TWI302484B - - Google Patents
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- Publication number
- TWI302484B TWI302484B TW94114897A TW94114897A TWI302484B TW I302484 B TWI302484 B TW I302484B TW 94114897 A TW94114897 A TW 94114897A TW 94114897 A TW94114897 A TW 94114897A TW I302484 B TWI302484 B TW I302484B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- pipe
- heat sink
- fins
- dissipating
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094114897A TW200639014A (en) | 2005-05-09 | 2005-05-09 | Assembling and forming method of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094114897A TW200639014A (en) | 2005-05-09 | 2005-05-09 | Assembling and forming method of heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200639014A TW200639014A (en) | 2006-11-16 |
| TWI302484B true TWI302484B (cg-RX-API-DMAC7.html) | 2008-11-01 |
Family
ID=45070493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094114897A TW200639014A (en) | 2005-05-09 | 2005-05-09 | Assembling and forming method of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200639014A (cg-RX-API-DMAC7.html) |
-
2005
- 2005-05-09 TW TW094114897A patent/TW200639014A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200639014A (en) | 2006-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |