TWI283492B - Optical communication module - Google Patents
Optical communication module Download PDFInfo
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- TWI283492B TWI283492B TW094118392A TW94118392A TWI283492B TW I283492 B TWI283492 B TW I283492B TW 094118392 A TW094118392 A TW 094118392A TW 94118392 A TW94118392 A TW 94118392A TW I283492 B TWI283492 B TW I283492B
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- light
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- 230000006854 communication Effects 0.000 title claims abstract description 60
- 238000004891 communication Methods 0.000 title claims abstract description 60
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000005452 bending Methods 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007175 bidirectional communication Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/114—Indoor or close-range type systems
- H04B10/116—Visible light communication
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/114—Indoor or close-range type systems
- H04B10/1143—Bidirectional transmission
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
1283492 (1) 九、發明說明 【發明所屬之技術領域】 本發明是關於光通訊模組。 【先前技術】 具備受光元件及發光元件可進行雙向通訊的光通訊模 組有例如I r D A ( I n f r a r e d D a t a A s s 〇 c i a t i ο η )依據的紅外線 φ 數據通訊模組。紅外線數據通訊模組在筆記型個人電腦的 領域中,其普及顯著,而最近同時普及於行動電話和掌上 型電腦等。 紅外線數據通訊模組是將紅外線用的發光元件及受光 元件,或控制該等元件用的控制電路元件等一體封裝所構 成。紅外線數據通訊可以和另外的紅外線數據通訊模組之 間進行無限的雙向通訊^ 桌7圖是表不習外線數據通訊模組的一例圖。紅 鲁外線數據通訊模組X具備安裝在該基板91的發光元件92、 受光元件93及驅動1C94。紅外線數據通訊模組X形成有覆 蓋發光元件92、受光元件93及驅動1C 94的樹脂封裝95。該 樹脂封裝95在發光元件92及受光元件93的各個正面形成有 透鏡部9 5 a、9 5 b。 發光元件92將來自驅動1C 94的電訊號轉換成光訊號, 射出作爲光訊號的紅外線。所射出的紅外線通1透鏡部 95 a放射到外部,以其他紅外線數據通訊模組(省略圖示 )的受光元件受光。從其他紅外線數據通訊模組所射出的 -4 - (2) 1283492 紅外線是通過透鏡95b而以受光元件93受光。受光元件93 將受光的紅外線轉換成電訊號而輸出到驅動IC94。根據該 等的動作,紅外線數據通訊模組X可以在其他的紅外線數 據通訊模組之間進行雙向的通訊。 基板91及樹脂封裝95安裝有覆蓋該等大致整體的屏蔽 盒96。該屏蔽盒96會當驅動IC96受到外來的電擾或可視光 而有誤動作之虞,以作爲防止上述問題之用。屏蔽盒96是 φ 將金屬板彎曲加工所形成。屏蔽盒96,具有:覆蓋樹脂封 裝95及基板91的一側面的主板部96a、覆蓋樹脂封裝95及 基板91的兩端側面的2個第1彎曲部96b、覆蓋2個透鏡部 95a、95b間的區域的第2彎曲部96c及從第2彎曲部前端延 伸的第3彎曲部96d。 基板91及樹脂封裝95安裝屏蔽盒96時,利用主板部 96 a的一部份及第1彎曲部96b的一部份,包覆各透鏡部95a 、95b的上方及側方。即,透鏡部95a的上方被主板部96a • 的前方一端部96 A所包覆。透鏡部95 a的右側方被一方的第 1彎曲部96b的前方一端部96B所包覆。另一方面,透鏡部 95b的上方被主板部96a的前方一端部96A’所包覆。透鏡部 95b的左側方被另一方的第1彎曲部96b的前方一端部96B’ 所包覆。 因此,從發光元件92所射出的紅外線之中,朝著利用 主板部96a的前方一端部96A及第1彎曲部96b的前方一端部 96B所包覆的方向以不當的寬角度所射出的紅外線被屏蔽 盒9 6所屏蔽。同樣地,從利用主板部9 6 a的前方一端部 1283492 t 4 (3) 9 6A’及第1彎曲部96b的前方一端部96B’所包覆的方向朝著 透鏡部95b方向的紅外線被屏蔽盒96所屏蔽。因此,該紅 外線通過透鏡部95b被抑制在受光元件93中受光。此時, 主板部96a的前方一端部96A、96A’及第1彎曲部96b的前方 一端部96B、96B’具有遮斷紅外線的遮光部的功能。 因此,紅外線數據通訊模組X在和其他紅外線數據通 訊模組進行雙向通訊時,可以抑制因錯誤將紅外線照射到 φ 非通訊對象的機器等。紅外線數據通訊模組X可以抑制對 於來自非通訊對象的機器等紅外線的受光。 但是,根據該紅外線數據通訊模組X,透鏡部95a、 95b之間,在該等彼此相對的方向上並未存在有作爲遮光 部功能。因此,從發光元件92所發出紅外線的一部份會通 過透鏡部95 a而有不當射出至接近透鏡部95b方向的場合。 並且,相對於透鏡部95 b朝著接近透鏡部95 a的方向而來的 紅外線在受光元件93中會有導致不當受光的場合。 φ 因此,以往的紅外線數據通訊模組X,會有導致紅外 線數據通訊模組X通訊上的障礙’對於利用屏蔽盒96仍有 改善的餘地。 〔曰本專利文獻〕特開2003 -8 066號公報 ................................................................ ........................... 【發明內容】 本發明是根據上述問題所硏創而成’以提供從發光元 件使光罩射在適當的區域,同時以受光元件可接收來自適 當區域的光的光通訊模組爲課題。 -6 - (4) 1283492 利用本發明所提供的光通訊模組,具備:長矩形的基 板;排列安裝於上述基板的長軸方向上之發光元件及受光 元件;具有突出形成在上述發光元件及受光元件的各個正 面的2個透鏡部,並且包覆上述發光元件及受光元件的樹 脂封裝;及上述發光元件及受光元件的電磁屏蔽及遮光用 的屏蔽盒,朝著其長軸方向延伸的一個側面是被當作和外 部被安裝體之間的安裝面之光通訊模組,其特徵爲:上述 φ 各透鏡部的各個側面在朝向上述基板的長軸方向的兩方向 ,及朝向和上述安裝面的方向相反的一方向的合計三方向 上,受到上述屏蔽盒所包覆。 最好是,上述屏蔽盒是藉由將金屬板彎曲加工所形成 ,並且,具備:覆蓋上述樹脂封裝中與上述安裝面相反側 的一個側面的主板部;覆蓋上述樹脂封裝的兩端側面的2 個第1彎曲部;覆蓋上述樹脂封裝中的上述2個透鏡部間的 區域的第2彎曲部;從上述第2彎曲部的前端朝向沿著上述 # 安裝面方向延伸的第3彎曲部;及從上述第3彎曲部的兩端 朝向上述基板的短軸方向延伸的2個第4彎曲部,上述各透 鏡部在上述三方向上,被上述主板部和上述第1彎曲部和 上述第4彎曲部所覆蓋。 最好是,上述屏蔽盒,更具備覆蓋上述基板的背面的 第5彎曲部。 最好是,在上述樹脂封裝中的上述2個透鏡部間的區 域形成有凹部,在上述屏蔽盒的上述第2彎曲部上形成有 嵌入上述凹部的凸部。 (5) 1283492 最好是,上述屏蔽盒是利用上述第3彎曲部來接地連 式 方 施 實 圖 下 1 以第 明的 說組 體模 具訊 示通 圖光 照及 參涉 , 所 例明 施發 實本 的示 明表 發是 本圖 對 4 針第 例 。該紅外線數據通訊模組A,具備:基板1、搭載在基板1 II 的表面la的發光元件2、受光元件3及驅動IC4、形成封閉 該等組件的樹脂封裝5及屏蔽盒6所構成 上述基板1是以玻璃環養樹脂等的樹脂,整體形成平 面呈長矩形。基板1的扁面la上(參照第2圖)形成有預定 的配線圖案(圖示省略)。基板1的一側端面1 b (參照第4 圖)設有複數個連接端子部11。連接端子部11在延著基板 1的厚度方向的凹槽內面形成有導體層。該紅外線數據通 訊模組A是如第3圖表示,利用連接端子部1 1安裝在安裝基 φ 板B上。 發光元件2例如爲可以發出紅外線的紅外線發光二極 體等所構成,藉引線焊接和上述配線圖案連接。受光元件 3例如爲可以感測紅外線的PIN光二極體等所構成,藉引線 焊接和上述配線圖案連接。驅動IC4爲控制發光元件2及受 光元件3的送收訊動作之用。驅動IC4藉著引線焊接和上述 配線圖案連接,定且,通過上述配線圖案連接在發光元件 2和受光元件3。該紅外線數據通訊模組A中,驅動IC4形成 不受來自可視光的影響。 -8- (6) 1283492 樹脂封裝5是例如以含有顏料的環氧樹脂等所形成。 樹脂封裝5相對於可視光不具有透光性,相反地相對於紅 外線具有透光性。該樹脂封裝5是利用傳遞模塑法等的手 法所形成。 該樹脂封裝5—體形成有位在發光元件2正面的發光用 透鏡部5 1。發公用透鏡部5 1構成可持續地聚集來自發光元 件2上面所放射的紅外線而射出。又,樹脂封裝5—體形成 φ 有位在受光元件3正面的受光用透鏡部52。受光用透鏡部 52構成送訊至該紅外線數據通訊模組A的紅外線而射入到 受光兀件3。 屏蔽盒6是作爲電磁屏蔽或遮光之用,設置可包覆基 板1及樹脂封裝5。該屏蔽盒6是藉著將金屬板彎曲加工所 形成,具有主板部60和第1〜第5的彎曲部61〜65。 主板部60覆蓋基板1及樹脂封裝5中和連接端子部1 1相 反側的側面1 C、5 C,大致呈〕字型。2個第1的彎曲部6 1是 Φ 從主板部60的兩端部向下方彎曲所形成,覆蓋基板1及樹 脂封裝5的兩端側面Id、5d。該等主板部60的前方一端部 60a、60a’及2個第1的彎曲部61的前方一端部61b、61b’形 成在分別的兩方向覆蓋各透鏡部5 1、52側面的遮光部。 即,在基板1及樹脂封裝5安裝屏蔽盒6時,透鏡部5 1 的上方被主板部69的前方一端部60a所覆蓋。透鏡部51的 上方被一方的第1彎曲部61的前方一端部61a所覆蓋。另一 方面,透鏡部52的上方被主板部60的前方一端部60a’所覆 蓋。透鏡部5 2的左側方被另一方的第1彎曲部6 1的前方一 -9- (7) 1283492 端部61 a’所覆蓋。 第2彎曲部62是從主板部60的凹部底邊向下方彎曲所 形成。該第2彎曲部62形成有模壓部62a。另一方面,在樹 脂封裝5的2個透鏡部51、52間的面5a形成嵌入該模壓部 62a的凹部53。屏蔽盒6被安裝在樹脂封裝5時,將模壓部 62 a嵌入凹部53內。藉此,屏蔽盒6例如不使用黏著劑即可 確實地固定在樹脂封裝5上。 B 第3彎曲部63是從第2彎曲部62的前端部朝著沿安裝基 板B的方向彎曲所形成。該第3彎曲部63是如第3圖表示’ 其下面被焊接在安裝基板B的配線圖案(省略圖示)上。 藉此,將屏蔽盒6連接在配線圖案上的接地端子。 2個第4彎曲部64是從第3彎曲部63的兩端部向上方彎 曲所形成,使其前端部到達主板部60附近。該等的第4彎 曲部64是如第1圖及第2圖表示,形成設置位在透鏡部51、 5 2間分別覆蓋的遮光部。如上述,在該紅外線數據通訊模 鲁組A中,透鏡部51、52藉著主板部60的前方一端部60a、 60a,、2個第1彎曲部61的前方一端部61b、61b’及2個的第4 彎曲部64,形成分別在三方向遮光的構成。 第5彎曲部65是從主板部60向下方彎曲所形成’覆蓋 基板1的背面Id的一部份。 屏蔽盒6是例如準備第5圖表示的金屬板P,對於其各 部依序施以彎曲加工所形成。金屬板P的各彎曲預定部 60,〜65,是分別形成主板部60及第1〜第5彎曲部61〜65的部 分。 -10- (8) 1283492 此外,爲了以一片金屬板P形成屏蔽盒6,如第1圖表 示,主板部60中覆蓋透鏡部51、52部分的尺寸L1以小於第 2及第4彎曲部62的尺寸L2爲佳。尺寸L1小於尺寸L2時,如 第5圖表示可以避免彎曲預定部60’和2個彎曲預定部64’的 干涉,將金屬片P形成屏蔽盒6時可獲得適當的形狀。 其次,針對紅外線數據通訊模組A的作用說明如下。 如第2圖表示,透鏡部51、52在基板1的長軸方向上, φ 分別爲第1彎曲部61的前方一端部61b、62b’及第4彎曲部 64所覆蓋。本實施型態中,第1彎曲部61的前方一端部61b 、61b’及第4彎曲部64的前端部被延伸到和透鏡部51、52 的頂部大致相同的位置爲止。該等的第1彎曲部61的前方 一端部61b、61b’及第4彎曲部64是形成遮光部,可以遮蔽 從透鏡部5 1以不當的寬角度射出的紅外線或從不當的寬角 度射來的紅外線。 從透鏡部5 1射出的紅外線的照射角度α 1及朝著透鏡 # 部5 2射出紅外線的受光角度α 2可以調整爲預定的角度。 例如根據IrDΑ規格,彼此進行雙向數據通訊的紅外線數據 通訊模組彼此的可通訊角度是限定在30度。紅外線數據通 訊模組A中,照射角度αΐ及受光角度α2可藉著第1彎曲部 61及第4彎曲部64深度方向的長度的變更而容易地進行調 整。因此,紅外線數據通訊模組Α可將照射角度α 1及受光 角度α 2設定在適當的大小,即可容易滿足上述規格。 此外,相對於透鏡部5 1、5 2的基板1的短軸方向的遮 光可藉著主板部60及安裝基板Β適當地進行。針對該短軸 -11 - (9) 1283492 方向的照射角度及受光角度,同樣可變更主板部60的深度 方向的長度或紅外線數據通訊模組A的安裝基板B的安裝位 置而可容易進行調整。 根據本實施型態,屏蔽盒6是如第5圖表示’可對於一 片金屬板P依序進行彎曲加工而形成。因此,可發揮上述 遮光效果的屏蔽盒6不需要經過特別的工序即可以和以往 同種的屏蔽盒同等的效率製造。 B 根據本實施型態,將形成在第2彎曲部62的模壓部62a 嵌入樹脂封裝5的凹部53內,例如不須使用黏著劑即可適 當進行屏蔽盒6的固定。模壓部62 a例如在金屬板P的彎曲 加工時容易地形成。又,凹部5 3構成使傳遞模塑法形成樹 脂封裝5時產生的頂出銷的痕跡位在第4圖表示的透鏡部5 1 、52之間時,不須進行機械加工等的特別處理即可容易形 成。 根據本實施型態,設置第5彎曲部65,藉著第2及第5 肇彎曲部62、65,使屏蔽盒6形成夾持基板1及樹脂封裝5的 形式,適當地固定屏蔽盒6。再者,可以在第2彎曲部62設 置V字型缺口以代替模壓部62a,將此部份朝著樹脂封裝5 側以淺的角度彎曲使其突出。 本發明所涉及的光通訊模組不僅限於上述的實施型態 。本發明所涉及的光通訊模組各部的具體構成可自由地施 以種種設計變更。 屏蔽盒6如上述實施型態爲配置有第1〜第5彎曲部 6 1〜65的構造,藉此可合理地從一片金屬板P形成,同時寄 -12- (10) 1283492 望於製造效率的提昇,但是本發明不僅限於此。例如,第 6圖所示,也可以將比較小型的窄長形金屬板彎曲成大致 呈口字型並形成可在三方向包圍透鏡部51、52的構件66, 將此構件66接合在主板部60及第1彎曲部51等形成屏蔽盒6 〇 發光元件2及受光元件3不僅限於可以使紅外線發光或 接受紅外線,也可以使用可視光可發光或受光的元件。即 φ ,光通訊模組不僅限於紅外線數據通訊模組,也可以使用 可視光的通訊方式。 【圖式簡單說明】 第1圖是表示本發明涉及的光通訊模組的一例的整體 透視圖。 第2圖是沿著第1圖的Π - Π線的剖面圖。 第3圖是沿著第1圖的m - m線的剖面圖。 第4圖是表示本發明所涉及光通訊模組的一例的分解 透視圖。 第5圖是形成本發明涉及光通訊模組的一例所使用的 屏蔽盒用的金屬板。 第6圖是表示本發明所涉及光通訊模組的其他例的主 要部透視圖。 第7圖是表示習知光通訊的一例的分解透視圖。 【主要元件符號說明】 -13- (11) 1283492 1 基板 la 表面 1 b —側端面
1 c、5 c 相反側的側面 1 d、5d 相反側的側面 2 發光元件 3 受光元件 4 驅動1C 5 樹脂封裝 5a 面 6 屏蔽盒 11 連接端子部 5 1 發光用透鏡部 52 受光用透鏡部 53 凹部 60 主板部 60a' 60a ’ 、61b 、 61b’ 61 〜65 第1〜第5彎曲部 60’〜65’ 彎曲預定部 62a 模壓部 91 基板 92 發光元件 93 受光元件 94 驅動1C 前方一端部 -14- (12) 1283492 95 樹脂封裝 95a、95b透鏡部 96 屏蔽盒 96A、96B、96A’、96B’ 前方一端部
96a 96b 96c 96d A B P X 主板部 第1彎曲部 第2彎曲部 第3彎曲部 紅外線數據通訊模組 安裝基板 金屬板 紅外線數據通訊模組 照射角度 受光角度
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Claims (1)
- (1) 1283492 十、申請專利範圍 1. 一種光通訊模組,具備: 長矩形的基板;及 排列安裝於上述基板的長軸方向上之發光元件及受光 元件;及 具有突出形成在上述發光元件及受光元件的各個正面 .的2個透鏡部,並且包覆上述發光元件及受光元件的樹脂 ^ 封裝;及 上述發光元件及受光元件的電磁屏蔽及遮光用的屏蔽 盒, 朝著其長軸方向延伸的其中一個側面是被當作和外部 被安裝體之間的安裝面之光通訊模組,其特徵爲: 上述各透鏡部的各個側面在朝向上述基板的長軸方向 的兩方向,及朝向和上述安裝面的方向相反的一方向的合 計三方向上,受到上述屏蔽盒所包覆。 φ 2.如申請專利範圍第1項記載之光通訊模組,其中, 上述屏蔽盒是藉由將金屬板彎曲加工所形成,並且,具備 :覆蓋上述樹脂封裝中與上述安裝面相反側的一個側面的 主板部;覆蓋上述樹脂封裝的兩端側面的2個第1彎曲部; 覆蓋上述樹脂封裝中的上述2個透鏡部間的區域的第2彎曲 部;從上述第2彎曲部的前端朝向沿著上述安裝面方向延 伸的第3彎曲部;及從上述第3彎曲部的兩端朝向上述基板 的短軸方向延伸的2個第4彎曲部, 上述各透鏡部在上述三方向上,被上述主板部和上述 -16- (2) 1283492 第1彎曲部和上述第4彎曲部所覆蓋。 3.如申請專利範圍第2項記載之光通訊模組,其中, 更具備覆蓋上述基板的背面的第5彎曲部。 4 ·如申請專利範圍第2項或第3項記載之光通訊模組 ,其中,在上述樹脂封裝中的上述2個透鏡部間的區域形 成有凹部,在上述屏蔽盒的上述第2彎曲部上形成有嵌入 上述凹部的凸部。 5 ·如申請專利範圍第2項或第3項記載之光通訊模組 ’其中,上述屏蔽盒是利用上述第3彎曲部來接地連接。-17-
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JP2004165756A JP4210240B2 (ja) | 2004-06-03 | 2004-06-03 | 光通信モジュール |
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TWI283492B true TWI283492B (en) | 2007-07-01 |
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TW094118392A TWI283492B (en) | 2004-06-03 | 2005-06-03 | Optical communication module |
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US (1) | US20070230965A1 (zh) |
JP (1) | JP4210240B2 (zh) |
KR (1) | KR100835492B1 (zh) |
CN (1) | CN100511726C (zh) |
TW (1) | TWI283492B (zh) |
WO (1) | WO2005119795A1 (zh) |
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2004
- 2004-06-03 JP JP2004165756A patent/JP4210240B2/ja not_active Expired - Fee Related
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2005
- 2005-06-02 CN CNB2005800180770A patent/CN100511726C/zh not_active Expired - Fee Related
- 2005-06-02 KR KR1020067024449A patent/KR100835492B1/ko not_active IP Right Cessation
- 2005-06-02 US US11/597,841 patent/US20070230965A1/en not_active Abandoned
- 2005-06-02 WO PCT/JP2005/010165 patent/WO2005119795A1/ja active Application Filing
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JP4210240B2 (ja) | 2009-01-14 |
CN100511726C (zh) | 2009-07-08 |
TW200603448A (en) | 2006-01-16 |
JP2005347536A (ja) | 2005-12-15 |
CN1965416A (zh) | 2007-05-16 |
KR20070029712A (ko) | 2007-03-14 |
US20070230965A1 (en) | 2007-10-04 |
KR100835492B1 (ko) | 2008-06-04 |
WO2005119795A1 (ja) | 2005-12-15 |
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