TW200635080A - Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board - Google Patents

Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board

Info

Publication number
TW200635080A
TW200635080A TW094114530A TW94114530A TW200635080A TW 200635080 A TW200635080 A TW 200635080A TW 094114530 A TW094114530 A TW 094114530A TW 94114530 A TW94114530 A TW 94114530A TW 200635080 A TW200635080 A TW 200635080A
Authority
TW
Taiwan
Prior art keywords
led
packaging
printed
wiring board
recess
Prior art date
Application number
TW094114530A
Other languages
Chinese (zh)
Other versions
TWI289940B (en
Inventor
Noboru Tanaka
Original Assignee
Noboru Tanaka
Ke Guang Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noboru Tanaka, Ke Guang Yu filed Critical Noboru Tanaka
Publication of TW200635080A publication Critical patent/TW200635080A/en
Application granted granted Critical
Publication of TWI289940B publication Critical patent/TWI289940B/en

Links

Landscapes

  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

In the traditional method for packaging LED to printed-wiring board, the miniaturization of LED packaging printed-wiring board is difficult to be realized because of the ease of soldering, the minimum size limitation derived from the size of LED device, and the limitation of temperature rise derived from the heat generated by LED. The purpose of the present invention is to provide a method for packaging an LED to a printed-wiring board for facilitating miniaturization by increasing packaging density in the LED, and for extending the lifetime of the LED by increasing heat radiation effect, and to provide an LED packaging printed-wiring board. In the method for packaging the LED, a recess in a truncated cone shape having a section in an inverted trapezoidal shape having a wiring circuit is created on a metal substrate that also serves as a heat sink and has improved heat conduction, an LED bare chip is loaded for fixing and wiring, the upper surface of the bare chip is sealed by a transparent material, such as glass, acryl, silicone, epoxy, and polycarbonate, and a transparent plate is set to be in a flat or convex lens shape. A metal substrate is exposed to the sidewall of a recess in a truncated cone shape having a section in an inverted trapezoidal shape or a metal film is formed, and emitted rays from the LED bare chip to the sidewall of the recess are reflected so that they go in the direction of the front.
TW94114530A 2005-03-17 2005-05-05 Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board TWI289940B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005076410A JP2006261366A (en) 2005-03-17 2005-03-17 Method for packaging led to printed-wiring board, and led packaging printed-wiring board

Publications (2)

Publication Number Publication Date
TW200635080A true TW200635080A (en) 2006-10-01
TWI289940B TWI289940B (en) 2007-11-11

Family

ID=37100273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94114530A TWI289940B (en) 2005-03-17 2005-05-05 Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board

Country Status (2)

Country Link
JP (1) JP2006261366A (en)
TW (1) TWI289940B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101107590B1 (en) 2011-04-05 2012-01-25 안복만 Light emitting device package and manufacturing method the same
CN103296185A (en) * 2012-03-02 2013-09-11 河南森源电气股份有限公司 Inverted trapezoidal LED support and LED light source thereof
US10763414B2 (en) 2017-12-18 2020-09-01 Rohm Co., Ltd. Semiconductor light-emitting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107483A (en) * 1986-10-22 1988-05-12 Matsushita Electric Ind Co Ltd Brushless motor
JP2593703B2 (en) * 1987-12-24 1997-03-26 三菱電線工業株式会社 Light-emitting diode lighting
JPH11298050A (en) * 1998-04-10 1999-10-29 Mitsubishi Plastics Ind Ltd Metal core printer circuit board with bent and lighting device using the same
JP2000031548A (en) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd Surface mount light-emitting diode and its manufacture
JP2001148514A (en) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd Illuminating light source
JP4139634B2 (en) * 2002-06-28 2008-08-27 松下電器産業株式会社 LED lighting device and manufacturing method thereof

Also Published As

Publication number Publication date
JP2006261366A (en) 2006-09-28
TWI289940B (en) 2007-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees