TWI289151B - Ink composition for use in inkjet - Google Patents

Ink composition for use in inkjet Download PDF

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Publication number
TWI289151B
TWI289151B TW93132896A TW93132896A TWI289151B TW I289151 B TWI289151 B TW I289151B TW 93132896 A TW93132896 A TW 93132896A TW 93132896 A TW93132896 A TW 93132896A TW I289151 B TWI289151 B TW I289151B
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Taiwan
Prior art keywords
ink composition
substrate
coupling agent
inkjet
circuit pattern
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TW93132896A
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English (en)
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TW200526745A (en
Inventor
Toshifumi Kawamura
Toru Imori
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Nippon Mining Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Ink Jet (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)

Description

1289151 九、發明說明： 【發明所屬之技術領域】 安本發明係關於-種適於在基板上藉噴墨描繪電路圖 木之油墨組成物。 【先前技術】 使用貝墨方式作為在基板上描緣電路圖之 有各種提案。 /左匕 物:^ Γ二有如下之方法：使於溶劑中存在吸附有硫化名 細電路圖荦之曰使，在基板上而形成微 又，利特開平㈣侧號公報）< 於基板上以噴墨形成用以無 夕古、、土 η 兒浒电鍍之活化劑的圖幸 的點狀隼上=藉噴墨印刷機喷出之水性油墨 印刷電= ί 案，乾燥後，進行無電解鑛銅之 包路基板的製造方法γ 士 鉬）* L 去（曰本專利特開平7-245467號公 報）。在此方法中，係使用由 所構成之油墨作為輕油,墨。〃 ^生有機_與水 為提高無電解金屬之圖案對基 # ^ ^ ^ ^ -種利用矽烷偶合劑之方法（專…屬，亦已棱出 石々、田人 去（專利弟338〇880號）。傕用 、兀5劑溶液並以喷墨印表機描 活化處理液中’使活化劑附著於所騎之'圖^於 無電解電鍍。而且’前述彻 鎳 乙氧基料等之胺基系料偶合劑。以卜私基丙基三 【發明内容】 然而’在使用r•胺基丙基三乙氧基㈣等之胺基系石夕 316429 5 1289151 Γ:偶=’活化劑之捕捉(附著)狀態變得不均勻，亦 於A材上佈或濃度變得不均勾。其接著力尚不足， 、基材上必須進行蝕刻處理等之前處理。 本發明之目的在於提供一 均一日很胃—^ 裡用以在基板上形成具有 裎徂 心貧墨用油墨組成物，又， M、—種使用該油墨組成物而形成電路圖案之方法。 本發明人等經精心研究結果 無電解電鍍之活化劑—起含有用以；=油〜且成物中和 人心 ’用以捕捉該活化劑，含唑化 :物作為附著於基板之偶合劑甚為有效，遂而完成本發 亦即，本發明係關於： +(D —種油墨組錢，係'於基板上用以描繪電路圖案之 賀墨用油墨組成物，其中，含有|彡 劑偶合劑。 偶合劑作為活化 :2)如前述（1)之油墨組成物，其中’唑系矽烷偶合劑 為咪哇;5夕烧。 二3)—種電路圖案之描繪方法，係於基板上藉噴墨描繪 電路圖案之方法，其中，使用如前述（1)記载之=墨组 成物。 土 (4) 一種金屬被覆方法，於基板上藉噴墨描繪電路圖案， 然後依需要而浸潰於活化劑溶液後，藉無電解電鑛以金屬 被覆該電路圖案之方法中，其中，於電路圖案之描繪係使 用如記载於（1 )之油墨組合物。 【實施方式】 316429 6 1289151 者 本發明之油墨組成物最重要係含有。坐系彻合劑 該。坐系㈣偶合劑係可將無電解電鑛之活化劑以古 在接性地附著在基板上，具有由 门 所吝斗—▲,, 守、，，貝進订之無電解電鍍 生之皮胰強固地附著之作用。在本發明中， 包含於油墨組成物中，所謂油墨組成物係調製來 : = : =溶液’而使被唾系彻合劑的油墨描緣 电路圖木改〉貝於該活化劑溶液中，亦可使之附著。 又，在本發明之油墨組成物巾 喑黑田^ 風物中，亦可依需要而使用在 貝1用油墨中所使用之黏度調節 般之添加劑。 纟面張力调即劑等一 戶 =發明所使用之哇石夕垸偶合劑係含有唾基與烧· 乳基矽烷基之化合物。 唑基係可例舉如：咪唑基、噚唑（〇xaz〇le)基、噻唑 (ti雇口ole)基、石西哇基、D比唾基、異鳴吐基、異噻唾、三唑 基'、卩亏二唑基、噻二唑基、四唑基、噚三唑基、噻三唑基、籲 五唾基、°引唾基、苯并σ米唾基、苯并三唾基等。其中，亦 以哺哇基為最佳。 烷氧基矽烷基係只要為可顯示一般矽烷偶合劑所含 有之偶合劑功能之基即可，例如具有〗至3個甲氧基、乙 氧基寺低級燒氧基之碎烧。 该唑系矽烷偶合劑本身為習知者，例如可使咪唑等之 唑化合物與r -環氧丙氧基丙基三烷氧基矽烷等之環氧基 矽烷反應而得。有關該反應係記載於例如日本專利特開平 7 316429 1289151 5-186479號公報等。 唑化合物濃度為〇.〇1至1〇〇g/升，· 若少於O.Olg/升砗，认#， 王）g/升（
;基板表面之附著量會因變少而不均 一。右多於1 l〇g/弁栌 卜一J 廿… g/升&，則附著量會因過多而難以乾燥， 使用於本發明$ I恭 、 …、电解電鐘的活化劑，係可借用 屬化合物、例如翻、如、入 H 你』使用重i 生、銀等之鹵化物、氫氧化物 硫酸鹽、碳酸鹽、脂肪酸臨 飞氣化物
佳。繼而，於油：…: 合物。尤以1巴化合物肩 也、 、""、、，成物中含有該活化劑之情形下，該邊 度以0.01至l〇〇g/井兔社 ’ ”、、么。與油墨組成物調製為其它溶液 0守亦同。 [實施例] 實施例 1 對味峻與7 ·%氧丙氧基丙基三甲氧基料之等莫耳 反應生成物之水溶液添加氣化纪水溶液以調製溶液，進一
步，添加水、黏度調節劑、丰 A 表面張力调郎劑而以前述等莫 耳反應生成物為3QGg/升、氣化纪水溶液為lGGmg/升的方 式，調製油墨組成物。從油墨噴嘴喷出該油墨組成物而於 基板上描繪電路回路。並徭，盘 /、俊，貝知無電解鍍鎳（日礦Metal plating公司製造之NlKOMUr立士罢λ、 UU澤）7队0)使膜厚為〇·2# m。進一步，附著無電解鍍銅（ 丁取⑷、曰碾metal platmg公司製
造之 KC500 ) 1 " m 厚。以 SEM 此M的截面硯察之結果、無圖 案外析出，形成電鍍界面之明鞾雷 甘+ w, ^ _ 1、、貝兒路。其電鍍皮膜的剝離 強度係表示高達1.5kgf/cm2之密著戶。 316429 8 1289151 實施例？ 對咪唑與-環氧丙氧基丙基三甲氧基矽烷之等莫 =應生絲水溶液中添加水、黏度調節劑、表面張力、 诏而以前述等莫耳反應生成物為3〇〇g/升的方式1制、、由 t成物。從油墨噴嘴噴出該油墨組成物，於基板上^ 會 :二然後，浸潰於氯化把水溶液（1GQmg/升）中，以味 =定化。其後，實施無電解鑛鎳（曰確Meta— mKOMU7N_0)使膜厚為〇 2//m。進一步，附 ，’、，'電解錢銅（日礦metalplating公司製··奶 截面觀察之結果、無圖案外析出，形成電 =之明顯電路。其電鐘皮膜的剝離強度係15kgf/cm2。 唾二胺基丙基三甲氧她水溶液以取代咪 物;;夕卜ϋ 丙基三甲氧基㈣之等莫耳反應生成 物。，/、余係與貫施例1之相同操作而調製油墨組成 又’除了使用該油墨組成物以外係與實施例i之相同 呆作2形成電路圖案，進行無電解電鍍。 ._八、、，。果，電鍍物皮膜之剝離強度為0.3kgf/cm2。 產業上之可利用性 利用Γ依本發明，藉由於油墨組成物中使含有°坐化合物， 牙J用使用此組成物哈 成物之貝墨方式，可對基板賦予具有優異密 其^均—之無電解電鑛活化劑，因此，不須要縫面處理 密接性之電路圖宰。 了…鍍而传到具有優異 316429 9

Claims (1)

1289151 第93132896號專利申請案 (96年7月3曰）· 十、申請專利範圍： ： 1 · 一種油墨組成物，係用於基板上描緣電路圖案之喷墨用 油墨組成物，其中含有〇·〇1至l〇〇g/升之濃度的唑系矽 燒偶合劑作為活化劑偶合劑。 2·如申請專利範圍第1項之油墨組成物，其中，唑系石夕燒 偶合劑為咪唑矽烷。 種如申明專利範圍第1項之油墨組成物之用途，係用 以於基板上藉喷墨描繪電路圖案者。 4· 一種如：請專利範圍第1項之油墨組合物之用途，係於< ，，上藉噴墨描繪電路圖案，然後依需要而浸潰於活化 d冷液後，藉無電解電鍍以金屬被覆該電路圖案之方法 中用以描％電路圖案者。
316429修正本 10
TW93132896A 2003-11-05 2004-10-29 Ink composition for use in inkjet TWI289151B (en)

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TWI289151B true TWI289151B (en) 2007-11-01

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US (1) US20070120880A1 (zh)
EP (1) EP1681321B1 (zh)
JP (1) JP4863715B2 (zh)
KR (1) KR100764294B1 (zh)
TW (1) TWI289151B (zh)
WO (1) WO2005044931A1 (zh)

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KR100796894B1 (ko) * 2004-01-29 2008-01-22 닛코킨조쿠 가부시키가이샤 무전해 도금 전처리제, 그것을 이용하는 무전해 도금방법,및 무전해 도금물
JP4859232B2 (ja) * 2004-09-10 2012-01-25 Ｊｘ日鉱日石金属株式会社 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体
JP4897384B2 (ja) * 2006-08-03 2012-03-14 株式会社ブリヂストン 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP2008041823A (ja) * 2006-08-03 2008-02-21 Bridgestone Corp 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ
JP5396871B2 (ja) * 2009-01-20 2014-01-22 コニカミノルタ株式会社 インクジェットインクおよび金属パターン形成方法
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EP1681321B1 (en) 2011-08-10
EP1681321A4 (en) 2006-11-22
US20070120880A1 (en) 2007-05-31
KR20060088899A (ko) 2006-08-07
WO2005044931A1 (ja) 2005-05-19
EP1681321A1 (en) 2006-07-19
JPWO2005044931A1 (ja) 2007-11-29

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