TWI289940B - Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board - Google Patents
Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board Download PDFInfo
- Publication number
- TWI289940B TWI289940B TW94114530A TW94114530A TWI289940B TW I289940 B TWI289940 B TW I289940B TW 94114530 A TW94114530 A TW 94114530A TW 94114530 A TW94114530 A TW 94114530A TW I289940 B TWI289940 B TW I289940B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- wiring board
- emitting diode
- led
- printed wiring
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract 8
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000012780 transparent material Substances 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 6
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 6
- 239000004417 polycarbonate Substances 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 210000004508 polar body Anatomy 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 2
- -1 acryl Chemical group 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005076410A JP2006261366A (ja) | 2005-03-17 | 2005-03-17 | プリント配線板へのｌｅｄ実装方法およびｌｅｄ実装プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200635080A TW200635080A (en) | 2006-10-01 |
| TWI289940B true TWI289940B (en) | 2007-11-11 |
Family
ID=37100273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94114530A TWI289940B (en) | 2005-03-17 | 2005-05-05 | Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006261366A (enrdf_load_stackoverflow) |
| TW (1) | TWI289940B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101107590B1 (ko) | 2011-04-05 | 2012-01-25 | 안복만 | 발광소자 패키지의 제조방법 |
| CN103296185A (zh) * | 2012-03-02 | 2013-09-11 | 河南森源电气股份有限公司 | 一种倒梯形led支架及其led光源 |
| US10763414B2 (en) | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107483A (ja) * | 1986-10-22 | 1988-05-12 | Matsushita Electric Ind Co Ltd | ブラシレスモ−タ |
| JP2593703B2 (ja) * | 1987-12-24 | 1997-03-26 | 三菱電線工業株式会社 | 発光ダイオード照明具 |
| JPH11298050A (ja) * | 1998-04-10 | 1999-10-29 | Mitsubishi Plastics Ind Ltd | 窪み付きメタルコア印刷回路基板およびこれを用いた照明具 |
| JP2000031548A (ja) * | 1998-07-09 | 2000-01-28 | Stanley Electric Co Ltd | 面実装型発光ダイオードおよびその製造方法 |
| JP2001148514A (ja) * | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | 照明光源 |
| JP4139634B2 (ja) * | 2002-06-28 | 2008-08-27 | 松下電器産業株式会社 | Ｌｅｄ照明装置およびその製造方法 |
-
2005
- 2005-03-17 JP JP2005076410A patent/JP2006261366A/ja active Pending
- 2005-05-05 TW TW94114530A patent/TWI289940B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006261366A (ja) | 2006-09-28 |
| TW200635080A (en) | 2006-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |