apparatus for inspecting an electrical defect of electrodes formed on a substrate.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display (LCD), plasma display panel (PDP), electro luminescent display (ELD), and VFD have been developed. Various flat panel display devices such as Vacuum Fluorescent Display have been researched and developed.

Among them, liquid crystal display devices, which have improved performance by rapidly developing semiconductor technology, have superior image quality, and have been replaced by existing cathode ray tubes (CRTs) due to advantages such as miniaturization, light weight, and low power. It is used a lot.

Liquid crystal display, which is one of the flat panel displays, is a medium-large product such as a portable cell phone, a personal digital assistant (PDA) and a portable multimedia player (PMP), as well as a TV and a computer monitor that receive and display broadcast signals. It is used in various ways.

The liquid crystal display device is a display device in which a data signal according to image information is individually supplied to liquid crystal cells arranged in a matrix form so as to display a desired image by adjusting the light transmittance of the liquid crystal cells.

The liquid crystal display determines whether light is transmitted as an electrical signal is applied between a thin film transistor (TFT) substrate having a plurality of pixel patterns and a color filter substrate having a color filter layer. A liquid crystal layer is provided.

The liquid crystal display device may be manufactured by the following method. First, a plurality of pixel electrodes formed in each pixel region defined by crossing a plurality of gate lines arranged in one direction, a plurality of data lines arranged in a direction perpendicular to the gate lines, and a gate line and a data line in a TFT substrate; The plurality of TFTs are switched by the signals of the gate lines to transfer the signals of the data lines to each pixel electrode.

In addition, a black matrix for blocking light in portions other than the pixel region, an RGB color filter layer for expressing color colors, and a common electrode for implementing an image are formed on the color filter substrate.

Subsequently, after the alignment film is applied to the TFT substrate and the color filter substrate, the alignment film is rubbed to provide a pre-tilt angle and an alignment direction to the liquid crystal molecules in the liquid crystal layer to be formed between the TFT substrate and the color filter substrate. (rubbing)

Then, paste is applied to at least one substrate in a predetermined pattern to form a paste pattern so as to maintain a gap between the substrates while preventing liquid crystals from leaking out and to seal the substrates. The liquid crystal panel is manufactured through the process of forming the liquid crystal layer.

During the manufacturing process of such a liquid crystal display device, a process of testing for defects such as disconnection of gate lines or data lines formed on a TFT substrate, or open circuit defects on other TFT substrates is performed.

The defect of the electrode formed on the board | substrate is inspected by the array tester. This array test apparatus has a fixed block and a modulator block. The modulator block includes a modulator electrode for forming an electric field between the substrate electrode and a physical property change portion whose physical properties change according to the size of the electric field.

The modulator block, after performing an array test on a portion of the substrate, moves to the next adjacent test location to repeat the array test.

The modulator block is liftably coupled to the fixed block. These modulator blocks should be placed as close to the substrate as possible during the array test to form an electric field with the substrate, and at least a certain distance from the substrate to prevent scratches and the like during movement. In view of this, the modulator block is typically arranged to maintain a distance of about 30-50 μm from the substrate.

However, a problem arises in that the substrate is not provided in a perfectly smooth plane. In the substrate, a protruding portion larger than a distance between the modulator and the substrate may be generated, for example, a protruding portion having a size of about 50 to 100 μm, and thus contact between the modulator and the substrate may frequently occur during the substrate inspection process.

In consideration of this point, a predetermined interval, for example, about 2 mm, is formed between the fixed block and the modulator block, and the fixed block and the modulator block are connected by air bearings.

The air bearing may be interposed between the stationary block and the modulator block to serve to suppress lateral shaking of the modulator block when the modulator block moves, but may provide a damping force for suppressing the longitudinal movement speed of the modulator block. There is no.

Accordingly, when contact between the protruding portion of the substrate and the modulator is generated while the modulator passes through the protruding portion of the substrate surface, a phenomenon occurs that the module block does not smoothly pass through the protruding portion of the substrate and bounces up.

When the modulator block bounces up as described above, the shaking of the modulator block becomes that severe, and in a severe case, a collision between the modulator block and the fixed block may occur, and the shaking of the modulator block may be very severe.

As the shaking of the modulator block increases, a problem arises in that the settling time until the shaking modulator block is completely stopped increases, which in turn causes an array test time delay.

It is an object of the present invention to provide an array test apparatus having an improved structure so that a modulator block can be prevented from being bounced off during an inspection process.

Another object of the present invention is to provide an array test apparatus that is easy to manufacture.

An array test apparatus according to the present invention comprises: a fixing module disposed on an upper substrate to be inspected; A modulator module disposed between the fixed module and the substrate; And a support member interposed between the fixed module and the modulator module to connect the fixed module and the modulator module, wherein the support member comprises: a first link fixed to the fixed module; A second link fixed to the modulator module; A third link connecting between the first link and the second link, one side of which is rotatably connected to the first link, and the other side of which is rotatably connected to the second link; And an elastic member provided at the connecting portion of the first link and the third link and the connecting portion of the second link and the third link, respectively, and providing an elastic force for returning the rotated third link to its original state. It includes.

The modulator module may include a moving block disposed between the fixed module and the substrate and coupled to the fixed module so as to be lifted and lowered, and a modulator disposed between the moving block and the substrate and coupled to the moving block. The moving block is preferably provided with a through portion formed to penetrate the moving block along a moving direction of the moving block, and the support member is inserted into the through portion.

The first link may protrude from the fixing module toward the inside of the through part, and the second link may protrude from the moving block toward the inside of the through part, and the third link may include the It is preferable to be rotatably connected to each of the first link and the second link disposed to be spaced apart from each other inside the through part.

In addition, the third link is provided in a rod shape having a length extending in the horizontal direction, one longitudinal side of the third link is rotatably coupled to the first link in the vertical direction, the length of the third link The other side of the direction is preferably rotatably coupled to the second link in the vertical direction.

In addition, the elastic member, it is preferable to include a torsion spring which is disposed at each of the longitudinal center and the rotational center of the other side of the third link to provide an elastic force in the reverse direction of the rotational direction of the third link.

The apparatus may further include a protruding block protruding from the fixing module toward the moving block, wherein the first link protrudes from the protruding block toward the inside of the through part, and the protruding block includes the through part. It is preferably inserted into the sliding block so as to be movable in the movable block.

In addition, it is preferable that the protruding block is formed in a rectangular parallelepiped shape, and the through part is formed in a rectangular parallelepiped shape corresponding to the protruding block shape.

The moving block may be formed in a quadrangular shape having a pair of sides facing in the first direction and a pair of sides facing in the second direction, and the through part is disposed at each of the sides, respectively, Preferably, the through parts are formed to be open to the side of the moving block, respectively.

The apparatus may further include a mounting block fixed to the movable block and to which the second link is fixed, wherein the movable block is concave in a direction from the lower surface of the movable block facing the modulator toward the fixed block. A mounting through portion is formed, and the mounting through portion is disposed laterally inside the through portion to communicate with the through portion. The mounting block is inserted into the mounting through portion, and the second link is formed from the mounting block. It is preferably formed to protrude toward the inner space of the through part.

The array test apparatus of the present invention allows the modulator module to smoothly pass through the protruding portion without jumping even when it is in contact with the protruding portion of the glass panel during the glass panel inspection process, thereby shortening the stabilization time of the modulator block, thereby making the array test. It has the effect of reducing time and providing stable and accurate test results.

In addition, according to the present invention, since the structure of the support member is simple and the assembly of the support member is easy, the workability of assembling the support member and coupling work between the fixing module and the modulator module can be improved, thereby facilitating manufacture and inspection results. It is possible to provide an array tester with high accuracy.

1 is a perspective view schematically showing an array test apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating the test module illustrated in FIG. 1.
3 is a front view of the test module illustrated in FIG. 2.
4 is a cross-sectional view taken along the line “IV-IV” of FIG. 2.
FIG. 5 is a perspective view of the supporting member shown in FIG. 4 separated from each other. FIG.
6 is a view showing an operating state of the support member shown in FIG.
7 is a view illustrating a return state of the support member shown in FIG.

Hereinafter, an embodiment of an array test apparatus according to the present invention will be described with reference to the accompanying drawings. For convenience of description, the thicknesses of lines, sizes of components, and the like shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary depending on the intention or convention of a user or an operator. Therefore, the definitions of these terms should be made based on the contents throughout the specification.

[Overall Structure of Array Test Apparatus]

1 is a perspective view schematically showing an array test apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the array test apparatus 100 according to an embodiment of the present invention is provided as an apparatus for testing electrical defects of electrodes formed on the glass panel P, and the loading unit 110 and a test. The unit 120, an unloading unit 130, and a test unit are included.

The loading unit 110 may include at least two or more loading plates 111. The loading plates 111 are arranged side by side with a predetermined play therebetween. The glass panel P to be tested by the array test apparatus 100 may be moved to the test unit 120 while being supported by the loading plate 111.

The glass panel P may be one panel provided in the flat panel display panel. As an example, the glass panel 100 may be a TFT panel in which a TFT is formed on a TFT LCD substrate.

The test unit 120 is disposed at one side of the loading unit 110, more specifically, at the exit side of the loading unit 110. The test on the glass panel P transferred by the loading plate 111 is performed in this test unit 120.

The unloading unit 130 is disposed at one side of the test unit 120, more specifically, at the exit side of the test unit 120. The glass panel P tested by the test unit 120 is transferred from the test unit 120 to the unloading unit 130, and is moved out of the array test apparatus 100 by the unloading unit 130. .

The unloading unit 130 may include an unloading plate 131. The unloading plate 131 is provided to move the tested glass panel P. FIG. The unloading plate 131 may be provided in a form of moving the tested glass panel P in a state in which the tested glass panel P is seated on the unloading plate 131, and a state in which the tested glass panel P is provided at a predetermined interval. It may be provided in the form to move to.

 When the loading plate 111 of the loading unit 110 and the unloading plate 131 of the unloading unit 130 are provided to move in a state in which the glass panel P is lifted at a predetermined interval, the loading plate 111 ) And the unloading plate 131 may be provided with air holes 112 and 132. The air holes 112 and 132 provided in the loading plate 111 and the unloading plate 131 have a passage for supplying air pressure from the lower portion of the glass panel P toward the glass panel P and the loading plate 111. It may be formed on the loading plate 131. In addition, the loading unit 110 and the unloading unit 130 may be provided with an adsorption plate 101 provided to adsorb the glass panel P.

The test unit inspects the electrical defect of the glass panel P. The test unit 150 and the test unit 120 inspect the electrical defect of the glass panel P disposed on the test unit 120. It may be configured to include a probe module 140 for applying an electrical signal to the electrode on the glass panel (P) disposed on the.

The test unit may include a plurality of test modules 150 disposed spaced apart from each other along the X-axis rail 102. Each test module 150 may include a modulator and an imaging unit 155 for imaging the modulator.

In addition, the test module 150 may be provided to be parallel to the X axis along the X axis rail 102. In addition, the glass panel P may be transferred in the Y-axis direction while passing through the loading unit 110, the test unit 120, and the unloading unit 130. Therefore, the array test apparatus 100 of the present exemplary embodiment may test the electrodes of the glass panel P while relatively moving the glass panel P and the test module 150.

However, the present invention is not limited thereto, and the test module 150 is moved to the X-axis and the Y-axis while the glass panel P is fixed to the fixed support plate. .

Structure of Test Module

2 is a perspective view illustrating the test module illustrated in FIG. 1, FIG. 3 is a front view illustrating the test module illustrated in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line “IV-IV” of FIG. 2.

2 to 4, the test module 150 of the array test apparatus 100 according to an embodiment of the present invention includes a fixing module 160, a modulator module 170, and a support member 180. .

The fixing module 160 is disposed above the glass panel P to be inspected. The fixed module 160 is disposed to be positioned above the test unit 120, and supports the modulator module 170 on the test module 150.

The test module 150 may further include an elevating unit 190 for elevating the fixed module 160. The lifting unit 190 may be applied with various configurations that can raise or lower the fixed block 160 such as a cylinder operated by the pressure of the fluid or a linear motor operated by the electromagnetic interaction between the mover and the stator. Can be.

The modulator module 170 is disposed under the fixed module 160, that is, between the fixed module 160 and the glass panel P. In this case, the modulator module 170 may be disposed below the fixing module 160 to form an interval of about 2 mm with the fixing module 160. The modulator module 170 may include a moving block 171 and a modulator 175.

The moving block 171 is disposed between the fixing module 160 and the glass panel P, more specifically, between the fixing module 160 and the modulator 175. The moving block 171 is coupled to the lower portion of the fixed module 160 to be elevated.

The modulator 175 is disposed below the moving block 171, that is, between the moving block 171 and the glass panel P. The frame 177 may be provided between the moving block 171 and the modulator 175. The frame 177 is fixed around the modulator 175 to support the modulator 175, and the frame 177 and the modulator 175 may be fixed to the moving block 171 by vacuum suction.

The modulator 175 includes an all-mineral material layer for changing the amount of light reflected (for reflection) or the amount of light transmitted (for transmission) according to the magnitude of the electric field generated between the glass panel P ( Electro-optical material layer) and electrodes are provided. The all material layer is made of a material whose specific properties are changed by an electric field generated when a voltage is applied to the glass panel P and the modulator 225 to change the amount of light incident on the all material layer. The all-optical layer may be formed of a liquid crystal having a characteristic of being arranged in a predetermined direction according to the size of the electric field.

When the modulator module 170 applies a constant voltage to the electrodes of the modulator 175 included in the modulator module 170 and the electrodes formed on the glass panel P in the state in which the modulator module 170 approaches the glass panel P, An electric field is generated between them.

In this case, the size of the electric field between the defective portion and the portion without the defect on the glass panel P is changed, and whether the defect is detected through the difference.

The support member 180 is interposed between the fixed module 160 and the modulator module 170 to connect the fixed module 160 and the modulator module 170. The support member 180 couples the modulator module 170, and more specifically, the moving block 171 to the fixed module 160 so that the predetermined range can be elevated.

The moving block 171 is provided with a penetrating portion 172 formed to penetrate the moving block 171 along the moving direction of the moving block 171, that is, the up and down direction. That is, the penetrating portion 172 is formed to penetrate in the vertical direction on the moving block 171. The support member 180 is provided in a form inserted into the through part 172 formed as described above, and the detailed structure of the support member 180 will be described later.

Meanwhile, the fixing module 160 and the moving block 171 may be formed in a hexahedral shape, respectively. That is, the fixed module 160 and the moving block 171 may have a pair of sides facing in the first direction, for example, the X axis direction, and a pair of sides facing in the second direction, for example, the Y axis direction. Each may be formed in a shape including a rectangular shape having.

At least one support member 180 is disposed on each side of the fixing module 160 and the moving block 171. In the present embodiment, it is illustrated that a pair of moving blocks 171 are disposed on each side of the fixed module 160 and the moving block 171 so as to be spaced apart from each other at predetermined intervals.

In addition, the through part 172 may be disposed on each side of the moving block 171, respectively, and may be disposed in a quantity and a position corresponding to the arrangement quantity and arrangement position of the support member 180. Each through part 172 may be formed to open to the side of the moving block 171. That is, each through part 172 formed in the vertically penetrating shape of the moving block 171 may be formed to be open to the side of the moving block 171.

[Structure of Support Member]

FIG. 5 is a perspective view of the supporting member shown in FIG. 4 separated from each other. FIG.

3 to 5, the support member 180 may include a first link 181, a second link 183, a third link 185, and an elastic member 187.

The first link 181 may be provided in a form fixed to the fixing module 160 and may have a length extending in a direction toward the modulator module 170, that is, extending downward. As an example, the first link 181 may be provided in the form of a flat bar protruding downward from the fixing module 160 toward the inner space of the through part 172.

The second link 183 may be provided in a form fixed to the modulator module 170 and may have a length extending in a lateral direction from the moving block 171. As an example, the second link 183 may be provided in the form of a flat rod protruding horizontally from the fixing module 160 toward the inner space of the through part 172.

The third link 185 is disposed to be located in the inner space of the through part 172. As an example, the third link 185 may be provided in a rod shape having a length extending in the horizontal direction. The third link 185 connects between the first link 181 and the second link 183.

The first link 181 and the second link 183 are spaced apart from each other along the longitudinal direction of the third link 185 in the inner space of the through part 172 where the third link 185 is disposed. The three links 185 are rotatably connected to the first link 181 and the second link 183, respectively.

In this case, one longitudinal side of the third link 185 is rotatably coupled with the first link 181, and the other longitudinal side of the third link 185 is rotatably coupled with the second link 183. Accordingly, the third link 185 may be rotatably coupled to the first link 181 in the up and down direction, and may be rotatably coupled to the second link 183 in the up and down direction.

The elastic member 187 is provided at the connecting portion of the first link 181 and the third link 185, and at the connecting portion of the second link 183 and the third link 185, respectively. That is, the elastic member 187 may include a center of rotation of the third link 185 at the engagement portion between the first link 181 and the third link 185, and the second link 183 and the third link 185. It is provided at the center of rotation of the third link 185 in the engaging portion of the liver. Each of the elastic members 187 may provide an elastic force to return the rotated third link 185 to its original state.

In this embodiment, the elastic member 187 is illustrated as including a torsion spring. The elastic members 187 are disposed at rotation centers of one side and the other side in the longitudinal direction of the third link 185, respectively. The elastic members 187 disposed in this way are opposite to the rotation direction of the third link 185. It can provide an elastic force of.

In addition, the support member 180 of the present embodiment may further include a protruding block 182. The protruding block 182 is provided to protrude from the fixing module 160 toward the moving block 171. In this embodiment, the protruding block 182 is illustrated as being formed in a cuboid shape. The protruding block 182 is provided to protrude from the fixing module 160 to the lower portion of the fixing module 160, and at least a portion of the protruding block 182 may be inserted into the interior of the through part 172. have.

The first link 181 is formed to protrude downward from the protruding block 182 toward the inner space of the through part 172. In addition, the protruding block 182 may be formed to have a width corresponding to the width of the penetrating portion 172, whereby the protruding block 182 is inserted into the penetrating portion 172 and slidably moves up and down in the moving block 171. Possibly combined.

In addition, the support member 180 of the present embodiment may further include a mounting block 184. The mounting block 173 may be formed in the moving block 171.

The protruding block 182 is fixed to the moving block 171, and the second link 183 is fixed to the protruding block 182. And the mounting groove 173 is formed concave in the direction toward the fixed module 160 from the lower surface of the moving block 171 facing the modulator 175. That is, the mounting groove 173 is formed to be concave upward from the lower surface of the moving block 171. The mounting groove 173 may be disposed in the lateral direction of the through part 172 to communicate with the through part 172.

The mounting block 184 may be fixed to the moving block 171 in a state of being inserted into the mounting groove 173. The second link 183 may be formed to protrude in a horizontal direction from the mounting block 184 toward the inner space of the through part 172.

[Installation structure of support member]

The test module 150 of the present embodiment is a modulator module 170 is supported on the lower portion of the fixed module 160, and the fixed module 160 and the modulator module 170 is connected to the lifting member 180 by lifting and lowering. Is provided.

A plurality of support members 180 are disposed at each side of the fixed module 160 and the moving block 171, and each of the supporting members 180 is an internal space of the through part 172 formed in the moving block 171. It is provided in the form of being inserted in.

Among the components constituting the support member 180, the first link 181 is formed to protrude downward from the protruding block 182, and the first link 181 is fixed to the protruding block 182. It is installed in the lower portion of the fixing module 160 by being fixed to the lower portion of the module 160.

The second link 183 is formed to protrude in the horizontal direction from the mounting block 184, the second link 183 is a moving block in the form of the mounting block 184 is inserted into the mounting groove 173. It is installed inside the moving block 171 by being fixed to the inside of the 171. In this case, the second link 183 is installed on the moving block 171 in a form protruding from the inside of the moving block 171 into the space inside the through part 172.

In addition, the third link 185 is rotatably coupled to the first link 181 and the second link 183 in the interior of the through part 172, and the first link 181 and the second link 183 are respectively. Connect between. In addition, elastic members 187 are installed at the coupling portions of the first link 181 and the third link 185, and the coupling portions of the second link 183 and the third link 185, respectively. The member 187 provides an elastic force to return the rotated third link 185 to its original state.

The installation of the support member 180 may couple the protruding block 182 to the fixing module 160 to fix the first link 181 to the lower portion of the fixing module 160, and the mounting block 184 may be mounted to the mounting groove part. 173, the second link 183 is fixed to the moving block 171 by coupling to the moving block 171, and then the third link 185 is connected to the first link 181 and the second link (181). 183), respectively.

At this time, in a state in which the fixing module 160 and the moving block 171 are separated from each other and spaced apart from each other, the first link after first coupling the third link 185 together with the second link 183 together with the elastic member 187. If the operation of coupling between the link 181 and the second link 183, the installation of the support member 180 can be made more easily.

If the fixing module 160 and the moving block 171 are separated from each other and separated from each other, if the first link 185 is coupled to the second link 183 together with the elastic member 187, Joining operations between the second link 183 and the third link 185 may be more easily performed in an advantageous environment in which the upper part, the lower part, and the side of the part 172 are open.

In addition, even when the coupling operation between the second link 183 and the third link 185 is performed first, the coupling operation between the first link 181 and the third link 185 may be easily performed. In this condition, the coupling operation between the fixed first link 181 and the third link 185 should be performed while the upper portion of the penetrating portion 172 is covered by the fixing module 160, even though the penetrating portion 172. The bottom and sides of the are still open. Therefore, even in the above conditions, the coupling operation between the first link 181 and the third link 185 may be more easily performed in an environment in which the lower part and the side of the through part 172 are opened.

That is, the through part 172 is formed to open to the side of the moving block 171, so that the workability of the assembling and fixing module 160 and the modulator module 170 of the support member 180 can be improved. It will be.

[Action and Effect of Supporting Member]

6 is a view showing an operating state of the support member shown in Figure 4, Figure 7 is a view showing the original state return state of the support member shown in FIG.

Hereinafter, operations and effects of the array test apparatus according to an exemplary embodiment of the present invention will be described with reference to FIGS. 4 to 7.

As shown in FIGS. 4 and 5, the support member 180 includes a first link 181 fixed to the fixing module 160 and a second link 183 fixed to the moving block 171. The third link 185 is rotatably coupled to the first link 181 and the second link 183, respectively, by the link 185 and the first link 181 and the third link 185. The elastic member 187 is provided in the coupling portion between the second link 183 and the third link 185, respectively.

The modulator module 170 is supported by the support member 180 so as to be lifted and lowered by the fixing module 160, and the test module 150 is mounted on the test unit 120 using the modulator module 170 provided as described above. The electrical defect of the glass panel P disposed on the surface is inspected.

As illustrated in FIG. 1, the test module 150 may test the electrodes of the glass panel P that are moved to the test unit 120 through the loading unit 110. As another example, the test module 150 may be moved along the X and Y axes to test whether the glass panel P has an electrode error.

The modulator 175 should be disposed as close as possible to the glass panel P during the array test to form an electric field with the glass panel P, and scratches or the like during the movement of the test module 150 or the glass panel P. In order to prevent it, it should be separated from the glass panel P by a predetermined distance or more. In consideration of this point, the modulator 175 is disposed to maintain a distance of about 30-50 μm from the glass panel P.

In the glass panel P, a protruding portion larger than the distance between the modulator 175 and the glass panel P, for example, a protruding portion having a size of about 50 to 100 μm, may be generated. The test module 150 or the glass panel may be formed. There is a case where contact between the protruding portion and the modulator 175 occurs during the movement of (P).

When such contact occurs, the modulator 175 rides on the protruding portion while passing through the protruding portion, thereby raising the modulator 175.

At this time, in the support member 180, as shown in Figure 6, the rise of the second link 183 together with the modulator 175 is also made. Accordingly, in the coupling portion between the second link 183 and the third link 185, the third link 185 is rotated in the counterclockwise direction, and the first link 181 and the third link 185 are rotated. In the coupling portion, the third link 185 is rotated in the counterclockwise direction.

However, due to the rotation of the third link 185, the first link 181 and the second link 183 may be subjected to a force in a direction in which the distance between them narrows, the rising width of the modulator 175 is 1mm Considering that it is short enough, the force applied to the first link 181 and the second link 183 due to the rotation of the third link 185 will be insignificant. Therefore, the lateral force applied to the first link 181 and the second link 183 due to the rotation of the third link 185 as described above, the first link 181 and the second link 183 itself. Elasticity, tolerances in the engagement portion between the first link 181 and the third link 185, and tolerances in the engagement portion between the second link 183 and the third link 185 can be sufficiently absorbed. something to do.

In this process, the modulator 175 rises only by the difference between the height of the modulator 175 and the height of the protruding portion, and does not bounce further. This is due to the elastic force provided by the elastic member 187 provided between the coupling portion between the first link 181 and the third link 185 and the coupling portion between the second link 183 and the third link 185. The member 187 may provide a clockwise elastic force against counterclockwise rotation of the third link 185 generated in the process of raising the modulator 175 as described above.

As such, the elastic force provided by the elastic member 187 may act as a force to allow only the lift necessary for the modulator 175 to pass over the protruding portion. As a result, even when the modulator 175 is in contact with the protruding portion of the glass panel P in the test process of the glass panel P, the modulator 175 can smoothly pass through the protruding portion without popping up.

In addition, as shown in FIG. 7, the elastic member 187 may provide an elastic force for returning the third link 185 rotated counterclockwise to its original position. As a result, the modulator 175 smoothly passing through the protruding portion of the glass panel P again returns to the position at which the distance between the glass panel P and the glass panel P is set, for example, about 30 to 50 μm. Will return.

That is, the modulator module 170 supported by the support member 180 to be lifted and lowered to the fixing module 160 may not protrude even if it comes into contact with the protruding portion of the glass panel P during the inspection of the glass panel P. The part can be passed smoothly, and after passing through the protruding part, it can be naturally returned to the original position suitable for inspecting the glass panel P again.

The array tester according to the present embodiment having the above-described configuration may smoothly pass through the protruding portion without popping up even when it is in contact with the protruding portion of the modulator module 170 or the glass panel P during the inspection of the glass panel P. In addition, the stabilization time of the modulator module 170 may be shortened, thereby reducing the array test time and providing a stable and accurate test result.

In addition, according to the array tester of the present embodiment, since the structure of the support member 180 is simple and the support member 180 is easily assembled, the assembly and fixing module 160 and the modulator module 170 of the support member 180 may be separated. The workability of the joining operation can be improved, thereby providing an array tester that is easy to manufacture and has high accuracy of inspection results.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art to which the art belongs can make various modifications and other equivalent embodiments therefrom. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the claims below.

100: array test device
110: loading unit
111: loading plate
112,132: Air hole
120: test unit
130: unloading unit
131: unloading plate
150: test module
160: fixed module
170: modulator module
171: moving block
172: through part
173: mounting groove
175 modulator
177 frame
180: support member
181: first link
182: protrusion block
183: second link
184: mounting block
185: third link
187: elastic member
190: lifting unit

Claims (9)

A fixed module disposed on the substrate to be inspected;
A modulator module disposed between the fixed module and the substrate; And
And a support member interposed between the fixed module and the modulator module to connect the fixed module and the modulator module.
The support member,
A first link fixed to the fixing module;
A second link fixed to the modulator module;
A third link connecting between the first link and the second link, one side of which is rotatably connected to the first link, and the other side of which is rotatably connected to the second link; And
An elastic member provided at the connection portion of the first link and the third link and the connection portion of the second link and the third link, respectively, and providing an elastic force for returning the rotated third link to its original state; Array testing device comprising.
The method of claim 1,
The modulator module includes a moving block disposed between the fixed module and the substrate and coupled to the fixed module so as to be lifted and lowered, and a modulator disposed between the moving block and the substrate and coupled to the moving block.
The moving block is provided with a through portion formed to penetrate the moving block along the moving direction of the moving block,
The support member is an array test device inserted into the through part.
The method of claim 2,
The first link is formed to protrude from the fixing module toward the inside of the through part,
The second link is formed to protrude from the moving block toward the inside of the through part,
And the third link is rotatably connected to the first link and the second link, respectively, spaced apart from each other within the through part.
The method of claim 3,
The third link is provided in a rod shape having a length extending in the horizontal direction,
One longitudinal side of the third link is rotatably coupled to the first link in the vertical direction,
The other lengthwise side of the third link, the array test device is rotatably coupled to the second link in the vertical direction.
The method of claim 4,
The elastic member, the array test device comprising a torsion spring disposed at each of the longitudinal center and the rotational center of the other side of the third link to provide an elastic force in the reverse direction of the rotational direction of the third link.
The method of claim 2,
Further comprising a protruding block protruding from the fixing module toward the moving block,
The first link is formed to protrude from the protruding block toward the inside of the through part,
The protruding block is inserted into the through part, the array test device coupled to the movable block in a sliding movement.
The method of claim 6,
The protruding block is formed in a rectangular parallelepiped shape,
And the through part is formed in a rectangular parallelepiped shape corresponding to the protruding block shape.

The method of claim 6,
The moving block is formed in a rectangular shape having a pair of sides facing in the first direction and a pair of sides facing in the second direction,
The through portion is disposed on each of the sides,
Each of the through portions is formed to be open to the side of the moving block, respectively.
The method of claim 2,
A mounting block fixed to the moving block and to which the second link is fixed;
The movable block is provided with a mounting penetrating portion formed concave in a direction from the lower surface of the movable block to the fixed block facing the modulator,
The mounting through portion is disposed in the lateral direction of the through portion communicates with the through portion,
The mounting block is inserted into the mounting through portion,
And the second link is formed to protrude from the mounting block toward the inner space of the through part.

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