TWI280077B - Ag paste composition for microelectrode formation and microelectrode formed using the same - Google Patents

Ag paste composition for microelectrode formation and microelectrode formed using the same Download PDF

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Publication number
TWI280077B
TWI280077B TW093103048A TW93103048A TWI280077B TW I280077 B TWI280077 B TW I280077B TW 093103048 A TW093103048 A TW 093103048A TW 93103048 A TW93103048 A TW 93103048A TW I280077 B TWI280077 B TW I280077B
Authority
TW
Taiwan
Prior art keywords
weight
group
paste composition
silver paste
composition
Prior art date
Application number
TW093103048A
Other languages
English (en)
Chinese (zh)
Other versions
TW200501835A (en
Inventor
Chan-Seok Park
Byung-Joo Chung
Bong-Gi Kim
Young-Gil Yoo
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200501835A publication Critical patent/TW200501835A/zh
Application granted granted Critical
Publication of TWI280077B publication Critical patent/TWI280077B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H01J2211/225—Material of electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW093103048A 2003-02-11 2004-02-10 Ag paste composition for microelectrode formation and microelectrode formed using the same TWI280077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030008451A KR100581971B1 (ko) 2003-02-11 2003-02-11 미세 전극 형성용 고점도 Ａｇ 페이스트 조성물 및 이를이용하여 제조된 미세 전극

Publications (2)

Publication Number Publication Date
TW200501835A TW200501835A (en) 2005-01-01
TWI280077B true TWI280077B (en) 2007-04-21

Family

ID=32866876

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103048A TWI280077B (en) 2003-02-11 2004-02-10 Ag paste composition for microelectrode formation and microelectrode formed using the same

Country Status (3)

Country Link
KR (1) KR100581971B1 (ko)
TW (1) TWI280077B (ko)
WO (1) WO2004072736A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640971B2 (ja) * 2005-09-08 2011-03-02 東京応化工業株式会社 プラズマディスプレイの遮光性パターン形成用感光性樹脂組成物
KR100871075B1 (ko) * 2006-04-18 2008-11-28 주식회사 동진쎄미켐 인쇄용 페이스트 조성물
CN100435366C (zh) * 2006-06-08 2008-11-19 天津大学 以纳米银焊膏低温烧结封装连接大功率led的方法
US7655864B2 (en) * 2006-07-13 2010-02-02 E.I Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
KR101280489B1 (ko) * 2007-05-09 2013-07-01 주식회사 동진쎄미켐 태양전지 전극 형성용 페이스트
KR100978736B1 (ko) * 2008-05-01 2010-08-30 주식회사 엘 앤 에프 Ｐｄｐ 전극용 도전성 페이스트 조성물 및 이의 제조방법
US20120234384A1 (en) * 2011-03-15 2012-09-20 E.I. Du Pont Nemours And Company Conductive metal paste for a metal-wrap-through silicon solar cell
US20120234383A1 (en) * 2011-03-15 2012-09-20 E.I.Du Pont De Nemours And Company Conductive metal paste for a metal-wrap-through silicon solar cell
JP6646643B2 (ja) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3758220B2 (ja) * 1995-11-17 2006-03-22 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JPH1074419A (ja) * 1996-06-25 1998-03-17 Du Pont Kk チップ抵抗体の端子電極用導電性ペースト組成物
JPH11120818A (ja) * 1997-10-16 1999-04-30 Tdk Corp 導電体ペーストおよびそれを用いた非可逆回路素子
JPH11154417A (ja) * 1997-11-21 1999-06-08 Dainippon Printing Co Ltd 電極形成用銀ペースト
WO2000040632A1 (fr) * 1998-12-28 2000-07-13 Daicel Chemical Industries, Ltd. Composition de resine durcissable, copolymere modifie et composition de resine, et pate de verre photodurcissable pour developpement de type alcalin
KR100351230B1 (ko) * 2000-06-09 2002-09-05 대주정밀화학 주식회사 전극용 도전 페이스트 조성물
KR100390345B1 (ko) * 2000-12-29 2003-07-07 엘지마이크론 주식회사 플라즈마 디스플레이 패널 후면판용 전극 페이스트
JP2002311581A (ja) * 2001-04-16 2002-10-23 Sumitomo Bakelite Co Ltd 感光性銀ペースト及びそれを用いた画像表示装置
JP2002323756A (ja) * 2001-04-25 2002-11-08 Kansai Paint Co Ltd ネガ型感エネルギー線性ペースト及びそれを使用したパターン形成方法

Also Published As

Publication number Publication date
WO2004072736A1 (en) 2004-08-26
KR100581971B1 (ko) 2006-05-22
KR20040072809A (ko) 2004-08-19
TW200501835A (en) 2005-01-01

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