TWI297125B - Rfid tag and method of manufacturing the same - Google Patents

Rfid tag and method of manufacturing the same Download PDF

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Publication number
TWI297125B
TWI297125B TW094109083A TW94109083A TWI297125B TW I297125 B TWI297125 B TW I297125B TW 094109083 A TW094109083 A TW 094109083A TW 94109083 A TW94109083 A TW 94109083A TW I297125 B TWI297125 B TW I297125B
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TW
Taiwan
Prior art keywords
antenna
bumps
substrate
circuit chip
paste
Prior art date
Application number
TW094109083A
Other languages
English (en)
Other versions
TW200620124A (en
Inventor
Naoki Ishikawa
Shunji Baba
Hidehiko Kira
Hiroshi Kobayashi
Original Assignee
Fujitsu Ltd
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Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200620124A publication Critical patent/TW200620124A/zh
Application granted granted Critical
Publication of TWI297125B publication Critical patent/TWI297125B/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
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  • Wire Bonding (AREA)

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1297125 九、發明說明： 【發明戶斤屬之技術領域;3 發明領域 本發明係有關一以非接觸方式與一外部裝置交換資訊 5之射頻識別（RFID)標籤及其製造方法。部分案例中，熟習 本發明對應的技術領域者係將此說明書所提及的“RFID標 鐵稱為身為RFID標籤”的一内部成份構件（镶後物）之 “RFK)標籤鑲後物(RFID tag inlay)”。部分其他案例中，此 “RFID標籤”係稱為“無線ic標籤”。並且，此標籤包 10 含一非接觸式ID卡。 I：先前技術3 發明背景 15 20 近年來，已經提出能夠藉由無線電波與通常為讀取器/ 寫入裔的外部裝置作非接觸性資訊交換之各種不同類型的 RFID標籤。所提出的各種不同類型RFID標籤之一者係具有 一用於無線電波通信之天線圖案以及一安裝在由塑料^紙 製成的一基片上之1C晶片。此類型RFID標籤的_種可处應 用中，RFID標鐵係附接至一物件且與一外部裝置六換有 該物件之資訊以供該物件的識別或類似作用。 第1 (A)及(B)圖分別為一 rFId標籤的一範例之正視田 及剖侧視圖。 ？圖 第1(A)及1(B)圖所示的RFID標籤1係包含一天線12 設置於藉由一諸如聚對苯二甲酸乙二酯（ΡΕτ)膜等片狀材 料形成之-基底13上；-u，其經由凸塊16連接Ζ ⑤ 5 1297125 天線12 ;及一覆蓋片14，其藉由一黏劑15結合至基底13藉 以覆蓋住天線12及1C晶片11。 構成RFID標籤1之1C晶片11係能夠藉由經過天線12進 行無線通信而與一外部裝置交換資訊。 5 已經相對於此類型的RFID標籤想見包括上述用途之 各種不同使用形式。在使用此類型RFID標籤時，如何降低 RFID標籤的製造成本係已成為一項嚴重的問題，且已經多 方嘗試解決此問題。 一種降低製造成本之嘗試中，提供利用藉由混攪一金 10屬性填料（一般案例中為Ag)與一諸如環氧樹脂等樹脂材料 而製成傳導性之一膏劑材料來形成一天線之概念（日本先 行公開專利案2000-311226號(段落[0066]))。如果可利用此 用刻材料來取代傳統所使用的一諸如Cu、A1或Au等薄金屬 性材料作為一種形成天線之材料，將大幅有助於降低 15 標籤的製造成本。 如第1圖所示，當製造RFID標籤時，其中IC晶片u係經 由ic晶片11的電極上所形成之凸塊（金屬突部）16連接至身 為-片狀PET構件或類似物之形成於基扣表面上的天線 12 ’如果藉由列印_膏劑材料來形成天線12，對於ic晶片 20 11及天線12之間的連接可能產生下述問題。 第2(A)圖係顯示一使用一金屬料一天線材料之案 例’而第2(B)圖顯示一使用一膏劑作為一天線材料之案 例，以供比較之用。 由一薄片金屬所形成之一天線121(第2(A)圖）或由一膏 6 ⑤ 1297125 劑材料所形成之一天線122(第2(B)圖）係形成於由一PET所 形成之基底13上。在第2(A)及(B)圖所示的各案例中，凸塊 16係形成於1C晶片11上所形成之電極hi上。 第2(A)及(B)圖所示的各狀態係顯示一種狀態，其中具 5有凸塊16之1C晶片11係放置在上方形成有天線121或122之 基底13上以使凸塊16面對基底13且1C晶片11經由凸塊16連 接至天線121或122。 第2(A)及(B)圖中，省略了第i(B)圖所示之黏劑15及覆 蓋片14的圖示。在連接的時候，如圖式所示藉由一治具(未 10圖示）自上方來壓抵1C晶片11。藉此自凸塊16將一壓抵力施 加至天線121或122。在如第2(A)圖所示由一金屬性材料製 成之天線121的案例中，因為天線121具有高硬度，此壓抵 並無問題。在如第2(B)圖所示由一膏劑材料製成之天線122 的案例中’具有下述問題。膏劑材料係受到天線122自凸塊 15 16接收的壓抵力所變形因而順應於凸塊16的形狀，而在天 線122及凸塊16之間的連接處係造成膏劑材料的壓縮彎 折，導致圖案破裂及彎折部分處之沉降。在此例中，IC晶 片11及天線122之間無法維持所需要的絕緣距離。如果此距 離改變，RFID標籤的特徵且包括一無線通信特徵(下文稱為 20標籤特徵)係改變，當製造大量RFID標籤時導致了標籤特徵 的變異。 廣泛地實行用於將各種不同類型的1€晶片安裝在一與 RFID標籤分開之電路板上之方法。在普通案例中，即便當 使用一膏劑材料作為一電路板上的一配線材料時，許多凸 ⑤ 1297125 塊係形成於一 1C晶片上且每個凸塊具有小的壓抵力，因 此，膏劑材料的突起並非一種嚴重問題。 反之’在RFID標籤的案例中，因為設置於一ic晶片中 用以連接至天線之凸塊數量係約為二或四，每個凸塊的壓 5抵力極大而因此產生上述的沉降問題。為了降低壓抵力， 相較於放置一上方形成有許多凸塊之普通IC晶片的案例， 需要將藉由一用以放置1C晶片於基底上之裝備來放置1(^晶 片時所施加的壓抵力降低至一極小值。並且，因為基底與 1C晶片之間存在一黏劑，極難以在能夠在一段短時間中產 10生可靠連接之同時來將壓抵力降低至一極小值。 【發明内容3 發明概要 已經鑑於上述環境作出本發明，本發明提供一RFID標 籤，其使用一貧劑作為一用於一天線之材料且能夠避免由 15於凸塊沉積使標籤特徵改變之問題，並提供該RFID標籤之 一製造方法。 根據本發明，提供一第一RFID標籤，具有··一基底； 一用於通信之天線，其設置於基底上；一電路晶片，其經 由凸塊連接至天線，電路晶片經過天線進行無線通信，其 20中天線係由一膏劑形成，膏劑中係混攪一金屬性填料與一 樹脂材料；及一阻止器，其用於限制當具有凸塊的電路晶 片連接至天線時由一壓抵力所造成之凸塊的沉降，阻止器 係與凸塊相鄰地設置。 本發明的第一RF1D標籤中，提供阻止器以限制上文參 ⑥ 8 1297125 苐2(B)圖所述之沉降，藉以避免由於標籤變異導致之問 題。 本發明的第一RFID標籤中，可藉由電路晶片或基底上 所形成且具有與凸塊連接部分呈現對應的孔之一膜來形成 5阻止部。或者，可藉由與凸塊連接部分相鄰之基底的一部 分上所形成之一突部來形成阻止器。 並且，本發明的第一rFID標籤中，基底及電路晶片之 間的一間隙係可充填有一其中混擾一填料之黏劑，以當具 有凸塊的電路晶片連接至天線時將電路晶片及基底彼此固 10 定’且填料可構成阻止器。 根據本發明，提供一第二RFID標籤，具有：一基底； 一用於通信之天線，其設置於基底上；一電路晶片，其經 由凸塊連接至天線，電路晶片經過天線進行無線通信，其 中天線係由一膏劑形成，膏劑中係混攪一金屬性填料與一 15 樹脂材料；及一硬層，其用於限制當具有凸塊的電路晶片 連接至天線時由一壓抵力所造成之凸塊的沉降，該硬層係 至少設置在基底與天線之間正位於凸塊下方之位置處。 本發明的第二RFID標籤中，提供硬層以限制上文參照 第2(B)圖所述之沉降，藉以避免由於標籤特徵的變異所導 20 致之問題。 根據本發明，提供一第三RFID標籤，具有：一基底； 一用於通信之天線，其設置於基底上；一電路晶片，其經 由凸塊連接至天線，電路晶片經過天線進行無線通信，其 中天線係由一膏劑形成，膏劑中係混授一金屬性填料與_ ⑧ 9 1297125 樹脂材料；及一導電性支撐件，其用於限制當具有凸塊的 電路晶片連接至天線時由一壓抵力所造成之凸塊的沉降， 該導電性支撐件係設置在天線與凸塊之間。 本發明的第三RFID標籤中，如同本發明第一及第二態 5樣的RFID標籤之案例中，提供支撐件以限制凸塊之沉降。 因此，可穩定住RFID標籤之標籤特徵。 根據本發明，提供一第四RFT〇標籤，具有：一基底； -用於通信之天線，其設置於基底上；_電路晶片，其經 由凸塊連接至天線，電路晶片經過天線進行無線通信，其 10中天線係由-膏劑形成，膏劑中係混擾一金屬性填料與〆 樹脂材料’而位於凸塊正下方之天線部分係由一膏劑形 成，此貧劑中相較於位於凸塊正下方部分以外之部分所用 的嘗劑而言改變了金屬性填料的混授比例以限制當具有凸 塊的電路晶片連接至天線時由一壓抵力所造成之凸塊的沉 15 降。 本發明的第四RFID標籤中，緊位於凸塊下方的天線部 分所用之金屬性填料之混授比例係受到改變以限制沉降， 藉以穩定住RFID標籤的標籤特徵及第一至第三態樣的 RFID標籤之標籤特徵。 Z〇 根據本發明，提供一第五RFID標籤，具有：一基底； 用於通佗之天線，其設置於基底上；及一電路晶片，其 經由凸塊連接至天線，電路晶片經過天線進行無線通信， 其中天線係由-膏劑形成，膏劑中係混擾一對於一樹脂材 料提供所需要的傳導性之金屬性填料與該樹脂材料，而一 ⑧ 10 1297125 硬填料亦與樹脂材料混授，該硬填料係用於限制當具有凸 2的電路晶片連接至天線時由-壓抵力所造成之凸塊的沉 降。 本發_第五RFID標射，構成RnD標籤 ^其中關有硬填雖如Cu、Pd、Ni或類似物)及金屬性 =枓(譬如Ag)之膏劑形成’藉以限制沉降並狀住標鐵特 、、根據本發明，提供一用於製造一RFID標籤之第一方 10 ^包括：一天線列印步驟’其利用一其中混擾一金屬性 土、料與-樹脂材料之膏劑來列印1於通信的天線於一基 t上；-電路晶片絲步驟，其安H夠經由天線進行 〔線通k之具有凸塊的電路晶片，電路晶片及天線經由凸 塊而彼此連接；及一阻止器形成步驟，其在一與凸塊相鄰 15的位置處形成一阻止器以限制當具有凸塊的電路晶片連接 5至天線時由一壓抵力所造成之凸塊的沉降。 、、根據本發明，提供一用於製造一RFID標籤之第二方 、’包括：一天線列印步驟，其利用一其中混攪一金屬性 、料與樹脂材料之膏劑來列印一用於通信的天線於一基 20盔，一電路晶片安裝步驟，其安裝一能夠經由天線進行 f 之具有凸塊的電路晶片，電路晶片及天線經由凸 彼此連接；及—硬層形成步驟，其在基底與天線之間 、二於凸塊正下方的位置處形成一硬層以限制當具有凸塊 :電路阳片連接至天線時由_壓抵力所造成之凸塊的沉 11 ⑧ 1297125 根據本發明，提供一用於製造一RFID標籤之第三方 法，包括：一天線列印步驟，其利用一其中混授一金屬性 填料與一樹脂材料之膏劑來列印一用於通信的天線於一基 底上；一電路晶片安裝步驟，其安裝一能夠經由天線進行 5 無線通信之具有凸塊的電路晶片，電路晶片及天線經由凸 塊而彼此連接；及一支撐件形成步驟，其在天線與凸塊之 間形成一導電性支撐件以限制當具有凸塊的電路晶片連接 至天線時由一壓抵力所造成之凸塊的沉降。 鲁根據本發明，提供一用於製造一RFID標籤之第四方 10 法，包括：一天線列印步驟，其利用一其中混攪一金屬性 填料與一樹脂材料之膏劑來列印一用於通信的天線於一基 底上；及一電路晶片安裝步驟，其安裝一能夠經由天線進 行無線通信之具有凸塊的電路晶片’電路晶片及天線經由 凸塊而彼此連接，其中天線列印步驟係包括一第一列印步 15 驟，其利用其中混攪金屬性填料與樹脂材料之膏劑來列印 凸塊所連接部分以外之天線的一部分，及一第二列印步 ® 驟，其利用一其中相較於第一列印步驟中所用的膏劑改變 了金屬性填料的混攪比例之膏劑來列印凸塊所連接的天線 部分藉以在凸塊所連接的天線部分上形成一硬導電膜以限 20 制當具有凸塊的電路晶片連接至天線時由一壓抵力所造成 之凸塊的沉降。 根據本發明，提供一用於製造一RFID標籤之第五方 法，包括：一天線列印步驟，其利用一其中混擾一金屬性 填料與一樹脂材料之膏劑來列印一用於通信的天線於一基 12 1297125 底上；一電路晶片安裝步驟’其安裝—能夠經 一能夠經由天線進行
5材料之膏劑來列印用於通信的天線於基底上之步驟，而一 硬填料亦與樹脂材料混攪，該硬填料係用以限制當具有凸 塊的電路晶片連接至天線時由一壓抵力所造成之凸塊的沉 降。 圖式簡單說明 〇 第1 (A)及1 (B)圖分別為一 RFID標臧的一範例之正視圖 及剖側視圖； 第2(A)及第2(B)圖分別顯示利用一金屬作為一天線材 料之案例以及利用一膏劑作為一天線材料之案例以供比較 用； 15 第3圖為根據本發明的第一實施例之一RFID標籤的剖 视圖； 第4圖為根據本發明的第二實施例之一RFID標籤的剖 視圖； 第5圖為根據本發明的第三實施例之一 RFID標籤的剖 2G視圖； 第6(A)至(C)圖顯示一身為根據本發明的第三實施例 之一修改的一範例之RFID標籤； 第7圖為根據本發明的第四實施例之一RFID標籤的剖 视圖； ⑧ 1297125 第8圖為根據本發明的第五實施例之一rfid標籤的剖 視圖； 第9圖為根據本發明的第六實施例之一rfID標籤的剖 視圖； 5 第10圖為根據本發明的第七實施例之一RFID標籤的 剖視圖； 第11圖為根據本發明的第八實施例之一 R Π D標籤的剖 視圖； 第12圖為根據本發明的第九實施例之一RFID標籤的 10 天線部分及基底之剖視圖； 第13(A)至13(C)圖顯示一用以形成凸塊於一κ：晶片的 電極上之方法； 第14圖顯示一用以平放凸塊之方法； 第15(A)至15(C)圖顯示平放之後的凸塊； 15 第16(A)至16(D)圖顯示一用以製造如第3圖所示具有 阻止器之RFID標籤之方法，其中阻止器係由具有孔的聚醯 亞胺膜所形成； 第17(A)至17(C)圖顯示一用以製造如第4圖所示具有 一阻止器之RFID標籤之方法，其中阻止器係由一具有孔的 20 PET所形成； 第18(A)至18(C)圖顯示一用以製造如第5圖所示的 RHD標籤之方法，其中RFID標籤具有一阻止器； 第19(A)及19(B)圖顯示一用以製造如第7圖所示的 RF1D標籤之方法，其中RFID標籤包括一塑料填料； 1297125 第20(A)至20(D)圖顯示一用以製造如第8圖所示的 RFID標籤之方法； 第21(A)至21(D)圖顯示一用以製造如第9圖所示的 RFID標籤之方法； 5 第22(A)至22(D)圖顯示一用以製造如第1〇圖所示的 RFID標籤之方法； 第23(A)至23(C)圖顯示一用以製造如第11圖所示的 RFID標籤之方法； 第24(A)及24(B)圖顯示一用以製造如第12圖所示的 10 RFID標籤之方法。 I：實施方式3 較佳實施例之詳細說明 下文將參照實施例來描述本發明。 第3圖為根據本發明的第一實施例之一 ^^仍標籤的剖 15 視圖。
第3圖及下述其他圖式中，與上文參照第2圖所述的 RFH)標籤中對應之成份係以相同代號表示而不贅述。只描 述與上述RFID標籤之差異點。第3圖及下述其他圖式中，如 同第2圖，省略了對於基底13與1(：晶片n之間的黏劑15以及 2〇覆蓋住RFID標籤上部之基片14(請見第2(B)圖）的圖示。然 而’下文參照第2〇圖所述之本發明的一雜係留駐在黏劑 中。因此，黏劑顯示於第2〇圖中。並且，下述實施例中， 除非另外指明，基底13係由—PET所形成而天線m利用藉 由混攪一峨料與一諸如環氧樹脂等樹脂材料所製備之I ⑧ 15 1297125 膏劑形成。 第3圖所示的RFID標籤1A中，一在對應於凸塊的位置 處具有孔之聚醯亞胺膜21係形成於1C晶片11上。聚醯亞胺 膜21略微地低於凸塊16的高度（比凸塊16更薄）。當具有凸塊 5 16及聚醯亞胺膜21之1C晶片11連接至天線122時，聚醯亞胺 膜21作為一阻止器以限制凸塊16的沉降(請見第2(B)圖），藉 此穩定住RFID標籤的標籤特徵。 第4圖為根據本發明的第二實施例之一RFID標籤的剖 視圖。 10 第4圖所示的RFID標籤1B中，一具有孔的PET構件22 係黏附至基底13。PET構件22的厚度略微地小於凸塊16的高 度。當具有凸塊16的1C晶片11連接至天線122時，PET 22作 為一阻止器以限制凸塊16的沉降，藉此穩定住RFID標籤的 標籤特徵。 15 第5圖為根據本發明的第三實施例之一RF1D標籤的剖 視圖。 第5圖所示的RFID標籤1C中，1C晶片11連接至天線122 之前，一比凸塊16具有略微較低高度之突部（阻止器部23) 係形成於基底侧13上。當具有凸塊16的1C晶片11連接至天 20 線122時，藉由阻止器部23的功能限制了凸塊16的沉降。 第6(A)至6(C)圖顯示身為本發明第三實施例（請見第5 圖）中之一修改的一範例之一RFID標籤。第6(A)圖為剖視 圖，第6(B)圖為顯示安裝1C晶片前之基底的平面圖，而第 6(C)圖為顯示安裝1C晶片後之基底的平面圖。第6(c)圖中， 16 ⑧ 1297125 1C晶片的位置只以虛線顯示。 並且，第6(A)至6(C)圖所示的RFID標籤1C，中，1C晶片 11連接至天線122之前，一比凸塊16具有略微較低高度之突 部（阻止器部23)係形成於基底側13上，如同第5圖所示的案 5例。當具有凸塊16的1C晶片11連接至天線122時，藉由阻止 器部23的功能限制了凸塊16的沉降。第6(A)至6(C)圖所示的 RFID 1C，之案例中，阻止器部23係形成於上方可供安裝1(： 晶片11之基底13部分上，但上方可供凸塊16連接之部分則 除外。亦即，阻止器部23係延伸以充填於天線122兩端之間 10不存在天線部分的幾乎整體區域。如果阻止器部23符合不 存在天線圖案部分之區域，在1C晶片11安裝於基底13上 時’可能維持1C晶片11的平衡(姿態），並改良ic晶片11與基 底13之間的親密接觸。 第7圖為根據本發明第四實施例中之一^^仍標籤的剖 15 視圖。 第7圖所示的RHD標籤1D中，一比凸塊16高度具有略 微較小直徑之塑料填料24係與一黏劑（未圖示）混攪。當具有 凸塊16的1C晶片11連接至天線122時，塑料填料24係作為一 用於限制凸塊16的沉降之阻止器。 20 第8圖為根據本發明第五實施例之一RFID標籤的剖視 圖。 第8圖所示的RF1D標籤中，一硬樹脂層25係設置於由 一PET形成的基底13與天線122之間。當具有凸塊16的1C晶 片11連接至天線122時，由於存在有硬樹脂層25而限制了凸 17 ⑧ 1297125 塊16的沉降。 第9圖為根據本發明第六實施例之一RFID標籤的剖視 圖。 第9圖所示的RFID標籤1F中，一比基底13更硬之PET 5片26係放置在由一PET形成的基底13與天線122之間。當具 有凸塊16的1C晶片11連接至天線122時，由於存在有硬PET 片26而限制了凸塊16的沉降，如同第8圖所示的RFID標籤 1E之案例。 第10圖為根據本發明第七實施例之一RFID標籤的剖 10 視圖。 第10圖所示的RFID標籤1G中，由一金屬製成的支撐件 27係配置在與凸塊16位置呈現對應之基底13上的天線122 部分上。凸塊16直接地連接至支撐件27且經由支撐件27連 接至天線122。此RFID標籤1G的案例中，由於存在有支撐 15 件27而防止了凸塊16的沉降。 第11圖為根據本發明第八實施例之一 RFID標籤的剖視 圖。 第11圖所示的RFID標籤1H中，將被連接至凸塊16之天 線122的凸塊安裝部122a之Ag填料充填因數相對於凸塊安 20裝部122a以外的部分而言係增高而使凸塊安裝部122a比其 他部分具有更高硬度’_當天線122自减16接收壓抵力 時限制了凸塊16的沉降。 第12圖為根據本發明第九實施例之一RFID標籤的基 底及天線部分之剖視圖。 18 ⑧ 1297125 習 誤。因此，—二:未:慮到由於上述沉降所造成的任何失 已經主要基於用來對=用—貧劑作為天線122的材料時， 作為天線之目的來進劑提供所需要的傳導性以使膏劑 部分(A)所示之仃—痛財狀賴，譬如第12圖 脂材料之㈣ g填料或類似物與—諸如環氧樹脂等樹
10 U之安γ f /目^⑼所7^具有基底及天線之RFID標籤 劑作：一用來對於^提供所需要剛 蓉擬1 L之諸如#Ag填料等填料係混授—諸如環氧樹脂 ^材料❿諸如Cu、Pd或Ni等-用以對於膏劑形成的 、、、、M、所而要的硬度之填料28係亦混攪樹脂材料。利用 此授此等填料之㈣來形成—天線咖。利用此方式，可 P方止來自凸塊16的壓抵力所造成之凸糾的沉降。 現在將描述上述各種不同RFID標籤1A至II之製造方 15 法0 第13(A)至13(C)圖顯示一用於形成凸塊於1〇晶片的電 極上之方法。 首先使付一形成為凸塊之細金屬線30自一具有，孔 之治具20梢部突起，如第13(A)圖所示，且造成細金屬線3〇 20與一放電電極40之間的放電。位於梢部之細金屬線30的一 部分係被放電能量融化以形成一金屬球31。 隨後，金屬球31壓抵住IC晶片η的電極m，且超音波 經由治具20施加至金屬球31，如第13(B)圖所示。金屬球31 藉由超音波接合至1C晶片11的電極hi。當治具2〇移除時， ⑧ 19 1297125 位於足部之金屬球31及細金屬線30係撕除以在ic晶片11的 電極111上形成呈現原始形式之凸塊，如第13(C)圖所示。 第14圖顯示一種用於平放凸塊之方法，而第i5(a)至 15(C)圖顯示平放之後的凸塊。 5 如第13圖所示形成於1C晶片11的電極ill上之後，呈現 原始形式32之凸塊係壓抵在一玻璃板5〇的一扁平表面上， 如第14圖所示。選擇此壓抵的負荷及壓抵高度以改變凸塊 的形狀。亦即，在低負荷高位置壓抵之案例中係形成具有 弟15 (A)圖所不形狀之凸塊16，在中負荷中位置壓抵之案例 10中係形成具有第15(B)圖所示形狀之凸塊16 ;在高負荷低位 置壓抵之案例中係形成具有第15(C)圖所示形狀之凸塊16。 第16(A)至16(D)圖顯示一用以製造第3圖所示具有阻 止窃之RFID標籤之方法，其中阻止器係由具有孔的聚醯亞 胺膜所形成。 15 聚醯亞胺膜21係形成於上方設有電極111之1C晶片11 的表面上（第16(A)圖），只有對應於電極lu之聚醯亞胺膜21 部分藉由雷射機械加工或蝕刻加以移除，因此形成了與上 方將形成凸塊的電極111呈現對應地設有孔212之聚醯亞胺 膜21(第16(B)圖）。隨後，呈現原始形式32的凸塊係藉由第 20 13(A)至13(C)圖所示的方法形成於電極111上，如第16(C) 圖所示。藉由第14圖及15⑷至15⑹圖所示的方法在呈現原 始形式32的凸塊上進行平放以形成比聚醯亞胺膜21具有略 微較高高度之凸塊16。面對基底13及天線122之凸塊16係彼 此連接（第16(D)圖）。在此時，聚醯亞胺膜21作為一阻止器 ⑧ 20 1297125 以限制凸塊16的沉降。 第17(A)至17(C)圖顯示一用於製造如第4圖所示具有 阻止器之RFID標籤之方法，其中阻止器係由_具有孔的 PET形成。 5 *有孔221的PET構件22係製備（第17(A)圖）及施加至 上方形成有天線122之基底13，孔221係對準於凸塊連接部 (第17(B)圖）。隨後安裝IC晶片η (第17(c)圖）。在此時，ρΕτ 構件22作為一阻止器以防止凸塊16的沉降。 第18(A)至18(C)圖顯示一用於製造如第5圖所示具有 10阻止器之RFID標籤之方法。 一由一絕緣材料製成的膜231係形成於上方形成有天 線122之基底13表面上（第18(a)圖）。譬如可使用聚乙烯、環 氧樹脂、聚酯或類似物來作為此膜231的材料。因此形成的 膜231係具有比隨後形成的凸塊16高度略微更小之一厚 15度。膜231的不需要部分係藉由化學姓刻移除且留下了與凸 塊所連接之天線122部分相鄰之膜231的一部分，藉此形成 基底13上之阻止器部23(第18(B)圖）。具有凸塊16的〗(：晶片 11係安裝在基底13上而凸塊16及天線122彼此相連接。因為 阻止器部23形成為比連接前的凸塊16具有略微更低的高 20度，藉由阻止器部23的功能來防止凸塊16的沉降。 雖然已經參照第18(A)至18(C)圖來描述根據第三實施 例之用於製造RFID標籤之方法，亦可藉由形成阻止器部23 來製造身為第三實施例的修改之一範例之第6(八)至6(c)圖 所示的RF標籤，但阻止器部23的形狀如第6(B)圖所示。 21 ⑧ 1297125 第19(A)及19(B)圖顯示一用於製造如第7圖所示包括 塑料填料的RFID標籤之方法。 如第19(A)圖所示，混攪有塑料填料24之黏劑15係施加 至上方可供形成天線122之基底13的一部分。施加有塑料填 5料24之基底13部分係與凸塊所連接的部分相鄰並被界定在 填料未分散至凸塊所連接部分之位置處。藉由自一喷嘴梢 部將含有塑料填料24之黏劑施加至基底13來進行此施加作 用。 隨後，具有凸塊16的1C晶片11係安裝在基底13上而凸 1〇塊16與天線122彼此相連接，如第19(B)圖所示。然而，在 此時，因為塑料填料24具有比凸塊16高度略微更小之一直 徑，凸塊16係可靠地連接至天線122，而塑料填料24作為一 阻止器以防止凸塊16的沉降。 第20(A)至20(D)圖顯示一用於製造第8圖所示的RnD 15 之方法。 在此例中，一其中形成有一孔作為天線122的一圖案之 列印母片_放置在硬樹脂片251上，且藉由一橡皮親_ 驅迫入列印母片8G的孔内來列印—提供作為天線122材料 之膏劑83(第20(C)圖）。 20 ^後，移除用於形成突部之列印母>} 8G，然後加以乾 燥。藉此形成天線122。 可使用一在所需要位置處藉由蝕刻形成有孔之薄…或 SUS板或類似物來作為列印母片8〇。 因為已熟知用於列印膏劑之技術，在其他實施例的描 22 ⑧ 1297125 述中並未敘述用於製造天線122之方法。然而，其他實施例 中可利用與上述相同之方法來形成天線122。 天線122已經列印在硬樹脂層25上之後，以凸塊16壓抵 在天線122上的方式來安裝1C晶片11，如第20(D)圖所示。 5在此時’由於存在有硬樹脂層25藉以防止凸塊16的沉降。 第21(A)至21(D)圖顯示一用於製造第9圖所示的RFID 標戴之方法。 在此例中，製備一比基底13更硬由PET形成的PET片 26(第21(A)圖）。硬PET片26係藉由黏劑252黏附至基底13(第 10 21(B)圖）。使用一以聚丙烯為基礎的軟PET作為基底13的材 料。可使用一聚酯或耐綸片作為黏附至基底13之硬PET片 26 〇 後續的製造步驟係與第20(C)及20(D)圖所示者相同。 天線122列印在PET片26上（第21(C)圖）且安裝1C晶片11(第 15 21Ρ)圖）。在此安裝的時候，由於存在有硬PET片26而防止 凸塊16的沉降。 第22(A)至22(D)圖顯示一用於製造第10圖所示的RFID 標戴之方法。 在此例中，天線122已經列印在基底13上（第22(A)圖） 20 之後，一導電性黏劑或一感壓性黏劑271係供應至與凸塊連 接之天線122部分（第22(B)圖）而金屬性支撐件27黏附至天 線122表面（第22(C)圖）。隨後，安裝1C晶片11以使凸塊16 放置在支撐件27上（第22(D)圖）。在此安裝的時候，由於存 在有支撐件27而防止凸塊16的沉降。 23 ⑧ 1297125 第23(A)至23(C)圖顯示一用於製造第u圖所示的RFID 標籤之方法。 在此例中，製備一用於列印與凸塊連接的凸塊安裝部 以外的天線部分之列印罩幕8〇1，且利用一橡皮輥81及一其 5中混攪一諸如環氧樹脂等樹脂材料之列印膏劑8 3將此部分 列印在基底13上（第23(A)圖）。隨後，製備一用於列印天線 的凸塊安裝部之列印罩幕802,且利用一橡皮輥81及一其中 改變Ag填料的混攪比以相較於列印凸塊安裝部以外的部分 所使用之貧劑83使硬度增高之列印膏劑831將凸塊安裝部 1〇列印在基底13上（第23(B)圖）。包括凸塊安裝部122&之天線 122已經利用此方式形成之後，IC晶片u係安裝在基底13上 (第23(C)圖）。在此安裝的時候，因為與凸塊16連接之凸塊 安裝部122a具有高硬度而防止凸塊16的沉降。 第24(A)及24(B)圖顯示一用於製造第12圖所示的灯1£) 15 標籤之方法。 在此例中，利用一膏劑832作為天線材料將天線列印在 基底13上，膏劑832中一用以硬化至夠高程度以有效地限制 凸塊沉降之諸如Cu、Pd或Ni填料等濾器係與一諸如環氧樹 脂等樹脂材料以及一對於樹脂材料提供天線所需要的傳導 2〇 性之Ag填料加以混攪：（第24(A)圖）。隨後，在上方已形成有 硬天線122b之基底13上，安裝1C晶片11以使形成於ic晶片 11及天線122b上之凸塊16彼此連接（第24(B)圖）。在此時， 因為天線122b具有夠高硬度而防止凸塊16的沉降。 ⑧ 1297125 L圖式簡單說明】 第1(A)及1(B)圖分別為一RHD標籤的一範例之正視圖 及剖側視圖； 第2(A)及第2(B)圖分別顯示利用一金屬作為一天線材 5 料之案例以及利用一膏劑作為一天線材料之案例以供比較 用； 第3圖為根據本發明的第一實施例之一RFID標籤的剖 視圖； • 第4圖為根據本發明的第二實施例之一RFID標籤的剖 10 視圖； 第5圖為根據本發明的第三實施例之一RFID標籤的剖 視圖， 第6(A)至（C)圖顯示一身為根據本發明的第三實施例 之一修改的一範例之RF1D標籤； 15 第7圖為根據本發明的第四實施例之一 R Π D標籤的剖 視圖， ® 第8圖為根據本發明的第五實施例之一 RFID標籤的剖 視圖； 第9圖為根據本發明的第六實施例之一 R Π D標籤的剖 20 視圖； 第10圖為根據本發明的第七實施例之一RF1D標籤的 剖視圖； 第11圖為根據本發明的第八實施例之一 R FI D標籤的剖 視圖； ⑧ 1297125 第12圖為根據本發明的第九實施例之一RFID標籤的 天線部分及基底之剖視圖； 第13(A)至13(C)圖顯示一用以形成凸塊於一1C晶片的 電極上之方法； 5 第14圖顯示一用以平放凸塊之方法； 第15(A)至15(C)圖顯示平放之後的凸塊； 第16(A)至16(D)圖顯示一用以製造如第3圖所示具有 阻止器之RF1D標籤之方法，其中阻止器係由具有孔的聚醯 § 亞胺膜所形成； 10 第17(A)至17(C)圖顯示一用以製造如第4圖所示具有 一阻止器之RHD標籤之方法，其中阻止器係由一具有孔的 PET所形成； 第18(A)至18(C)圖顯示一用以製造如第5圖所示的 RFID標籤之方法，其中RFID標籤具有一阻止器； 15 第19(A)及19(B)圖顯示一用以製造如第7圖所示的 RFID標籤之方法，其中RFID標籤包括一塑料填料； • 第20(A)至20(D)圖顯示一用以製造如第8圖所示的 RHD標籤之方法； 第21(A)至21(D)圖顯示一用以製造如第9圖所示的 20 RFID標籤之方法； 第22(A)至22(D)圖顯示一用以製造如第10圖所示的 RFID標籤之方法； 第23(A)至23(C)圖顯示一用以製造如第11圖所示的 RFID標籤之方法； 26 罅1297125 第24(A)及24(B)圖顯示一用以製造如第12圖所示的
RFID標籤之方法。 【主要元件符號說明】 1，1A，1B，1C，1C，，1D，1E，1G，1H， II RFID···標籤 11.. . 1C 晶片 12，121，122，1221)...天線 13.. .基底 14.. .覆蓋片 15,252···黏劑 16…凸塊 20.. .治具 21.. .聚醯亞胺膜 22.. .PET 構件 23.. .阻止器部 24.. .塑料填料 25…硬樹脂層 26.. .PET 片 27.. .金屬性支撐件 28…填料 30…細金屬線 31.. .金屬球 32.. .原始形式 40.. .放電電極 50.. .玻璃板 80.··列印母片 81.. .橡皮親 83,831…列印膏劑 111.. .電極 122a...凸塊安裝部 122b···硬天線 212,221·.·孔 231…膜 251…硬樹脂片 271.. .導電性黏劑或感壓性黏劑 801，802··.列印罩幕 832…膏劑 27 ⑧

Claims (1)

1297125 十、申請專利範圍： 丄.一種射頻識別(rfID)標籤，包含· 一基底； 一用於通信之天線，其設置於該基底上； 一電路晶片，其經由凸塊連接至該天線，該電路晶 片經過該天線進行無線通信， 其中該天線係、由—膏劑形成，該膏劑中魏授一金 屬性填料與一樹脂材料；及 “ 阻止器，其用於限制當該具有凸塊的電路晶片連 0 接至該天料由—壓抵力所造成之該等凸塊的沉降，該 阻止器係與該等凸塊相鄰地設置。 2·如申請專利範圍第i項之RFm標籤，其中該阻止部係藉 由膜形成，其中該膜係形成於該電路晶片或該基底上 且具有與該等凸塊所連接部分呈現對應之孔。 15 3·如申請專利範圍第1項之RHD標籤，其中該阻止部係由 大邛形成，其中該突部係形成於與該等凸塊所連接部 分相鄰之該基底的一部分上。 4·如申請專利範圍第i項之RFID標籤，其中當該具有凸绳 ，的電路晶#連接至該天線時，該基底及該電路晶片之間 的間隙係充填有-其中混授一填料之黏劑以將該電 路晶片及與該基底彼此固定；&影真料係構成該 器。 1 5· 一種射頻識別(RFID)標籤，包含： 一基底； ⑧ 28 —用於通信之天線，其設置於該基底上； —電路晶片，其經由凸塊連接至該天線，該電路晶 ▲過該天線進行無線通信，其中該天線係由一膏劑形 成，該膏劑中係混攪一金屬性填料與一樹脂材料；及 —硬層’其用於限制當該具有凸塊的電路晶片連接 至該天線時由一壓抵力所造成之該等凸塊的沉降，該硬 層係至少設置在該基底與該天線之間正位於該等凸塊 下方之位置。 —種射頻識別(RFID)標籤，包含： 一基底； 一用於通信之天線，其設置於該基底上； 一電路晶片，其經由凸塊連接至該天線，該電路晶 片經過該天線進行無線通信， 其中該天線係由一膏劑形成，該膏劑中係混攪一金 屬性填料與一樹脂材料；及一導電性支撐件，其用於限 制當該具有凸塊的電路晶片連接至該天線時由一壓抵 力所造成之該等凸塊的沉降，該導電性支撐件係設置在 該天線與該等凸塊之間。 一種射頻識別(RFID)標籤，包含： 一基底； 一用於通信之天線，其設置於該基底上；及 一電路晶片，其經由凸塊連接至該天線，該電路晶 片經過該天線進行無線通信， 其中該天線係由一膏劑形成，該膏劑中係混擾一金 屬1±填料與-樹脂材料，而位於該等凸塊正下方之該天 、戸刀係自θ劑形成，該膏劑中相較於位於該等凸塊 正下方部分以外之部分所用的膏劑而言改變了該金屬 性填料的混攪比例以限制當該具有凸塊的電路晶片連 接至該天線時由—壓抵力所造成之料凸塊的沉降。 一種射頻識別(RFID)標籤，包含： 一基底； 一用於通信之天線，其設置於該基底上；及 -電路晶片’其經由凸塊連接至該天線，該電路晶 片經過該天線進行無線通信， 其中天線係由—膏編彡成，該膏劑巾係混擾-對於 一樹脂材料提供該天線所需要的傳導性之金屬性填料 與該樹脂材料，而-硬填料亦與該樹脂材料混攪，該硬 填料係驗限制當該具有凸塊的電路晶片連接至該天 線時由-壓抵力所造成之該等凸塊的沉降。 -種用於製造-射頻朗(RFID)標籤之方法，包含： 一天線列印步驟，其利用-其中混攪-金屬性填料 與-樹脂材料之膏劑來列印—用於通信的天線於一基 底上； -電路晶片安|步驟，其安裝—能夠經由該天線進 行無線通信之具有凸塊的電路晶片，該電路晶片及該天 線經由該等凸塊而彼此連接；及 一阻止器形成步驟’其在-與該等凸塊相鄰的位置 處形成-阻止器以限制當該具有凸塊的電路晶片連接 1297125 至該天線時由一壓抵力所造成之該等凸塊的沉降。 10. —種用於製造一射頻識別（RFID)標籤之方法，包含： 一天線列印步驟，其利用一其中混攪一金屬性填料 與一樹脂材料之膏劑來列印一用於通信的天線於一基 5 底上； 一電路晶片安裝步驟，其安裝一能夠經由該天線進 行無線通信之具有凸塊的電路晶片5該電路晶片及該天 線經由該等凸塊而彼此連接；及 • 一硬層形成步驟，其在該基底與該天線之間至少於 10 該等凸塊正下方的位置處形成一硬層以限制當該具有 凸塊的電路晶片連接至該天線時由一壓抵力所造成之 該等凸塊的沉降。 11. 一種用於製造一射頻識別（RF1D)標籤之方法，包含： 一天線列印步驟，其利用一其中混攪一金屬性填料 15 與一樹脂材料之膏劑來列印一用於通信的天線於一基 底上； ® 一電路晶片安裝步驟，其安裝一能夠經由該天線進 行無線通信之具有凸塊的電路晶片’該電路晶片及該天 線經由該等凸塊而彼此連接；及 20 一支撐件形成步驟，其在該天線與該等凸塊之間形 成一導電性支撑件以限制當該具有凸塊的電路晶片連 接至該天線時由一壓抵力所造成之該等凸塊的沉降。 12. —種用於製造一射頻識別（RFID)標籤之方法，包含： 一天線列印步驟，其利用一其中混攪一金屬性填料 31 ⑧ 1297125 與一樹脂材料之膏劑來列印一用於通信的天線於一基 底上；及 一電路晶片安裝步驟，其安裝一能夠經由該天線進 行無線通信之具有凸塊的電路晶片’該電路晶片及該天 5 線經由該等凸塊而彼此連接， 其中該天線列印步驟係包括一第一列印步驟，其利 用該其中混攪該金屬性填料與該樹脂材料之膏劑來列 印該等凸塊所連接部分以外之該天線的一部分，及一第 ® 二列印步驟，其利用一其中相較於該第一列印步驟中所 10 使用的膏劑改變了該金屬性填料的混攪比例之膏劑來 列印該等凸塊所連接的天線部分藉以在該等凸塊所連 接的天線部分上形成一硬導電膜以限制當該具有凸塊 的電路晶片連接至該天線時由一壓抵力所造成之該等 凸塊的沉降。 15 13.—種用於製造一射頻識別(RF1D)標籤之方法，包含： 一天線列印步驟，其利用一其中混攪一金屬性填料 ® 與一樹脂材料之膏劑來列印一用於通信的天線於一基 底上； 一電路晶片安裝步驟，其安裝一能夠經由該天線進 20 行無線通信之具有凸塊的電路晶片’該電路晶片及該天 線經由該等凸塊而彼此連接， 其中該天線列印步驟係為一利用一其中混攪一對 於該樹脂材料提供該天線所需要的傳導性之金屬性填 料與該樹脂材料之膏劑來列印該用於通信的天線於該 32 ⑧ 1297125 基底上之步驟，而一硬填料亦與該樹脂材料混攪，其中 該硬填料係用以限制當該具有凸塊的電路晶片連接至 該天線時由一壓抵力所造成之該等凸塊的沉降。 33
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