TWI292085B - Resist composition for euv and process for forming resist pattern - Google Patents
Resist composition for euv and process for forming resist pattern Download PDFInfo
- Publication number
- TWI292085B TWI292085B TW94130565A TW94130565A TWI292085B TW I292085 B TWI292085 B TW I292085B TW 94130565 A TW94130565 A TW 94130565A TW 94130565 A TW94130565 A TW 94130565A TW I292085 B TWI292085 B TW I292085B
- Authority
- TW
- Taiwan
- Prior art keywords
- euv
- group
- integer
- photoresist composition
- acid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
- C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004262306A JP2006078744A (ja) | 2004-09-09 | 2004-09-09 | Euv用レジスト組成物およびレジストパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200617602A TW200617602A (en) | 2006-06-01 |
TWI292085B true TWI292085B (en) | 2008-01-01 |
Family
ID=36036281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94130565A TWI292085B (en) | 2004-09-09 | 2005-09-06 | Resist composition for euv and process for forming resist pattern |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006078744A (ja) |
KR (1) | KR20070057211A (ja) |
TW (1) | TWI292085B (ja) |
WO (1) | WO2006027996A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100900173B1 (ko) | 2004-02-20 | 2009-06-02 | 도오꾜오까고오교 가부시끼가이샤 | 패턴 형성 재료용 기재, 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 |
JP3946715B2 (ja) | 2004-07-28 | 2007-07-18 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
JP4468119B2 (ja) | 2004-09-08 | 2010-05-26 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
JP4837323B2 (ja) | 2004-10-29 | 2011-12-14 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法および化合物 |
US7981588B2 (en) | 2005-02-02 | 2011-07-19 | Tokyo Ohka Kogyo Co., Ltd. | Negative resist composition and method of forming resist pattern |
JP4959171B2 (ja) | 2005-04-15 | 2012-06-20 | 東京応化工業株式会社 | 化合物、溶解抑制剤、ポジ型レジスト組成物、レジストパターン形成方法 |
JP5138157B2 (ja) | 2005-05-17 | 2013-02-06 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
WO2006134811A1 (ja) * | 2005-06-13 | 2006-12-21 | Tokyo Ohka Kogyo Co., Ltd. | 多価フェノール化合物、化合物、ポジ型レジスト組成物およびレジストパターン形成方法 |
JP4813103B2 (ja) | 2005-06-17 | 2011-11-09 | 東京応化工業株式会社 | 化合物、ポジ型レジスト組成物およびレジストパターン形成方法 |
JP4732038B2 (ja) | 2005-07-05 | 2011-07-27 | 東京応化工業株式会社 | 化合物、ポジ型レジスト組成物およびレジストパターン形成方法 |
WO2008044568A1 (fr) * | 2006-10-13 | 2008-04-17 | Honshu Chemical Industry Co., Ltd. | Nouveau bis(formylphényl)alcane et nouveau phénol polynucléaire dérivé de celui-ci |
JP2008164904A (ja) * | 2006-12-28 | 2008-07-17 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
JP2009053665A (ja) * | 2007-08-02 | 2009-03-12 | Fujifilm Corp | 感光性組成物及び該感光性組成物を用いたパターン形成方法 |
JP4977747B2 (ja) * | 2009-12-10 | 2012-07-18 | 東京エレクトロン株式会社 | 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
JP2015015291A (ja) * | 2013-07-03 | 2015-01-22 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システム、基板処理方法及び基板処理用記録媒体 |
JP6293645B2 (ja) | 2013-12-27 | 2018-03-14 | 東京エレクトロン株式会社 | 基板処理システム |
JP6337757B2 (ja) | 2014-01-20 | 2018-06-06 | 東京エレクトロン株式会社 | 露光装置、レジストパターン形成方法及び記憶媒体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10123703A (ja) * | 1996-10-18 | 1998-05-15 | Fuji Photo Film Co Ltd | ポジ型感光性組成物 |
JP2002099088A (ja) * | 2000-09-26 | 2002-04-05 | Yasuhiko Shirota | 感放射線性組成物 |
JP4082201B2 (ja) * | 2002-12-12 | 2008-04-30 | Jsr株式会社 | 感放射性樹脂組成物 |
-
2004
- 2004-09-09 JP JP2004262306A patent/JP2006078744A/ja active Pending
-
2005
- 2005-09-01 WO PCT/JP2005/016011 patent/WO2006027996A1/ja active Application Filing
- 2005-09-01 KR KR1020077007019A patent/KR20070057211A/ko not_active Application Discontinuation
- 2005-09-06 TW TW94130565A patent/TWI292085B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200617602A (en) | 2006-06-01 |
JP2006078744A (ja) | 2006-03-23 |
KR20070057211A (ko) | 2007-06-04 |
WO2006027996A1 (ja) | 2006-03-16 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |