TWI312448B - Agent-based control architecture - Google Patents

Agent-based control architecture Download PDF

Info

Publication number
TWI312448B
TWI312448B TW091135512A TW91135512A TWI312448B TW I312448 B TWI312448 B TW I312448B TW 091135512 A TW091135512 A TW 091135512A TW 91135512 A TW91135512 A TW 91135512A TW I312448 B TWI312448 B TW I312448B
Authority
TW
Taiwan
Prior art keywords
medium
workpiece
controller
tool
configuration
Prior art date
Application number
TW091135512A
Other languages
English (en)
Chinese (zh)
Other versions
TW200301854A (en
Inventor
Miller Michael L L
Grover Jason A A
Conboy Michael R R
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200301854A publication Critical patent/TW200301854A/zh
Application granted granted Critical
Publication of TWI312448B publication Critical patent/TWI312448B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32097—Recipe programming for flexible batch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
TW091135512A 2002-01-10 2002-12-09 Agent-based control architecture TWI312448B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4464002A 2002-01-10 2002-01-10

Publications (2)

Publication Number Publication Date
TW200301854A TW200301854A (en) 2003-07-16
TWI312448B true TWI312448B (en) 2009-07-21

Family

ID=21933483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091135512A TWI312448B (en) 2002-01-10 2002-12-09 Agent-based control architecture

Country Status (8)

Country Link
JP (1) JP4849773B2 (ja)
KR (1) KR100939329B1 (ja)
CN (1) CN100449551C (ja)
AU (1) AU2002343588A1 (ja)
DE (1) DE10297636B4 (ja)
GB (1) GB2400925B (ja)
TW (1) TWI312448B (ja)
WO (1) WO2003060779A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8050900B2 (en) 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US7542880B2 (en) * 2006-04-06 2009-06-02 Advanced Micro Devices, Inc. Time weighted moving average filter
DE102007014970B3 (de) * 2007-03-28 2008-07-31 Siemens Ag Konfiguration von medizintechnischen Prozessen
DE102008035258A1 (de) * 2008-07-29 2010-03-25 Siemens Aktiengesellschaft Verfahren und Anordnung zum Prüfen der Datenkonsistenz einer technischen Anlage
DE102011109388A1 (de) * 2011-08-04 2013-02-07 Heidelberger Druckmaschinen Aktiengesellschaft Automatische Druckmaschinenverbesserung
US9383739B2 (en) * 2012-02-21 2016-07-05 Applied Materials, Inc. Enhanced re-hosting capability for legacy hardware and software
US20130282333A1 (en) * 2012-04-23 2013-10-24 Abb Technology Ag Service port explorer
DE102019218623A1 (de) * 2019-11-29 2021-06-02 Sms Group Gmbh Steuerungssystem für eine industrielle Anlage, insbesondere für eine Anlage zur Herstellung oder Verarbeitung von metallischen Bändern oder Blechen und Verfahren zum Steuern einer industriellen Anlage, insbesondere einer Anlage zur Herstellung oder Verarbeitung von metallischen Bändern oder Blechen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5548505A (en) * 1994-07-15 1996-08-20 Oktrak Systems, Inc. Scrubber control system
JP4276711B2 (ja) * 1998-01-05 2009-06-10 株式会社日立国際電気 半導体製造装置制御システム
JP3002776B1 (ja) * 1998-07-16 2000-01-24 横河電機株式会社 生産システム及び生産システムにおける加工装置の選択方法
JP3704698B2 (ja) * 1998-08-12 2005-10-12 横河電機株式会社 生産システム
JP2000158297A (ja) * 1998-12-01 2000-06-13 Dainippon Screen Mfg Co Ltd ジョブ管理システム、ジョブ管理方法および記録媒体
US6485990B1 (en) * 2000-01-04 2002-11-26 Advanced Micro Devices, Inc. Feed-forward control of an etch processing tool
JP2001338856A (ja) * 2000-05-30 2001-12-07 Tokyo Seimitsu Co Ltd 半導体製造システムのプロセスコントローラ
US6694275B1 (en) * 2000-06-02 2004-02-17 Timbre Technologies, Inc. Profiler business model

Also Published As

Publication number Publication date
TW200301854A (en) 2003-07-16
KR100939329B1 (ko) 2010-01-28
JP2005515623A (ja) 2005-05-26
GB2400925A (en) 2004-10-27
GB2400925B (en) 2005-08-03
DE10297636B4 (de) 2008-05-08
JP4849773B2 (ja) 2012-01-11
CN1610908A (zh) 2005-04-27
CN100449551C (zh) 2009-01-07
GB0412557D0 (en) 2004-07-07
KR20040074116A (ko) 2004-08-21
AU2002343588A1 (en) 2003-07-30
DE10297636T5 (de) 2005-01-05
WO2003060779A1 (en) 2003-07-24

Similar Documents

Publication Publication Date Title
TWI312448B (en) Agent-based control architecture
TW493116B (en) Semiconductor processing techniques
JP4384093B2 (ja) プロセス状態管理システム、管理サーバ、プロセス状態管理方法及びプロセス状態管理用プログラム
TWI310971B (en) Method and apparatus for predicting device electrical parameters during fabrication
US6408220B1 (en) Semiconductor processing techniques
US20070150235A1 (en) Controller and Method to Mediate Data Collection from Smart Sensors for Fab Applications
TWI471816B (zh) 預測及排程伺服器
TW200402617A (en) Dynamic targeting for a process control system
KR101307508B1 (ko) 자동화된 작업 관리
WO2006041543A1 (en) Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
JP4261190B2 (ja) ベースライン制御スクリプトを用いてツールを制御するための方法および装置
JP2003520435A (ja) Ｆｄｃ半導体製造プロセスからトレースデータ報告を要求する方法
TW200828478A (en) Real-time fault detection and classification system in use with a semiconductor fabrication process
TW201421409A (zh) 半導體製造系統和方法
US7197370B1 (en) Method and apparatus for dynamic adjustment of an active sensor list
JP2005515623A6 (ja) 自動生産システム
CN101151865B (zh) 多协议多客户端设备服务器
JP2004531794A (ja) 複数のプロセスコントローラを統合するための方法および装置
JP4662711B2 (ja) 製造フローのスケジュール作成方法および製造システム
TW200305091A (en) System for brokering fault detection data
Hung et al. Development of an AVM system implementation framework
TW200537351A (en) Method and system for problem case packaging
Moyne Making the move to fab-wide APC.
TWI237192B (en) Methods for creating control charts using a computer system
JP2023542815A (ja) 工場間通信

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent