TWI295765B - - Google Patents
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- Publication number
- TWI295765B TWI295765B TW94146178A TW94146178A TWI295765B TW I295765 B TWI295765 B TW I295765B TW 94146178 A TW94146178 A TW 94146178A TW 94146178 A TW94146178 A TW 94146178A TW I295765 B TWI295765 B TW I295765B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- fan
- heat source
- base
- heat pipe
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 238000009434 installation Methods 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 210000003746 feather Anatomy 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094146178A TW200725238A (en) | 2005-12-23 | 2005-12-23 | Slim type heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094146178A TW200725238A (en) | 2005-12-23 | 2005-12-23 | Slim type heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200725238A TW200725238A (en) | 2007-07-01 |
| TWI295765B true TWI295765B (cg-RX-API-DMAC7.html) | 2008-04-11 |
Family
ID=45068534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094146178A TW200725238A (en) | 2005-12-23 | 2005-12-23 | Slim type heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200725238A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401563B (zh) * | 2008-06-27 | 2013-07-11 | Foxconn Tech Co Ltd | 散熱裝置 |
-
2005
- 2005-12-23 TW TW094146178A patent/TW200725238A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401563B (zh) * | 2008-06-27 | 2013-07-11 | Foxconn Tech Co Ltd | 散熱裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200725238A (en) | 2007-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |