TW200635080A - Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board - Google Patents
Method for packaging LED to printed-wiring board, and LED packaging printed-wiring boardInfo
- Publication number
- TW200635080A TW200635080A TW094114530A TW94114530A TW200635080A TW 200635080 A TW200635080 A TW 200635080A TW 094114530 A TW094114530 A TW 094114530A TW 94114530 A TW94114530 A TW 94114530A TW 200635080 A TW200635080 A TW 200635080A
- Authority
- TW
- Taiwan
- Prior art keywords
- led
- packaging
- printed
- wiring board
- recess
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
In the traditional method for packaging LED to printed-wiring board, the miniaturization of LED packaging printed-wiring board is difficult to be realized because of the ease of soldering, the minimum size limitation derived from the size of LED device, and the limitation of temperature rise derived from the heat generated by LED. The purpose of the present invention is to provide a method for packaging an LED to a printed-wiring board for facilitating miniaturization by increasing packaging density in the LED, and for extending the lifetime of the LED by increasing heat radiation effect, and to provide an LED packaging printed-wiring board. In the method for packaging the LED, a recess in a truncated cone shape having a section in an inverted trapezoidal shape having a wiring circuit is created on a metal substrate that also serves as a heat sink and has improved heat conduction, an LED bare chip is loaded for fixing and wiring, the upper surface of the bare chip is sealed by a transparent material, such as glass, acryl, silicone, epoxy, and polycarbonate, and a transparent plate is set to be in a flat or convex lens shape. A metal substrate is exposed to the sidewall of a recess in a truncated cone shape having a section in an inverted trapezoidal shape or a metal film is formed, and emitted rays from the LED bare chip to the sidewall of the recess are reflected so that they go in the direction of the front.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005076410A JP2006261366A (en) | 2005-03-17 | 2005-03-17 | Method for packaging led to printed-wiring board, and led packaging printed-wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200635080A true TW200635080A (en) | 2006-10-01 |
TWI289940B TWI289940B (en) | 2007-11-11 |
Family
ID=37100273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94114530A TWI289940B (en) | 2005-03-17 | 2005-05-05 | Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2006261366A (en) |
TW (1) | TWI289940B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101107590B1 (en) | 2011-04-05 | 2012-01-25 | 안복만 | Light emitting device package and manufacturing method the same |
CN103296185A (en) * | 2012-03-02 | 2013-09-11 | 河南森源电气股份有限公司 | Inverted trapezoidal LED support and LED light source thereof |
US10763414B2 (en) | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63107483A (en) * | 1986-10-22 | 1988-05-12 | Matsushita Electric Ind Co Ltd | Brushless motor |
JP2593703B2 (en) * | 1987-12-24 | 1997-03-26 | 三菱電線工業株式会社 | Light-emitting diode lighting |
JPH11298050A (en) * | 1998-04-10 | 1999-10-29 | Mitsubishi Plastics Ind Ltd | Metal core printer circuit board with bent and lighting device using the same |
JP2000031548A (en) * | 1998-07-09 | 2000-01-28 | Stanley Electric Co Ltd | Surface mount light-emitting diode and its manufacture |
JP2001148514A (en) * | 1999-11-18 | 2001-05-29 | Matsushita Electric Works Ltd | Illuminating light source |
JP4139634B2 (en) * | 2002-06-28 | 2008-08-27 | 松下電器産業株式会社 | LED lighting device and manufacturing method thereof |
-
2005
- 2005-03-17 JP JP2005076410A patent/JP2006261366A/en active Pending
- 2005-05-05 TW TW94114530A patent/TWI289940B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2006261366A (en) | 2006-09-28 |
TWI289940B (en) | 2007-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |