TWI313517B - - Google Patents

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Publication number
TWI313517B
TWI313517B TW092127221A TW92127221A TWI313517B TW I313517 B TWI313517 B TW I313517B TW 092127221 A TW092127221 A TW 092127221A TW 92127221 A TW92127221 A TW 92127221A TW I313517 B TWI313517 B TW I313517B
Authority
TW
Taiwan
Prior art keywords
light
electrode
emitting diode
current
layer
Prior art date
Application number
TW092127221A
Other languages
English (en)
Chinese (zh)
Other versions
TW200421632A (en
Inventor
Takahiko Sakamoto
Takeshi Kususe
Original Assignee
Nichia Corporatio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corporatio filed Critical Nichia Corporatio
Publication of TW200421632A publication Critical patent/TW200421632A/zh
Application granted granted Critical
Publication of TWI313517B publication Critical patent/TWI313517B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers

Landscapes

  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
TW092127221A 2002-10-03 2003-10-01 Light emitting diode TW200421632A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002291131 2002-10-03
JP2002324020 2002-11-07
JP2002372034 2002-12-24
JP2003296275A JP3956918B2 (ja) 2002-10-03 2003-08-20 発光ダイオード

Publications (2)

Publication Number Publication Date
TW200421632A TW200421632A (en) 2004-10-16
TWI313517B true TWI313517B (enExample) 2009-08-11

Family

ID=32074567

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092127221A TW200421632A (en) 2002-10-03 2003-10-01 Light emitting diode

Country Status (8)

Country Link
US (2) US7075115B2 (enExample)
EP (1) EP1548849B1 (enExample)
JP (1) JP3956918B2 (enExample)
KR (1) KR100998405B1 (enExample)
AU (1) AU2003273590A1 (enExample)
MY (2) MY131853A (enExample)
TW (1) TW200421632A (enExample)
WO (1) WO2004032252A1 (enExample)

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US8896216B2 (en) 2005-06-28 2014-11-25 Seoul Viosys Co., Ltd. Illumination system
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TWI299917B (en) * 2006-03-17 2008-08-11 Epistar Corp Light-emitting diode and method for manufacturing the same
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JP5326225B2 (ja) * 2006-05-29 2013-10-30 日亜化学工業株式会社 窒化物半導体発光素子
JP5250856B2 (ja) 2006-06-13 2013-07-31 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子の製造方法
JP5045001B2 (ja) * 2006-06-22 2012-10-10 日亜化学工業株式会社 半導体発光素子
JP5719496B2 (ja) * 2006-06-28 2015-05-20 日亜化学工業株式会社 半導体発光素子及び発光装置、及び半導体発光素子の製造方法
JP2008034822A (ja) 2006-06-28 2008-02-14 Nichia Chem Ind Ltd 半導体発光素子
US7928451B2 (en) * 2006-08-18 2011-04-19 Sensor Electronic Technology, Inc. Shaped contact layer for light emitting heterostructure
US7964892B2 (en) * 2006-12-01 2011-06-21 Nichia Corporation Light emitting device
KR100787171B1 (ko) * 2007-01-02 2007-12-21 (주)에피플러스 발광다이오드
CN102779918B (zh) 2007-02-01 2015-09-02 日亚化学工业株式会社 半导体发光元件
CN101414653B (zh) * 2007-10-18 2010-04-14 泰谷光电科技股份有限公司 发光二极管结构及制造方法
JPWO2009054088A1 (ja) * 2007-10-23 2011-03-03 パナソニック株式会社 半導体発光素子およびそれを用いた半導体発光装置とその製造方法
CN101420003B (zh) * 2007-10-24 2011-11-30 泰谷光电科技股份有限公司 发光二极管的制造方法
WO2009057241A1 (ja) 2007-11-01 2009-05-07 Panasonic Corporation 半導体発光素子およびそれを用いた半導体発光装置
US7713769B2 (en) * 2007-12-21 2010-05-11 Tekcore Co., Ltd. Method for fabricating light emitting diode structure having irregular serrations
WO2009084325A1 (ja) * 2007-12-28 2009-07-09 Mitsubishi Chemical Corporation Ｌｅｄ素子およびｌｅｄ素子の製造方法
KR20090073935A (ko) * 2007-12-31 2009-07-03 주식회사 에피밸리 3족 질화물 반도체 발광소자
TWI447940B (zh) * 2008-07-15 2014-08-01 Lextar Electronics Corp 發光二極體晶片及其製造方法
TW201027811A (en) * 2009-01-12 2010-07-16 Ubilux Optoelectronics Corp LED and its manufacturing method
JP5087097B2 (ja) 2010-03-08 2012-11-28 株式会社東芝 半導体発光素子
KR101064020B1 (ko) * 2010-04-23 2011-09-08 엘지이노텍 주식회사 발광 소자 및 그 제조방법
JP5630384B2 (ja) * 2010-09-28 2014-11-26 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子の製造方法
KR101786094B1 (ko) * 2011-06-23 2017-10-16 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지, 및 라이트 유닛
JP4970611B2 (ja) * 2011-07-29 2012-07-11 株式会社東芝 半導体発光素子
US9419182B2 (en) 2012-01-05 2016-08-16 Micron Technology, Inc. Solid-state radiation transducer devices having at least partially transparent buried-contact elements, and associated systems and methods
JP2012074748A (ja) * 2012-01-16 2012-04-12 Toshiba Corp 半導体発光素子
JP2013258177A (ja) * 2012-06-11 2013-12-26 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物半導体発光素子
CN103413874A (zh) * 2013-08-21 2013-11-27 聚灿光电科技(苏州)有限公司 Led芯片及其制备方法
US9666779B2 (en) * 2013-11-25 2017-05-30 Yangzhou Zhongke Semiconductor Lighting Co., Ltd. Semiconductor light emitting diode chip with current extension layer and graphical current extension layers
JP6684541B2 (ja) 2014-01-20 2020-04-22 ローム株式会社 発光素子
KR101539430B1 (ko) * 2014-09-02 2015-07-27 서울바이오시스 주식회사 발광 다이오드 및 그 제조 방법
USD845920S1 (en) * 2015-08-12 2019-04-16 Epistar Corporation Portion of light-emitting diode unit
US10497835B2 (en) * 2015-09-25 2019-12-03 Lg Innotek Co., Ltd. Light emitting device, light emitting element package, and light emitting device
US20190189850A1 (en) * 2017-12-19 2019-06-20 Epistar Corporation Light-emitting device
JP6912731B2 (ja) 2018-07-31 2021-08-04 日亜化学工業株式会社 半導体発光素子
JP7219391B2 (ja) * 2018-07-31 2023-02-08 日亜化学工業株式会社 発光素子
KR102680291B1 (ko) * 2019-08-20 2024-07-02 삼성전자주식회사 발광 소자

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JP3602929B2 (ja) 1996-12-11 2004-12-15 豊田合成株式会社 ３族窒化物半導体発光素子
US6107644A (en) * 1997-01-24 2000-08-22 Rohm Co., Ltd. Semiconductor light emitting device
US6420735B2 (en) * 1997-05-07 2002-07-16 Samsung Electronics Co., Ltd. Surface-emitting light-emitting diode
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JP2000174339A (ja) 1998-12-04 2000-06-23 Mitsubishi Cable Ind Ltd ＧａＮ系半導体発光素子およびＧａＮ系半導体受光素子
JP3973799B2 (ja) 1999-07-06 2007-09-12 松下電器産業株式会社 窒化ガリウム系化合物半導体発光素子
US6614056B1 (en) 1999-12-01 2003-09-02 Cree Lighting Company Scalable led with improved current spreading structures
US6410942B1 (en) 1999-12-03 2002-06-25 Cree Lighting Company Enhanced light extraction through the use of micro-LED arrays
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Also Published As

Publication number Publication date
US20060081865A1 (en) 2006-04-20
US7075115B2 (en) 2006-07-11
EP1548849A4 (en) 2009-09-09
JP2004221529A (ja) 2004-08-05
MY131853A (en) 2007-09-28
EP1548849B1 (en) 2013-05-01
US7495259B2 (en) 2009-02-24
TW200421632A (en) 2004-10-16
KR20050061509A (ko) 2005-06-22
KR100998405B1 (ko) 2010-12-03
AU2003273590A1 (en) 2004-04-23
EP1548849A1 (en) 2005-06-29
MY165319A (en) 2018-03-21
US20040124422A1 (en) 2004-07-01
JP3956918B2 (ja) 2007-08-08
WO2004032252A1 (ja) 2004-04-15

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MM4A Annulment or lapse of patent due to non-payment of fees