KR100733840B1 - Light projecting apparatus of light emitting diode chip module - Google Patents

Abstract

A light projection apparatus of a light emitting diode chip module is provided to prevent interference of light emitted from each light emitting diode chip by installing an interference prevention groove. A main body unit(210) is tightly attached to an upper surface of a printed circuit board. A plurality of light emitting diode chips are arranged on the printed circuit board. A receiving groove(230) is formed on a bottom surface of the main body unit so as to receive the respective light emitting diode chips. A lens(220) is formed on an upper surface of the receiving groove to focus light emitted from the light emitting diode chip and to transmit it to an upper surface of the main body unit. An interference prevention groove(240) is formed between the receiving grooves so as to prevent interference of the light from the light emitting diode chip with light from a neighboring light emitting diode chip.

Description

Light projecting apparatus of light emitting diode chip module

1 is a perspective view showing a pixel module using a light emitting diode chip according to the prior art.

FIG. 2 is a side view illustrating a pixel module using the light emitting diode chip of FIG. 1. FIG.

3 is a diagram illustrating a form of light emitted from one light emitting diode chip in FIG.

Figure 4 is an exploded perspective view showing a light emitting device of a light emitting diode chip module according to the present invention.

5 is a side view of a light emitting device of a light emitting diode chip module showing a first embodiment according to the present invention;

FIG. 6 is an enlarged view of a portion A of FIG. 4; FIG.

7 is a partial view showing a light emitting device of a light emitting diode chip module with a reflecting unit according to the present invention.

8 is a side view of a light emitting device of a light emitting diode chip module showing a second embodiment according to the present invention;

Explanation of symbols used in the main part of the drawing

100: pixel module 200: light emitting device of light emitting diode chip module

210: body portion 220: lens portion

230: receiving groove 240,241: interference preventing groove

250: reflector 300: printed circuit board

310: light emitting diode chip

The present invention relates to a light emitting device of a light emitting diode chip module, and more particularly, to protect a plurality of light emitting diode chips installed on an upper portion of a printed circuit board, and to emit light emitted from the light emitting diode chip to have a straightness The present invention relates to a light emitting device of a diode chip module.

Generally, a light emitting diode is called an LED (Light Emitting Diode), and is used to send and receive an electric signal by converting an electric signal into an infrared, visible or light form using the characteristics of a compound semiconductor.

In particular, light emitting diodes are becoming more compact according to the trend of miniaturization and slimming of information and communication devices. In order to mount light emitting diode chips directly to a printed circuit board (PCB), a surface mount device (hereinafter referred to as SMD) is used. It is made with).

Accordingly, SMD type light emitting diodes used as display elements can replace conventional simple lighting lamps, which are widely used in lighting displays, character displays, and image displays that display various colors.

In addition, as the usage area of the light emitting diode is widened, the required amount of brightness also increases. As the brightness problem caused by the pixel module using the light emitting diode chip is improved, the backlight, automobile, electronic display, traffic signal, lighting, etc. Therefore, the application market using light emitting diodes is gradually expanding.

1 is a perspective view illustrating a pixel module using a light emitting diode chip according to the prior art, FIG. 2 is a side view showing a pixel module using the light emitting diode chip of FIG. 1, and FIG. 3 is light emitted from one light emitting diode chip. This is a drawing visually expressed.

As shown in FIG. 1, the pixel module 10 using the conventional LED chip is simply a printed circuit board 13 for electrical connection and a light emitting diode chip 11 attached to an upper portion of the printed circuit board to become a light source. And a protective plate cover 12 that protects the LED chip 11 from external impact and transmits light emitted from the LED chip.

In addition, the protective plate cover 12 installed on the printed circuit board 13 and the light emitting diode chip 11 is made of a transparent or translucent material so that light emitted from the light emitting diode chip 11 can be transmitted.

When power is applied to the pixel module 10 using the light emitting diode chip provided as described above, light scattered widely is emitted from the light emitting diode chip 11 serving as a light source, and passes through the protective flat plate cover 12 as it is. In the form as shown in Figure 3, it will be visible to the user's eyes.

Since light emitted from the light emitting diode chip 11 is scattered widely, irregular reflection occurs in a portion where the light propagates to both sides of the light emitting diode chip 11.

As a result, the light emitted from each LED chip 11 interferes with each other, resulting in a drop in sharpness.

In addition, since the light is scattered widely due to the characteristics of the LED chip 11, it is difficult to use for road signboards requiring the straightness of the light, which causes a problem in that its use is limited.

Accordingly, the present invention has been made to solve the above problems, the light emitting device of the light emitting diode chip module to prevent the scattering of light emitted from the light emitting diode chip and to improve the straightness of the light emitted from the light emitting diode chip. The purpose is to provide.

According to an aspect of the present invention, there is provided a light emitting device of a light emitting diode chip module, in which a plurality of light emitting diode chips emitting light on a printed circuit board are arranged, the body part being in close contact with an upper surface of the printed circuit board; An accommodation groove formed on a bottom surface of the main body so that each LED chip is accommodated therein; The light emitted from the light emitting diode chip and the lens portion formed on the upper portion of the receiving groove so as to transmit to the upper surface of the body portion and each of the light emitted from the light emitting diode chip adjacent to the light emitting diode chip interfere with each other. At least one interference preventing groove portion is formed between the accommodation groove portion and the adjacent accommodation groove portion.

In the present invention, the inner periphery of the receiving groove portion is characterized in that the reflection portion is further formed so that the light emitted from the light emitting diode chip is focused on the lens portion.

In addition, the reflector is characterized in that the inverted cone shape.

In addition, the at least one interference preventing groove may be formed on at least one of the upper and lower surfaces of the main body.

In addition, the lens unit is characterized in that the convex lens protruding convexly on the upper surface of the main body.

The lens unit may be a concave lens recessed in an upper surface of the body portion.

 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)

4 is an exploded perspective view showing a light emitting device of a light emitting diode chip module according to the present invention, Figure 5 is a side view of a light emitting device of a light emitting diode chip module showing a first embodiment according to the present invention, Figure 6 is FIG. This is an enlarged view of part A in.

As shown in FIGS. 4 to 6, the pixel module 100 using the light emitting diode chip emits light in close contact with the printed circuit board 300 and the printed circuit board 300 on which the plurality of light emitting diode chips 310 are installed. The light emitting device 200 of the LED chip module covers the diode chip 310 and the printed circuit board 300 so as to protect the diode chip 310 and the light emitted from the LED chip 310.

The light emitting device 200 of the light emitting diode chip module is in close contact with the upper portion of the printed circuit board 300 to protect the plurality of light emitting diode chips 310, the printed circuit board 300, and the light emitting diode chip 310.

The light emitting device 200 of the LED chip module may include a main body 210 attached to an upper surface of the printed circuit board 300, a lens unit 220 and a lens unit formed on the LED chip 310. The light emitting diode chip 310 emits light from the accommodating recess 230 and the light emitting diode chip 310 adjacent to the light emitting diode chip 310 so that the light emitting diode chip 310 is accommodated inside the lens 220. It consists of interference preventing grooves 240 and 241 for preventing each light from interfering with each other.

The main body 210 is installed on the upper surface of the printed circuit board 300 to protect the printed circuit board 300 and the light emitting diode chip 310. Preferably, the main body 210 has the same size as the printed circuit board 300 in a quadrangular shape. It is composed of a transparent acrylic material so that the light emitted from the light emitting diode chip 310 can be transmitted.

The lens unit 220 is formed on an upper surface of each light emitting diode chip 310 attached to the upper portion of the printed circuit board 300 so that the light emitted from the light emitting diode chip 310 is collected and irradiated in a predetermined direction. .

In addition, the shape of the lens unit 220 protrudes upward from the main body unit 210, and most preferably is a hemispherical convex lens.

In addition, the lens unit 220 may adjust the thickness or the shape of the lens unit 220 in order to increase the efficiency, such as the change in the irradiation direction of light emitted from the light emitting diode chip 310 and the illuminance.

The accommodation groove 230 is a groove in which a predetermined space is formed on the bottom surface of the lens unit 220 so that the light emitting diode chip 310 is accommodated in the lens unit 220.

The accommodation groove 230 is provided with at least one light emitting diode chip 310.

When the lens unit 220 and the receiving groove 230 are described in more detail, the upper surface of the lens unit 220 is convex, and the bottom surface of the lens unit 220, that is, when the receiving groove 230 is configured to be flat The focal length D of the light emitted from the light emitting diode chip 310 is shortened.

In addition, when the upper surface of the lens unit 220 is formed convex and the bottom surface of the lens unit 220, that is, the receiving groove 230 side is concave with a curvature smaller than the curvature of the convex portion formed on the upper surface of the lens unit 220, the light emission The focal length D 'of the light emitted from the diode chip 310 becomes longer than the focal length D described above.

In addition, when the upper surface of the lens unit 220 and the bottom surface of the lens unit 220, that is, the convex structure having different curvatures on both sides, the focal length D ″ may be the focal length D and D ') becomes shorter, and the relationship of each focal length is D'> D> D ".

Therefore, the shorter the focal length, the better the light diffusion characteristic, and the longer the focal length, the light is diffused in a narrow range, but the sharpness thereof is good.

That is, when the lens unit 220 having the above structure is installed on the upper portion of the LED chip 310, the focal length varies depending on the shape of the lens unit 220 and the receiving groove 230, so that the LED chip 310 may be formed. It is possible to diffuse the light emitted from the light at a wider angle or to increase the sharpness of the light while diffusing it into a rather narrow range.

FIG. 7 is a partial view showing a part of a light emitting device of a light emitting diode chip module having a reflecting unit according to the present invention. As shown in FIG. ) Is further formed.

The reflector 250 improves illuminance by projecting light scattered widely from the light emitting diode chip 310 in a predetermined irradiation direction, and light scattered to both sides of the light emitting diode chip 310 is reflected light 250. By reflecting in a predetermined direction by the lens to the lens unit 220 is condensed to improve the illuminance of the light and to improve the straightness of the light.

In addition, the reflector 250 may be chrome plated on the body made of any one material of polycarbonate, iron, stainless steel, and plastic, or a chrome thin film attached to the plastic body.

On the other hand, at least one or more interference preventing grooves 240 and 241 are formed on the upper and lower surfaces of the main body 210 between each receiving groove 230.

In the interference preventing grooves 240 and 241, a part of the light emitted from each of the LED chips 310 does not emit to the outside and light remaining inside the lens unit 220 is left in the lens unit 220 and the main body unit ( The interference between the light emitted from the light emitting diode chips 310 adjacent to each other through the inside of the 210 may be prevented.

That is, in the process of passing the light emitted from the light emitting diode chip 310 through the main body 210, light is collected and irradiated through the lens unit 220, and at this time, the main body 210 is used as a medium and the lens unit 220 is used. The color of light transmitted through the lens unit 220 to the periphery of) is expressed by the main body 210 around the lens unit 220.

In this case, the light emitted from each light emitting diode chip 310 causes interference with the light generated from the light emitting diode chip 310 by using the main body 210 as a medium, and the original light is converted into the surrounding light. Color distortion occurs.

Therefore, the interference preventing grooves 240 and 241 according to the present invention are adjacent to the receiving groove 230 accommodating each of the light emitting diode chips 310 so as to prevent interference by using the main body 210 as a medium. At least one interference preventing recess 240 and 241 may be formed between the receiving recesses, or at least one interference preventing recess 240 and 241 may be formed between the lens unit 220 and a neighboring lens unit. ), The light emitted from each LED chip 310 is prevented from interfering with each other.

The shape of the interference preventing grooves 240 and 241 as described above is cut to the lower side of the body portion 210 in a '∨' shape on the upper surface of the main body portion 210, the edge of the interference prevention groove 240 of the '∨' shape The lower surface of the side is not cut.

In addition, the main body 210 may be formed on both sides of the '∨' shape of the interference preventing groove 240 to prevent the light emitted from the neighboring LED chip 310 from interfering with a small amount through the interference preventing groove 240. It is also possible to further include an interference prevention groove portion 241 in the lower surface of the).

In addition, although not shown in the present embodiment, it is also possible to provide a '∧' shape of the interference preventing groove 241 and the '∨' shape of the interference preventing groove 240 may be formed on both sides thereof. It is apparent to those skilled in the art that the change can be easily performed.

On the other hand, a plurality of light emitting diode chips 310 of a predetermined arrangement is provided on the printed circuit board 300.

The light emitting diode chip 310 arranged on the printed circuit board 300 is installed by Surface Mount Technology (SMT), which is a technology in which a chip is mounted on a printed circuit board to be in contact with a printed circuit board and lead components. Although not shown in the drawing, a solder, a solder dam, and an insulating layer for insulation with the substrate 250 are further provided between the printed circuit board 300 and the light emitting diode chip 310.

(Second embodiment)

FIG. 8 is a side view of the light emitting device of the LED chip module according to the second embodiment of the present invention, and shows the light emitting device 200 of the LED chip module having the concave lens unit 220.

As shown in FIG. 8, the light emitting device 200 of the LED chip module includes a main body 210 that protects the printed circuit board 300, and a main body part that collects and emits light emitted from the LED chip 310. Receiving groove 230 for accommodating the light emitting diode chip 310 and the light emitted from each light emitting diode chip 310 interfere with each other formed in the concave upper surface of the lens unit 220 and the lens unit 220 An interference preventing groove 240 is formed to prevent the interference.

In addition, a reflection part 250 for condensing light is provided at an inner circumference of the accommodation groove 230.

The difference between the first embodiment and the second embodiment is the shape of the lens unit 220, the lens unit 220 according to the second embodiment is formed with a concave lens recessed concave on the upper surface of the body portion (210).

When the lens unit 220 described in the first embodiment forms a convex lens, the direction angle is further narrowed to irradiate stronger light. In the case of the concave lens in the second embodiment, the reflector 250 is used. It restores the narrowed angle of view.

Therefore, the light emitted from the light emitting diode chip 310 is collected by the lens unit 220 to be irradiated in a predetermined direction.

In addition, it is obvious to those skilled in the art that the light irradiation property or the straightness can be adjusted by varying the thickness between the lens unit 220 and the receiving groove 230, respectively. .

As described above, the light emitting device of the light emitting diode chip module is provided on the printed circuit board on which the plurality of light emitting diode chips are installed, thereby increasing the straightness of the light emitted from the light emitting diode chip.

In addition, since the interference prevention grooves are provided, the visibility of the light emitted from each LED chip is prevented, thereby improving visibility.

Although the present invention has been illustrated and described with respect to specific preferred embodiments, the present invention is not limited to the above-described embodiments, and a person having ordinary skill in the art to which the present invention pertains should be described in the following claims. Various changes may be made without departing from the spirit of the technical idea of the present invention.

Claims (6)

A light emitting device of a light emitting diode chip module in which a plurality of light emitting diode chips for emitting light on a printed circuit board is arranged, A main body part in close contact with an upper surface of the printed circuit board; An accommodation groove formed on a bottom surface of the main body so that each LED chip is accommodated therein; A lens unit configured to collect light emitted from the light emitting diode chip and to form an upper portion of the accommodating groove to be transmitted to an upper surface of the main body; And At least one interference preventing groove portion is formed between the receiving groove portion and the adjacent receiving groove portion so as to prevent each light emitted from the light emitting diode chip and the neighboring LED chip from interfering with each other. Floodlight of module. The method of claim 1, The inner periphery of the receiving groove portion, the light emitting device of the light emitting diode chip module, characterized in that the reflector further formed so that the light emitted from the light emitting diode chip is focused on the lens unit. The method of claim 2, The reflector is a light emitting device of the light emitting diode chip module, characterized in that the inverted cone shape. The method according to claim 1 or 2, The at least one interference preventing groove of the light emitting diode chip module, characterized in that at least one formed on the upper or lower surface of the main body. The method according to claim 1 or 2, And the lens unit is a convex lens which protrudes convexly on an upper surface of the main body unit. The method according to claim 1 or 2, And the lens unit is a concave lens recessed in an upper surface of the main body portion.

Images