CN1232601C - 小片连接糊剂与半导体器件 - Google Patents
小片连接糊剂与半导体器件 Download PDFInfo
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- CN1232601C CN1232601C CNB018078729A CN01807872A CN1232601C CN 1232601 C CN1232601 C CN 1232601C CN B018078729 A CNB018078729 A CN B018078729A CN 01807872 A CN01807872 A CN 01807872A CN 1232601 C CN1232601 C CN 1232601C
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- polyhutadiene
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F290/06—Polymers provided for in subclass C08G
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Abstract
本发明提供了用于半导体集成电路片粘结的有优良的焊料防裂缝性能的小片连接糊剂。本发明在于小片连接糊剂包括有:(A)数均分子量500至5,000和在分子中至少有一个双键的烃,或它的衍生物,(B)反应性稀释剂,(C)游离基聚合的催化剂,和(D)填料作为主要成分。
Description
技术领域
本发明涉及使用于连接半导体集成电路片的有优良的焊料防裂缝性能的小片连接(die-attaching)糊剂。还涉及使用这种小片连接糊剂而生产的有优良的可靠性的半导体器件。
背景技术
近年来半导体器件的产量显示出稳定增长,因而它的生产成本的下降已成为一项重要的工作任务。为把半导体集成电路片连接到引线框上,一种方法是使用无机材料如金-硅低共熔物或类似物作为粘附剂。这种方法昂贵,并且可由于热应力导致半导体集成电路片的破损。因此,使用分散填料在有机物质中而得的小片连接糊剂(糊状的粘结剂)或类似物的方法已成为一种主要趋向。
同时,就半导体器件的使用可靠性而言,焊料的防裂缝性能是特别重要的。能使半导体器件有满意的焊料防裂缝性能的小片连接糊剂需要有低的弹性模量,以减小半导体集成电路片和引线框之间线性膨胀系数的差别。
近年来,对焊料防裂缝性能的要求日趋严格;因焊料已无铅,回流焊接条件已从240℃转移至260℃;为了满足这个20℃的温度增高,低的弹性模量已是必需的。对于低的弹性模量,使用有低应力物质(如橡胶)的小片连接糊剂迄今是已知的;然而,它们还不能满足近来对焊料防裂缝性能上的要求,因而需要有一种改进的小片连接糊剂。
本发明的内容
本发明的目的在于提供使用于半导体集成电路片连接的有优良焊料防裂缝性能的小片连接糊剂,和使用这种小片连接糊剂生产的有优良的可靠性的半导体器件。
按照本发明,所提供的小片连接糊剂的主要成分包括:
(A)数均分子量500至5,000和分子中至少有一个双键的烃,或它的衍生物,
(B)反应性稀释剂,
(C)游离基聚合的催化剂,和
(D)填料。
在优选的实施方案中,组分(A),即数均分子量500至5,000和分子中至少有一个双键的烃或它的衍生物是马来化的聚丁二烯和(甲基)丙烯酸/脂族二醇酯之间的反应而得的化合物和环氧化的聚丁二烯的组合物,或是在两端有丙烯酸基或甲基丙烯酸基的聚丁二烯,或是在室温为液态的含有丙烯酸基或甲基丙烯酸基的聚丁二烯和环氧化的聚丁二烯的组合物;反应性稀释剂(B)选自分子中至少有一个丙烯酸基或甲基丙烯酸基的化合物,分子中至少有一个氟原子的(甲基)丙烯酸单体和邻苯二甲酸二烯丙基酯;填料(D)中的一部分是选自铁、钴、镍、铜和锌的至少一种金属;小片连接糊剂还包含硅烷偶合剂(E),它可由下列的通式(1)表示:
其中R1是有1至10个碳原子的烷氧基,R2是有1至10个碳原子的烷基,a是1至3的整数,m是1至5的整数,和n是1至10的整数;小片连接糊剂还包括有数均分子量500至4,000的氢化了的聚丁二烯;小片连接糊剂还包括有固化促进剂(G),它是熔点100至230℃并且在分子中至少有一个伯胺基的化合物。
按照本发明,也提供了由使用上述优选的小片连接糊剂生产的半导体器件。
本发明的详细描述
按本发明所找到的数均分子量500至5,000和在分子中至少有一个双键的烃或它的衍生物,即本发明小片连接糊剂的组分(A)在小片连接糊剂固化时可使它成为在广泛的温度范围内有柔韧性和显示良好粘附性的固化材料。例如,在有高交联密度和没有柔韧性的固化材料的情况下,能有大的粘结力但在与引线框或小片的界面难以有大的附着力。当组分(A)的数均分子量小于500时,所得的小片连接糊剂难以给予固化材料的交联部位之间有足够的间距和没有足够的粘附性。而当数均分子量大于5,000时,组分(A)有高粘度和要使组分(A)的用量可达到有足够的粘附性是不可能的。因此,这些数均分子量的组分(A)是不被优选的。
本发明使用的组分(A)包括,例如,如丁基橡胶,异戊二烯橡胶,液体聚丁二烯的二烯型橡胶或类似物;和它们的衍生物。这些衍生物包括丙烯酸改性的聚丁二烯,环氧改性的聚丁二烯等。这些橡胶和衍生物可单一地或以混合物使用。
优选的组分(A)是马来化的聚丁二烯和(甲基)丙烯酸/脂族二醇酯之间的反应而得的化合物和环氧化的聚丁二烯的组合物;在两端有丙烯酸基或甲基丙烯酸基的聚丁二烯;或在室温为液态的含有丙烯酸基或甲基丙烯酸基的聚丁二烯和环氧化的聚丁二烯的组合物。
有关本发明组分(A)的数均分子量是由凝胶渗透色谱得的聚苯乙烯换算值。
在本发明中,反应性稀释剂(B)用于小片连接糊剂的粘度调节,改进操作性能和改进固化性能,因单一使用组分(A)而不使用组分(B)将使小片连接糊剂的粘度高和操作性能差。优选的组分(B)是分子中至少有一个丙烯酸基或甲基丙烯酸基的化合物,如丙烯酸甲基丙烯酸酯,脂族的(甲基)丙烯酸酯,芳族的(甲基)丙烯酸酯等。具体的实例是1,6-己二醇二甲基丙烯酸酯,1,9-壬二醇二甲基丙烯酸酯,苯氧基二甘醇丙烯酸酯,丙烯酸月桂酯,丙烯酸硬脂酯,甲基丙烯酸苯氧乙酯;不过,组分(B)不限于这些实例,分子中至少有一个氟原子的(甲基)丙烯酸单体和邻苯二甲酸二烯丙酯也可优选使用。这些化合物能单独使用或以混合物使用。
按组分(A)和组分(B)的总重量计,本发明中组分(A)的使用量优选10至90%的量。当组分(A)量小于10%的量时,所得的小片连接糊剂有低的粘附性。当它的量大于90%的量时,所得的小片连接糊剂有高的粘度和有操作使用上的问题。因此,这些量都是不被优选使用的。
游离基聚合的催化剂(C)的使用在本发明中是不严格的,只需它是通常游离基聚合反应中使用的催化剂。不过,游离基聚合的催化剂的分解温度在40至140℃的将优选使用,分解温度的测定是将1克试样放在电热板上以4℃/分钟升温的迅速加热试验时进行的。如分解温度低于40℃,所得的小片连接糊剂在室温有不好的储存性能。如分解温度高于140℃,所得的小片连接糊剂要求有很长的固化时间。
作为满足上述分解温度的催化剂的具体实例,可以提出的有1,1-双(叔丁基过氧基)-2-甲基环己烷,过氧新癸酸叔丁酯和过氧化二枯基。这些化合物可单一使用,或为了控制固化性能而两种或多种混合使用。为改进小片连接糊剂的储存性能还可以加入阻聚剂。
按组分(A)和组分(B)的总重量100份计,游离基聚合的催化剂(C)的使用量优选0.1至10份。当该量大于10份时,所得的小片连接糊剂随着时间显示有大的粘度变化和有使用性能方面的问题。当该量低于0.1份时,所得的小片连接糊剂大大地降低了固化性能。因此,这些量都是不被优选使用的。
在本发明的小片连接糊剂中,以通式(1)表示的硅烷偶合剂(E)是优选使用的,因所得的小片连接糊剂显示出有明显的改进的粘附性能。在通式(1)中,R1是有1至10个碳原子的烷氧基;R2是有1至10个碳原子的烷基;a是1至3的整数,它决定烷氧基中的碳原子数,并能控制偶合剂和树脂或填料之间的反应性能;m是1至5的整数,为了这种硅烷偶合剂使用的易获得性而优选3;n是1至10的整数,为了这种硅烷偶合剂使用的易获得性而优选2或4。硅烷偶合剂(E)的具体实例如下所示;不过,硅烷偶合剂(E)不限于这些实例。
按组分(A)和组分(B)的总重量100份计,组分(E)的使用量优选0.01至10份。当该量小于0.01份时,粘附性没有足够的改进。大于10份的量导致固化速度减慢。因此,这些量是不被优选的。
作为本发明使用的填料(D),可提出的例如,电导性的填料如银粉,金粉、镍粉、铜粉等;和绝缘性的填料如氮化铝,碳酸钙,二氧化硅,氧化铝等。优选的电导性的填料是银粉和优选的绝缘性的填料是二氧化硅。
填料的使用量是不严格的,但优选小片连接糊剂总重量的20至95%。当该量小于20%的量时,所得的粘附强度趋低。当该量大于95%的量时,所得的小片连接糊剂有高粘度和趋于显示差的操作性能。因此,这些量是不被优选的。
银粉是用来产生电导性的,它含有的离子杂质(如卤素离子和碱金属离子)的优选量不高于10ppm。银粉以薄片状,树枝状、球状或类似的形状使用。决定于对于所得小片连接糊剂粘度的要求,银粉的粒径有所不同。不过,优选的平均粒径一般在2至10μm,优选的最大粒径一般在50μm或以下。当平均粒径小于2μm时,所得的小片连接糊剂有高粘度。当平均粒径大于10μm时,所得的小片连接糊剂当涂覆或固化时出现树脂的渗出。因此,这些平均粒径是不被优选的。当最大粒径大于50μm时,所得的小片连接糊剂使用分配器涂覆时出现针状物的堵塞;因此这种最大粒径是不被优选的。可以使用相当粗的银粉和细的银粉的混合物。也可以使用不同形状的银粉的混合物。
作为绝缘填料的二氧化硅优选的平均粒径是1至20μm和最大粒径是50μm或以下。当平均粒径小于1μm,所得的小片连接糊剂有高粘度。当平均粒径大于20μm时,所得的小片连接糊剂在涂覆和固化时出现树脂的渗出。因此,这些平均粒径是不被优选的。当最大粒径大于50μm时,所得的小片连接糊剂使用分配器涂覆时出现针状物的堵塞。因此,这种最大粒径是不被优选的。可以使用相当粗的二氧化硅和细的二氧化硅的混合物。也可以使用不同形状的二氧化硅混合物。
选自铁、钴、镍、铜和锌中的至少一种金属元素作为填料含有的部分,优选含量按小片连接糊剂的重量计为0.01至10%。这是因为金属元素如铁、钴、镍、铜、锌等可促进本小片连接糊剂中的树脂反应并能使该糊剂有良好的固化性能。当金属元素量低于0.01%时,不能得到所指望的固化促进作用。当该量大于10%时,所得的小片连接糊剂在室温下随着时间显示出太大的变化。因此,这些量是不被优选的。以上的金属元素可以单种的粒子或以合金的形式使用。
必要时,添加剂如其他的偶合剂,防沫剂,表面活性剂,弹性体,固化促进剂等可加入于本发明的小片连接糊剂中。
作为弹性体,可优选使用数均分子量500至4,000的氢化聚丁二烯。这种弹性体的加入已发现可使弹性模量有很大的减低。当该弹性体的数均分子量小于500时,弹性模量不可能有足够的减低。当数均分子量大于4,000时,所得的小片连接糊剂增加粘度和减低粘附性。因此,这些数均分子量是不被优选的。
弹性体的具体实例有氢化聚丁二烯(BI-200,Nippon Soda有限公司的产品)和丙烯酸改性的氢化聚丁二烯(TEAI-1000,Nippon Soda有限公司的产品)。
氢化聚丁二烯的使用量按组分(A)和组分(B)的总重量100份计优选1至20份。当该量不足1份时,弹性模量不能得到足够的减低。多于20份将导致操作性能与固化性能的下降。因此,这些份量是不被优选的。
作为固化促进剂(G)而被优选的是熔点100至230℃和在分子中至少有一个伯胺基的化合物。因为胺基加速游离基引发剂的分解反应。加入这个化合物将加速本小片连接糊剂的固化反应。另外,因为胺基与羰基反应,当小片连接糊剂中有羰基时,该物的加入将增加小片连接糊剂中固化物质的内聚力。
熔点低于100℃是不优选的,因为在本小片连接糊剂生产或储存期间有上述反应的发生而导致粘度增大。熔点高于230℃也是不被优选的,因为甚至在本小片连接糊剂固化时期,固化促进剂(G)有很大可能仍为固体而不能有所期望的效应。作为固化促进剂(G)的具体实例,可提出的有双氰胺,间苯二酸二酰肼,己二酸二酰肼,癸二酸二酰肼,碳二酰肼(carbon dihydrazide)和十二双酸二酰肼。这些化合物可单一地,或两种或多种组合使用。
因此促进剂的用量按组分(A)和组分(B)总重量100份计是0.3至10份。当该量低于0.3份时,不能充分地得到所期望的效果。当该量高于10份时,所得的小片糊剂含有的固体物量太多而使操作性能下降。因此,这些量是不被优选的。
本发明的小片连接糊剂,例如是通过各个物质预混合,使用三辊研磨机或类似物捏和该预混合料,和使捏和料在真空下脱气而生产的。
为了使用本发明的小片连接糊剂生产半导体器件,可使用所熟知的方法。
执行本发明的最佳模式
下面通过实例与比较实例对本发明进行具体说明。
实例1-15和对照实例1-3
实例中将下列组分如表1指示的比例混合;所得的每种混合物用三辊研磨机捏和;每种捏和物脱气而得各种小片连接糊剂。按照下列方法对每种小片连接糊剂的性能进行评定。评定的结果见表1。
组分(A)
丙烯酸改性的聚丁二烯(数均分子量:约1,000,MM-1000-80,日本石油化学有限公司产品),环氧改性的聚丁二烯(数均分子量:约1,000,E-1000-8,日本石油化学有限公司产品),在两端有(甲基)丙烯酸基的聚丁二烯(数均分子量:约3,000,BAC-45,Osaka有机化学有限公司产品)。
组分(B)
丙烯酸肉桂酯(NK Ester LA,Shin-Nakamura化学有限公司产品),甲基丙烯酸三氟乙酯(Light Ester M-3F,Kyoeisha化学有限公司产品),0-邻苯二甲酸二烯丙酯(Daiso Dap单体,Daiso有限公司产品)。
组分(C)
过氧化二枯基(在迅速加热实验时的分解温度:126℃,Percumyl D,日本油脂有限公司产品)。
组分(E)
双(3-三乙氧基甲硅烷基丙基)四硫烷(A-1289,日本Unicar有限公司产品)。
填料(D)
片状银粉(平均粒径:3μm,最大粒径:20μm),碾碎的二氧化硅(平均粒径:3μm,最大粒径:16μm),
铜粉(平均粒径:1μm)
弹性体
氢化的聚丁二烯(BI-2000,日本Soda有限公司产品)
固化促进剂(G)
双氰胺(试剂,熔点:209.5℃)
偶合剂
烷氧硅烷(KBM-403E,Shin-Etsu化学有限公司产品)
在对照实例中,在实例中使用的组分的一部分,或它加入下列的物质被使用作为配料的物质。如表2指示的比例进行配料,然后如同实例中的同一方式实行捏和与脱气而得小片连接糊剂。按照下列的方法评定每种小片连接糊剂的性能,结果如表2所示。
通过双酚A和表氯醇的反应得到二缩水甘油双酚A型的环氧树脂(环氧当量:180,在室温为液态,此后缩写为双A环氧)。
甲苯基缩水甘油基醚(环氧当量:185,此后缩写CGE)。
酚的线型酚醛清漆树脂(羟基当量:104,软化点:85℃,此后缩写为PN),
2-苯基-4,5-二羟甲基咪唑(Curezole 2PHZ,Shikoku化学公司产品)性能的评定
(1)粘度
使用E型粘度计(3°锥体)在25℃以2.5rpm测量。
(2)弹性模量
制作10×150×0.1mm的试验片(固化条件:175℃,30分钟)。试验片遭受张力试验以测量负载位移曲线(试验长度:100mm,试验速度:1mm/min,试验温度:25℃),从曲线的起始梯度测定模量。
(3)粘附强度
使用所制得的糊剂将6×6mm硅集成电路片封固在铜的框上。由此得的部件放于200℃的热板上达30秒和60秒使出现糊剂的固化。然后使用自动粘附强度试验机于260℃测定热小片的抗剪强度。
(4)焊料的防裂缝性能
使用所得小片连接糊剂将铜引线框和硅集成电路片(6×6mm)粘结,该糊剂在200℃的热板上固化60秒。然后,所得的组件用封装材料(Sumikon EME-7026,Sumitomo Bakelite有限公司产品)封装而得封装的组件(QFP,14×20×2.0mm)。封装的组件在60℃和相对湿度60%的大气中遭受湿气吸收处理达192小时,再受到IR回流处理(260℃、10秒,回流三次),此后通过截面的观察检查有内部裂缝的样品数目,并以此作为焊料防裂缝性能的标准。试验使用的样品总数为8。
表1
实例 | ||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | |
配料 | ||||||||
(A)BAC-45 | 12.5 | 20 | 5 | 37.5 | 12.5 | 12.5 | 12.5 | 12.5 |
(A)MM-1000-80 | ||||||||
(A)E-1000-8 | ||||||||
(B)NK酯LA | 12.5 | 5 | 20 | 37.5 | 12.5 | 12.5 | 12.5 | 12.5 |
(B)轻质酯M-3F | ||||||||
(B)Daiso Dap单体 | ||||||||
(C)Percumyl D | 0.5 | 0.5 | 0.5 | 1.5 | 0.1 | 1.75 | 0.5 | 0.5 |
(E)A-1289 | 0.5 | 0.5 | 0.5 | 2.25 | 0.5 | 0.5 | 0.1 | 1.75 |
BI-2000 | ||||||||
(G)双氰胺 | ||||||||
KBM-403E | 0.2 | 0.2 | 0.2 | 0.75 | 0.2 | 0.2 | 0.2 | 0.2 |
(D)银粉 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | |
(D)铜粉 | ||||||||
(D)碾碎的二氧化硅 | 25 | |||||||
性能 | ||||||||
粘度(Pa·s) | 18.1 | 24.3 | 16.2 | 21.3 | 18.3 | 18 | 18.2 | 17.9 |
弹性模量(Mpa) | 3300 | 2900 | 2800 | 3000 | 3100 | 3200 | 3000 | 3100 |
粘附强度(N/6×6mm) | ||||||||
30秒固化 | 60 | 55 | 50 | 58 | 50 | 63 | 62 | 54 |
60秒固化 | 72 | 77 | 70 | 77 | 71 | 78 | 66 | 78 |
焊料防裂缝性能 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 |
表1续
实例 | |||||||
9 | 10 | 11 | 12 | 13 | 14 | 15 | |
配料 | |||||||
(A)BAC-45 | 12.5 | 12.5 | 12.5 | 12.5 | 12.5 | 12.5 | |
(A)MM-1000-80 | 10 | ||||||
(A)E-1000-8 | 2.5 | ||||||
(B)NK酯LA | 12.5 | 12.5 | 12.5 | 12.5 | 12.5 | ||
(B)轻质酯M-3F | 12.5 | ||||||
(B)Daiso Dap单体 | 12.5 | ||||||
(C)Percumyl D | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(E)A-1289 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | |
BI-2000 | 2.5 | ||||||
(G)双氰胺 | 0.5 | ||||||
KBM-403E | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
(D)银粉 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 |
(D)铜粉 | 0.5 | ||||||
(D)碾碎的二氧化硅 | |||||||
性能 | |||||||
粘度(Pa·s) | 20.5 | 21.4 | 21.2 | 22.1 | 21.8 | 23.1 | 17.6 |
弹性模量(Mpa) | 3800 | 3400 | 3200 | 3500 | 3600 | 2400 | 3200 |
粘附强度(N/6×6mm) | |||||||
30秒固化 | 65 | 67 | 65 | 75 | 82 | 55 | 36 |
60秒固化 | 94 | 87 | 89 | 78 | 90 | 87 | 45 |
焊料防裂缝性能 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 | 0/8 | 1/8 |
表2
对照实例 | |||
1 | 2 | 3 | |
配料 | |||
(A)BAC-45 | 25 | ||
(B)NK酯LA | 25 | ||
(C)Percumyl D | 0.5 | 0.5 | |
(E)A-1289 | 0.5 | 0.5 | |
KBM-403E | 0.2 | 0.2 | 0.2 |
(D)银粉 | 75.0 | 75.0 | 75.0 |
双A环氧 | 16.0 | ||
CGE | 6.9 | ||
PN | 1.2 | ||
Curezole 2PHZ | 0.7 | ||
性能 | |||
粘度(Pa·s) | 34.5 | 12.3 | 20.8 |
弹性模量(Mpa) | 3000 | 970 | 5600 |
粘附强度(N/6×6mm) | |||
30秒固化 | 20 | 12 | 25 |
60秒固化 | 24 | 23 | 50 |
焊料防裂缝性能 | 8/8 | 8/8 | 6/8 |
从表1和表2清楚可见,本发明的小片连接软糊剂与对照实例的小片连接软糊剂相比具有优良的防裂缝性能。因此,使用本发明的小片连接糊剂能生产出有优良的可靠性能的半导体器件。
工业应用
在半导体工业中,本发明的小片连接糊剂能被用来作为半导体集成电路片与引线框的粘结剂。使用本小片连接糊剂生产的半导体器件在产率、成本与性能等方面都是优越的。
Claims (9)
1.小片连接糊剂,其主要成分包括:
(A)数均分子量为500至5000和分子中至少有一个双键的烃,或它的衍生物,所述的烃或它的衍生物为:
(A1)通过马来化的聚丁二烯和丙烯酸或甲基丙烯酸/脂族二醇酯反应而得到的化合物和环氧化的聚丁二烯的组合物,
(A2)在两端有丙烯酸基或甲基丙烯酸基的聚丁二烯,或
(A3)在室温为液态的含有丙烯酸基或甲基丙烯酸基的聚丁二烯和环氧化的聚丁二烯的组合物,
(B)反应性稀释剂,
(C)游离基聚合的催化剂,和
(D)填料。
2.权利要求1的小片连结糊剂,其中反应性稀释剂(B)是分子中至少有一个丙烯酸基或甲基丙烯酸基的化合物。
3.权利要求1的小片连结糊剂,其中反应性稀释剂(B)是分子中至少有一个氟原子的丙烯酸或甲基丙烯酸单体。
4.权利要求1的小片连结糊剂,其中反应性稀释剂(B)是邻苯二甲酸二烯丙酯。
5权利要求1的小片连结糊剂,其中填料(D)的一部分是选自铁、钴、镍、铜和锌的至少一种金属元素。
7.权利要求1的小片连结糊剂,还包括;
(F)数均分子量为500至4000的氢化聚丁二烯。
8.权利要求1的小片连结糊剂,还包括:
(G)固化促进剂,它是熔点为100至230℃和在分子中至少有一个伯胺基的化合物。
9.使用权利要求1所述的小片连结糊剂生产的半导体器件。
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JP107637/00 | 2000-04-10 | ||
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JP2000107637 | 2000-04-10 | ||
JP257734/00 | 2000-08-20 | ||
JP257734/2000 | 2000-08-20 | ||
JP2000257734 | 2000-08-28 | ||
JP2000281109 | 2000-09-18 | ||
JP281109/00 | 2000-09-18 | ||
JP281109/2000 | 2000-09-18 | ||
JP296899/00 | 2000-09-28 | ||
JP2000296899 | 2000-09-28 | ||
JP296899/2000 | 2000-09-28 | ||
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US6716992B2 (en) * | 2002-07-22 | 2004-04-06 | National Starch And Chemical Investment Holding Corporation | Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
US6809155B2 (en) * | 2002-11-20 | 2004-10-26 | National Starch And Chemical Investment Holding Corporation | Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
US6784025B2 (en) * | 2002-11-20 | 2004-08-31 | National Starch And Chemical Investment Holding Corporation | Semiconductor package with a die attach adhesive having silane functionality |
KR101020164B1 (ko) | 2003-07-17 | 2011-03-08 | 허니웰 인터내셔날 인코포레이티드 | 진보된 마이크로전자적 응용을 위한 평탄화 막, 및 이를제조하기 위한 장치 및 방법 |
SG151269A1 (en) * | 2004-03-19 | 2009-04-30 | Sumitomo Bakelite Co | Resin composition and semiconductor device produced by using the same |
US7763188B2 (en) * | 2005-03-04 | 2010-07-27 | International Business Machines Corporation | Electrically stable copper filled electrically conductive adhesive |
ATE397647T1 (de) * | 2006-03-06 | 2008-06-15 | Umicore Ag & Co Kg | Zusammensetzung zur befestigung von hochleistungshalbleiter |
US20070236542A1 (en) * | 2006-03-29 | 2007-10-11 | Graham David C | Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads |
US20110014354A1 (en) * | 2009-07-20 | 2011-01-20 | David Christopher Graham | Adhesive compositions and methods for use in failure analysis |
JP5767971B2 (ja) * | 2009-09-29 | 2015-08-26 | 電気化学工業株式会社 | 硬化性樹脂組成物 |
JP6207348B2 (ja) * | 2013-11-08 | 2017-10-04 | ナミックス株式会社 | 樹脂組成物、先供給型半導体封止剤および半導体装置 |
KR102356391B1 (ko) | 2016-07-20 | 2022-01-26 | 쇼와덴코머티리얼즈가부시끼가이샤 | 고주파 대역의 신호를 사용하는 전자 기기용 복합 필름, 프린트 배선판 및 그의 제조 방법 |
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JP4055215B2 (ja) | 1996-10-21 | 2008-03-05 | 日立化成工業株式会社 | 接着剤組成物 |
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DE60102457D1 (de) | 2004-04-29 |
US6861013B2 (en) | 2005-03-01 |
EP1274808B1 (en) | 2004-03-24 |
WO2001077243B1 (en) | 2001-12-13 |
US20030146521A1 (en) | 2003-08-07 |
WO2001077243A1 (en) | 2001-10-18 |
CN1422315A (zh) | 2003-06-04 |
KR100804889B1 (ko) | 2008-02-20 |
TWI282811B (en) | 2007-06-21 |
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