TWI282811B - Die-attaching paste and semiconductor device - Google Patents
Die-attaching paste and semiconductor device Download PDFInfo
- Publication number
- TWI282811B TWI282811B TW090108338A TW90108338A TWI282811B TW I282811 B TWI282811 B TW I282811B TW 090108338 A TW090108338 A TW 090108338A TW 90108338 A TW90108338 A TW 90108338A TW I282811 B TWI282811 B TW I282811B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- adhesive paste
- molecule
- polybutadiene
- paste
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 238000010526 radical polymerization reaction Methods 0.000 claims abstract description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 5
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 5
- 239000002685 polymerization catalyst Substances 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 38
- 230000001070 adhesive effect Effects 0.000 claims description 29
- 239000005062 Polybutadiene Substances 0.000 claims description 25
- 229920002857 polybutadiene Polymers 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- -1 acryl fluorenyl group Chemical group 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 2
- JOFQXPUKJJQCPW-UHFFFAOYSA-N 1-methyl-1-propylhydrazine Chemical compound CCCN(C)N JOFQXPUKJJQCPW-UHFFFAOYSA-N 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 230000000692 anti-sense effect Effects 0.000 claims 1
- 125000005641 methacryl group Chemical group 0.000 claims 1
- 238000005336 cracking Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PPQREHKVAOVYBT-UHFFFAOYSA-H dialuminum;tricarbonate Chemical compound [Al+3].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O PPQREHKVAOVYBT-UHFFFAOYSA-H 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 229930004069 diterpene Natural products 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- GWGODZWLKFUEOY-UHFFFAOYSA-N 1,4,5-trimethyl-2-phenylimidazole Chemical compound CN1C(C)=C(C)N=C1C1=CC=CC=C1 GWGODZWLKFUEOY-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- WOPPIQICQFNNLW-UHFFFAOYSA-N C(C)(C)C=1C(=C(C=CC=1)OOC1=C(C(=CC=C1)C(C)C)C(C)C)C(C)C Chemical group C(C)(C)C=1C(=C(C=CC=1)OOC1=C(C(=CC=C1)C(C)C)C(C)C)C(C)C WOPPIQICQFNNLW-UHFFFAOYSA-N 0.000 description 1
- SZVJCQQNPUIWNI-UHFFFAOYSA-N C1=CC=CC=2C3=CC=CC=C3CC12.C=CC Chemical compound C1=CC=CC=2C3=CC=CC=C3CC12.C=CC SZVJCQQNPUIWNI-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229940118662 aluminum carbonate Drugs 0.000 description 1
- ZRSKSQHEOZFGLJ-UHFFFAOYSA-N ammonium adipate Chemical compound [NH4+].[NH4+].[O-]C(=O)CCCCC([O-])=O ZRSKSQHEOZFGLJ-UHFFFAOYSA-N 0.000 description 1
- 235000019293 ammonium adipate Nutrition 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- XQYBHCMKXLINQE-UHFFFAOYSA-N buta-1,3-diene;prop-1-ene Chemical compound CC=C.C=CC=C XQYBHCMKXLINQE-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000004141 diterpene derivatives Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical compound ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- AFFZTFNQQHNSEG-UHFFFAOYSA-N trifluoromethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)F AFFZTFNQQHNSEG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
1282811 A7 B7 五、發明説明(1 ) 技術領域 本發明係有關抗焊接龜裂性優之粘著半導體用的晶片 粘著糊料及可靠性優之半導體裝置。 先行技術 近年來半導體裝置產量不斷增加,隨之而來的製造成 本之削減已成重要課題。半導體元件與導線架之接合方法 ’有利用金-砂共晶體等無機材料爲粘著劑之方法,但因 成本筒,且熱應力會使半導體元件破壞,於有機材料等分 散以塡料的晶片粘著糊料(糊狀粘著劑)之使用的方法已 成主流。 另一方面’半導體裝置之可靠性,尤以抗焊接龜裂性 至關重要。爲釐淸半導體裝置之抗焊接龜裂性,晶片粘著 糊料其與半導體元件,與導線架之線膨脹率之差的減低之 低彈性率化,乃更爲重要。 近年來,有關抗焊接龜裂性之要求漸嚴,隨著焊料之 無給化向來以2 4 0 °C爲迴焊條件者已變成2 6 0 °C之迴 焊條件,爲滿足此2 0 t:之溫度差,有更低彈性率化之要 求。低彈性率化之方法’向來已知有使用橡膠等低應力物 質之晶片粘著糊料,唯仍無法滿足近年來於抗焊接龜裂性 之要求,而企盼有更改進之晶片粘著糊料。 發明之揭示 本發明提供抗焊接龜裂性優之粘著半導體用晶片粘著 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -4 - — I--丨·---;---- (請先閱讀背面之注意事項再填寫本頁) 訂 έ 經濟部智慧財產局員工消費合作社印製 1282811 A7 B7 五、發明説明(2 ) 糊料’及可靠性優之半導體裝置。 本發明係以(A )數均分子量5 0 一分子內有至少1雙鍵的烴或其衍生物 釋劑’ (C)自由基聚合觸媒,及(d 之晶片粘著糊料。 較佳形態者,其數均分子量5 〇 〇 分子內有至少1雙鍵之烴或其衍生物( 酸之聚丁二烯與(甲基)丙烯酸之脂族 而得之化合物及環氧化之聚丁二烯之組 酯化或甲基丙烯酸酯化之聚丁二烯,或 烯醯基或甲基丙烯醯基之聚丁二烯及環 組合;反應性稀釋劑(B )係選自於一 基丙烯醯基或丙烯醯基之化合物,於一 原子之(甲基)丙烯醯單體,抑或酞酸 〇至5000之於 ,(B )反應性稀 )塡料爲必要成分 至5 0 0 A ),係 二醇的酯 合,兩末 室溫爲液 氧化之聚 分子內有 分子內有 二烯丙酯 0之於一 導入馬來 化物反應 端丙烯酸 態之具丙 丁二烯的 至少1甲 至少1氟 者;塡料 I----^---;--衣-- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 (叫
Si—r CH2
(D )之一部份,係選自鐵、鈷、鎳、銅、鋅之至少一種 金屬原子;晶片粘著糊料中含一般式(1 )所示之矽烷偶 合劑(E ),晶片粘著糊料中含有數均分子量5 0 0至 4 0 0 0之加氫型聚丁二烯,或係晶片粘著糊料中含於一 分子有至少1 一級胺基,熔點1 0 0 °C以上2 3 0 °C以下 之化合物作爲硬化促進劑(G )之晶片粘著糊料。 又,係用上述晶片粘著糊料所製作之半導體裝置。 s4—f ch2^(i) (R2)3-a 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)-5 - (R2)3-a 1282811 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(3 ) (Ri係碳原子數1至1 0之院氧基,R2係碳原子數 1至1 0之烷基,a係1至3之整數’ m係1至5之整數 ,11係1至1 0之整數) 發明之詳細說明 使用於本發明中之數均分子量5 0 0至5 0 0 0的於 一分子內有至少1雙鍵之烴或其衍生物(A ),發現可賦 予晶片粘著糊料硬化物柔軟性,於寬廣溫度領域可產生良 好之粘著性。例如交聯密度高不具柔軟性之硬化物,其內 聚力高,難以於與導線架或晶片之界面產生良好之粘著力 。而若數均分子量不足5 0 0則於硬化物中難以導入充分 交聯間距,不得充分之粘著性。另一方面’若數均分子量 超過5 0 0 0,則因粘度高無法以可獲充分粘著性之必要 量配合而不佳。 用於本發明之(A)成分有例如,異丁橡膠、異戊橡 膠、液態聚丁二烯等之二烯系橡膠、或其衍生物,衍生物 有壓克力改質之聚丁二烯,環氧改質之聚丁二烯等,此等 可以單獨或混合使用。 較佳之(A)成分係,導入馬來酸之聚丁二烯與(甲 基)丙烯酸之脂族二醇的酯化物反應而得之化合物及環氧 化聚丁二烯之組合,或二末端丙烯酸酯化或甲基丙烯酸酯 化之聚丁二烯,或室溫爲液態並有丙烯醯基或甲基丙烯酿 基之聚丁二烯及環氧化聚丁二烯之組合。 本發明之所謂(A )成分之數均分子量’係凝膠滲透 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -6 - 1282811 A7 B7 五、發明説明(4 ) 層析法的測定値之聚苯乙烯換算値。 (請先閱讀背面之注意事項再填寫本頁) 用於來本發明之反應性稀釋劑(B ),係因若僅用( A )成分則粘度高晶片粘著糊料之工作性差,爲調整晶片 粘著糊料之粘度,改進工作性進而提升硬化性之目的而使 用。較佳之(B )成分係於一分子內有至少1甲基丙烯醯 基或丙烯醯基之化合物,可舉例如,脂環式(甲基)丙· 酸酯、脂族(甲基)丙烯酸酯、芳族(甲基)丙烯酸酯等 ,具體而言,有1 ,6 -己二醇二甲基丙烯酸酯、1 ,9 一壬二醇二甲基丙烯酸酯、苯氧基二乙二醇丙烯酸酯、丙 烯酸月桂酯、丙烯酸硬脂酯、苯氧基乙基甲基丙烯酸酯等 ,而不限於此等。尙有,於一分子內有至少1氟原子之( 甲基)丙烯醯單體,以及酞酸二烯丙酯。這些可以單獨或 混合使用。 用於本發明之(A )成分的配合量,係以占(A )成 分及(B)成分合計重量之1 〇至9 0重量%者爲佳。不 足1 0重量%時粘著性差,超過9 0重量%時晶片粘著糊 料之粘度高,產生工作性問題而不佳。 經濟部智慧財產局員工消費合作社印製 用於本發明之自由基聚合觸媒(C),若係通常自由 基聚合用之觸媒即無特殊限制,理想者爲快速加熱試驗中 分解溫度(置1公克之試樣於電熱板上,以4 °C /分鐘升 溫時的開始分解之溫度)在4 0至1 4 0 °C時。分解溫度 不足4 0 °C,則晶片粘著糊料在常溫之保存性差,超過 1 4 0 °C則硬化時間極長而不佳。 滿足以上之觸媒的具體例可舉1 ,1 -雙(三級丁基 本紙張尺度適用中國國家標準(CNS ) A4規格(210乂297公釐) 1282811 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(5 ) 過氧基)-2-甲基環己烷、三級丁基過氧基新癸酸酯、 二異丙苯基化過氧等,這些可單獨或爲控制硬化性亦可二 種以上混合使用。再者,爲提升晶片粘著糊料之保存性亦 可預先添加各種聚合抑制劑。 自由基聚合觸媒(C )之配合量,係以相對於(A ) 成分及(B )成分之合計重量1〇 〇重量份,而以占 0 · 1至1 0重量份爲佳。超過1 〇重量份則晶片粘著糊 料之粘度的時間變化大,產生工作性問題,不足〇 · 1重. 量份則硬化性顯著惡化而不佳。 較佳者係,用一般式(1 )所示之砂院偶合劑(E ) 於本發明’粘著性可格外提升。一般式(1 )中’ R 1係碳 原子數1至1 〇之烷氧基,R2係碳原子數lgl 0之院基 。a係1至3之整數,藉烷氧基的碳原子數之調整’可調 整矽烷偶合劑與樹脂或塡料之反應性。m係1至5之整數 ,爲易於取得,m係以3爲佳。ΙΊ係1至1 0之整數,爲 易於取得,n係以2或4爲佳。以下呈示具體例’唯不限 於此等例。 OGH2CH3 CH3CH20 I 1 / \ _/ rw \一sr〇CH2CH3 V ;3 3 0CH2CH3 CH3CH2〇 一 Si I ch3ch2o 0CH2CH3 CH3CH20 , CH3〇H2〇-Si —^CH2^—S 4-(;CH2^^ 〇CH2 3 CH3CH2 QH2CH3 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家檩準(CNS ) A4規格(21Gx297公釐)-8 - 1282811 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(6 ) ch3(ch2)7? 〇(Chy7GH3 CH3(CH2)7〇一 Si —(- CH2^— S 4—^ CH2^—Si -〇(CH2)7CH3 ch3(ch2)7o 〇(ch2)7ch3 (E )成分之配合量,係以相對於(A )成分及(b )成分之合計1 00重量份,在Ο · Ο 1至1 0重量份爲 佳。不足0 · 0 1重量份,則粘著性之提升不充分,超過 1 0重量份則硬化速度低而不佳。 用於本發明之塡料(D )可舉例如,銀粉、金粉、鎳 粉、銅粉等導電塡料、氮化鋁、碳酸鈣、氧化矽、氧化銘 等之絕緣塡料,導電塡料係以銀粉、絕緣塡料係以氧化砂 爲佳。 此等塡料之配合量無特殊限定,以占全晶片粘著糊料 之2 0至9 5重量%爲佳。不足2 0重量%則貼著強度趨 於降低,超過9 5重量%則晶片粘著糊料之粘度加大晶片 粘著糊料之工作性趨於下降而不佳。 銀粉係用來賦予導電性,以鹵素離子、鹼金屬離子等 離子性雜質含量在1 0 p p m以下爲佳。又銀粉之形狀可 用片狀、樹枝狀、球狀等。隨必要的晶片粘著糊料之粘度 ,所用銀粉之粒徑有所不同,而通常平均粒徑係以2至 1 0微米,最大粒徑5 0微米以下者爲佳。平均粒徑不足 2微米,則晶片粘著糊料之粘度變高,超過1 〇微米則因 塗布或硬化時樹脂成分外流發生滲出而不佳。最大粒徑超 丨----^---^---- (請先閲讀背面之注意事項再填寫本頁} 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(21 o x 297公釐) -9 - 1282811 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(7 ) 過5 0微米則以配料機塗布晶片粘著糊料時,因發生針孔 堵塞而不佳。又可混合較粗銀粉及較細銀粉使用,形狀則 可混合各種形狀者。 絕緣塡料之一的氧化矽,以平均粒徑1至2 0微米, 最大粒徑5 0微米以下者爲佳。平均粒徑不足1微米則晶 片粘著糊料之粘度變高,超過2 0微米則塗布或硬化時因 樹脂成分流出發生滲出而不佳。最大粒徑超過5 0微米則 以配料機塗布晶片粘著糊料時,發生針孔堵塞而不佳。再 者,可混合較粗之氧化矽及較細之氧化矽使用,形狀則可 混合各種形狀者。 較佳者爲塡料之一部份含選自鐵、鈷、鎳、銅、鋅之 至少一種金屬原子,含量係晶片粘著糊料的〇 · 〇 1至 1 0重量%。此乃因鐵、鈷、鎳、銅、鋅等之原子可促進 樹脂之反應,可得良好硬化性之故。配合量少於晶片粘著 糊料的0 · 0 1重量%時不得目的之促進硬化效果,多於 1 ◦重量%時晶片粘著糊料在室溫之時間變化過大而不佳 。這些可將單獨之粒子配合,亦可於合金之形式配合。 本發明之晶片粘著糊料,必要時可添加其它偶合劑、 消泡劑、界面活性劑、彈性體、硬化促進劑等添加劑。 彈性體之較佳者,可以用數均分子量5 0 0至 4 0 0 〇之氫化型聚丁二烯,其添加已知可格外降低彈性 率。數均分子量不足5 0 0則低彈性率化不充分,而數均 分子量超過4 0 0 0則晶片粘著糊料粘度上升,有導致粘 著性下降之虞而不佳。 本紙張尺度適用中國國家標準icNS ) A4規格(210X297公釐) -- (請先閲讀背面之注意事項再填寫本頁) 1282811 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(8 ) 具體例有加氫型聚丁二烯(日本曹達(股)製,B I -2 0 0 0 ),壓克力改質加氫型聚丁二烯(日本曹達( 股)製,TEAI — 1〇〇〇)等。 加氫型聚丁二烯之配合量,係以相對於(A )成分及 (B)成分之合計1〇〇重量份,1至20重量份爲佳。 不足1重量份則低彈性率化不充分,超過2 0重量份則因 工作性、硬化性變差而不佳。 硬化促進劑(G )之較佳者,係於一分子內有至少1 一級胺基,熔點在1 0 0 t以上2 3 0 t以下之化合物。 其添加時因胺基具自由基啓始劑分解反應之促進作用可促 進硬化反應,當系內有自由基時可反應而具提升硬化物之 內聚力的效果。 熔點低於1 0 0 °c時糊料製作中或保存中隨反應之進 行粘度上升而不佳。又熔點高於2 3 0 X:則硬化中極可能 仍以固態存在於系內,不得目的效果而不佳。具體例可舉 雙氰胺、異酞酸二醯胼、己二酸二醯肼、癸二酸二醯肼、 碳化二醯肼、十二烷二酸二廳肼等,這些可單獨使用或二 種以上倂用。 硬化促進劑之配合量,相對於(A )成分及(B )成 分之合計重量1 0 0重量份,在〇 · 3至1 0重量份。少 於0 · 3重量份時,目的效果無法充分發揮,多於1 〇重 量份則晶片粘著糊料中固體成分過多工作性惡化而不佳。 本發明之晶片粘著糊料的製造方法,可係例如預混各 材料,用三輥機等混練後於真空下脫泡。. C-- (請先閱讀背面之注意事項存填寫本頁) ίI訂 L0. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 1282811 A7 B7 五、發明説明(9 ) 使用本發明之晶片粘著糊料的半導體裝置之製作方法 ’可用已知之方法。 本發明之最佳實施形態。 以下用實施例及比較例具體說明本發明。 實施例1至1 5及比較例1 _至 經濟部智慧財產局員工消費合作社印製 (A )成分壓克力改質之聚丁二烯(數均分子量:約 1 0 0 0,日本石油化學(股)製,Μ Μ — 1 〇 〇 〇 — 8 0),環氧改質聚丁二烯(其數均分子量:約1 0 〇 〇 ,日本石油化學(股)製,Ε— 1〇〇〇 一 8),二末端 丙烯酸酯或甲基丙烯酸酯化之聚丁二烯(其數均分子量: 約3 0 0 0,大阪有機化學(股)製,B A C — 4 5 ), (B )成分丙烯酸月桂酯(新中村化學工業(股)製,「 N K酯L A」),甲基丙烯酸三氟甲酯(共榮社化學(股 )製,「賴得酯Μ - 3 F」,鄰酞酸之二烯丙酯(「大曹 」(股)製,「大曹達單體」)’ (C)成分二異丙苯化 過氧(快速加熱試驗中之分解溫度:1 2 6 °C,曰本油脂 (股)製,「帕久米D」,(E)成分雙(3—三乙氧基 矽丙基)四硕(日本「尤尼加」(股)製’ A — 1289 ),塡料(D )片狀銀粉(平均粒徑3微米’最大粒徑 2 ◦微米),粉碎氧化矽(平均粒徑3微米’最大粒徑 1 6微米),銅粉(平均粒徑1微米),彈性體加氫型聚 丁二烯(日本曹達(股)製,BI-2000) ’硬化促 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 έ. l·. 1282811 A7 五、發明説明(1〇 ) 進劑(G )雙氰胺(試藥級,熔點2 (3 g · 5 〇c ),偶合 劑烷氧基矽烷(信越化學工業(股)製,K b M — 4 0 3 E )依表1之比例配合,用三輥機混練,脫泡後得 晶片粘著糊料。所得晶片粘著糊料之性能以如下方法評估 〇 而比較例係使用以上成分之一部份,或一部份再加上 雙酸A與環氧氯丙烷反應而得之二環氧丙基雙酚a型環氧 樹β曰(環氧當量1 8 0,室溫爲液態,以下略稱b丨s a 環氧),甲酚環氧丙醚(環氧當量18 5 ,以下略稱 C G E ),酚醛淸漆樹脂(羥基當量1 〇 4,軟化點8 5 C ’以下略稱pn) ,2 -苯基一 4,5 —二經基甲基咪 唑(四國化成工業(股)製,「熟化唑2 ρ η Z」),如 .同實施例,依表2配合得晶片粘著糊料。所得晶片粘著糊 料之性能依以下方法評估。 評估結果示於表1、2。 性通之評估方法 (1 )粘度:用E型粘度計(3。錐體)測定2 5 °c ,2 · 5 r p m下之値。 (2)彈性率:製成l〇xl5〇x〇.1毫米試片 (硬化條件1 7 5 °C,3 0分鐘),以拉伸試驗測定荷重 一變形曲線,由其初期斜率求出彈性率(測定長度: 1 0 0毫米,試驗速度:1毫米/分鐘,測定溫度:25 °C 。 (請先閱讀背面之注意事項再填寫本頁) C· ----訂 Λ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -13 - 1282811 五、發明説明(11 ) (3 )粘著強度 片粘著於銅架,於2 化。硬化後,用自動 晶片剪切強度。 (4 )抗焊接龜 線架(銅)及砂晶片 ’ 6 〇秒硬化粘著。 住友:電木(股)製) x 2 · 〇毫米),於 濕處理1 9 2小時後 1 0秒,三次迴焊) 本數,作爲抗焊接龜 8 ° A7 B7 :用所得糊料,將6 X 6毫米之矽晶 0 〇 °C之熱板上以3 〇秒或6 0秒硬 粘著力測定裝置測定2 6 〇 t:之高溫
裂性··用所得之晶片粘著糊料,將導 (6 X 6毫米)於熱板上以2 0 0 °C 之後用「住空」Ε Μ E — 7 0 2 6 ( 封裝材料封裝(Q F Ρ,1 4 X 2 0 6 0 °C,相對濕度6 0 °C,環境下吸 ’施以I R迴焊處理(2 6 0 °C, ’觀察剖面測定產生有內部龜裂之樣 裂性指標。供作本試驗之樣本總數二 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 14- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) 1282811 A7 B7 五、發明説明(13 ) 經濟部智慧財產局員工消費合作社印製 表2 比較例 1 2 3 配方 (A):BAC-45 25 (B):「NK 酯 LA」 25 (C ):「帕久米D」 0.5 0.5 (E)A-1289 0.5 0.5 KBM-403E 0.2 0.2 0.2 (D):銀粉 75.0 75.0 75.0 BisA環氧 16.0 CGE 6.9 PN 1.2 「熟化唑2PHZ j 0.7 性能 粘度(帕•秒) 34.5 12.3 20.8 彈性率(百萬帕) 3000 970 5600 粘著強度 30秒硬化 20 12 25 (牛頓/6 X 6毫米) 60秒硬化 24 23 50 抗焊接龜裂性 8/8 8/8 6/8 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ 16 - 1282811 A7 B7 五、發明説明(14 ) 如由表1及表2可知,本發明之晶片粘著糊料,其抗 焊接龜裂性優於比較例者。結果,使用本發明之晶片粘著 糊料,即可以製造可靠性優之半導體裝置。 產業上之利用可能性 本發明之晶片粘著糊料可以用作半導體產業中之接合 半導體元件及導線架用之粘著劑,藉本發明的糊料之使用 ’可得生產力、成本、特性等優良之半導體裝置。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
Claims (1)
1282811 公告本 A8 B8 C8 D8 六、申請專利範圍 第90 1 08338號專利申請案 中文申請專利範圍修正本 民國96年2月9日修正 1 · 一種晶片粘著糊料,其包含(A )數均分子量 5 0 0至5 〇 〇 〇,且於一分子內具有至少1個雙鍵之烴 或其衍生物,(B )反應性稀釋劑,(C )自由基聚合觸 媒’ (D)塡料及(e)下述一般式(1)表示之矽烷偶合 劑爲必要成分’其中數均分子量5 〇 〇至5 〇 〇 〇之一分 子內至少具有1個雙鍵之烴或其衍生物係由含有(A1 )馬 來酸化聚丁二烯與(甲基)丙烯酸之脂族二醇酯反應所得 的之化合物及環氧化聚丁二烯之組合物,(A2 )兩末端具 有丙烯酸酯或甲基丙烯酸酯化之聚丁二烯,或(A3)室溫 爲液態且含有丙烯基或甲基丙烯基之聚丁二烯及環氧化聚 丁二烯之組合物, (請先閱讀背面之注意事項再填寫本頁) 訂 (叫 (Rl)e
Sil· CH^ S CH2 ; Si、 (R2)3-a (R2)3 吒 ⑴ 經濟部智慧財產局員工消費合作社印製 (Ri係碳原子數1至1 0之烷氧基,R2係碳原子數 1至10之烷基,a係1至3之整數,m係1至5之整數 ,11係1至10之整數)。 2 ·如申請專利範圍第1項之晶片粘著糊料,其中反 義性稀釋劑(B )係於一分子內具有至少1個甲基丙嫌醯 _或丙烯醯基之化合物。 3 ·如申請專利範圍第1項之晶片粘著糊料,其中反 本紙張尺度適用中國國家標準(CNS )A4規格(210x297公釐)-1 - 1282811 A8 B8 C8 D8 六、申請專利範圍 應性稀釋劑(B )係,於一分子內具有至少 (甲基)丙烯酸單體。 4 ·如申請專利範圍第1項之晶片粘著糊米斗, ,其 應性稀釋劑(B )係酞酸二烯丙酯。 5 ·如申請專利範圍第1項之晶片粘著糊觀 ^ μ,其中塡 料(D )之一部份係選自鐵、鈷、鎳、銅、鋅> # , <主少一種 金屬原子。 6 ·如申請專利範圍第1項之晶片粘著糊料,_ φ t 有(F )數均分子量5 Ο 0至4 Ο Ο 0之加氫型聚Tz:jt 個氟元 素之 中反 7 ·如申請專利範圍第1項之晶片粘著糊料,其巾# 作爲硬化促進劑(G )之一分子內具有至少1個_級M ^ ,熔點在1 Ο 0 °C以上2 3 0 °C以下之化合物。 8 · —種半導體裝置,其特徵係使用申請專利範g第 1項之晶片粘著糊料而製造。 %* (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)-2 -
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US6716992B2 (en) * | 2002-07-22 | 2004-04-06 | National Starch And Chemical Investment Holding Corporation | Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
US6784025B2 (en) * | 2002-11-20 | 2004-08-31 | National Starch And Chemical Investment Holding Corporation | Semiconductor package with a die attach adhesive having silane functionality |
US6809155B2 (en) * | 2002-11-20 | 2004-10-26 | National Starch And Chemical Investment Holding Corporation | Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
WO2005017617A1 (en) | 2003-07-17 | 2005-02-24 | Honeywell International Inc. | Planarization films for advanced microelectronic applications and devices and methods of production thereof |
JP4967655B2 (ja) * | 2004-03-19 | 2012-07-04 | 住友ベークライト株式会社 | 樹脂組成物及び該樹脂組成物を使用して作製した半導体装置 |
US7763188B2 (en) * | 2005-03-04 | 2010-07-27 | International Business Machines Corporation | Electrically stable copper filled electrically conductive adhesive |
ATE397647T1 (de) * | 2006-03-06 | 2008-06-15 | Umicore Ag & Co Kg | Zusammensetzung zur befestigung von hochleistungshalbleiter |
US20070236542A1 (en) * | 2006-03-29 | 2007-10-11 | Graham David C | Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads |
US20110014354A1 (en) * | 2009-07-20 | 2011-01-20 | David Christopher Graham | Adhesive compositions and methods for use in failure analysis |
JP5767971B2 (ja) * | 2009-09-29 | 2015-08-26 | 電気化学工業株式会社 | 硬化性樹脂組成物 |
JP6207348B2 (ja) * | 2013-11-08 | 2017-10-04 | ナミックス株式会社 | 樹脂組成物、先供給型半導体封止剤および半導体装置 |
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JP4055215B2 (ja) | 1996-10-21 | 2008-03-05 | 日立化成工業株式会社 | 接着剤組成物 |
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MY127199A (en) | 2006-11-30 |
US20030146521A1 (en) | 2003-08-07 |
DE60102457T2 (de) | 2005-03-03 |
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