TW200501835A - Ag paste composition for microelectrode formation and microelectrode formed using the same - Google Patents

Ag paste composition for microelectrode formation and microelectrode formed using the same

Info

Publication number
TW200501835A
TW200501835A TW093103048A TW93103048A TW200501835A TW 200501835 A TW200501835 A TW 200501835A TW 093103048 A TW093103048 A TW 093103048A TW 93103048 A TW93103048 A TW 93103048A TW 200501835 A TW200501835 A TW 200501835A
Authority
TW
Taiwan
Prior art keywords
paste composition
microelectrode
formation
same
powders
Prior art date
Application number
TW093103048A
Other languages
Chinese (zh)
Other versions
TWI280077B (en
Inventor
Chan-Seok Park
Byung-Joo Chung
Bong-Gi Kim
Young-Gil Yoo
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200501835A publication Critical patent/TW200501835A/en
Application granted granted Critical
Publication of TWI280077B publication Critical patent/TWI280077B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H01J2211/225—Material of electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Provided are a high viscosity Ag paste composition and a microelectrode formed using the Ag paste composition. The Ag paste composition includes (a) 60 to 80 wt% of Ag powders, (b) 1 to 10 wt% of an inorganic binder, (c) 0.001 to 1 wt% of a stabilizer, and (d) 15 to 35 wt% of a negative photoresist composition that disperses conductive micro-powders and is soluble in an alkaline. The Ag paste composition can be applied in a sintering process of less than 600 DEG C and thus is suitable for PDP fabrication. Also, because of high viscosity, the Ag paste composition is suitable for microelectrode formation and has good printing property. In addition, because a surfactant and an organic solvent are not separately used, the Ag paste composition can be prepared simply and economically, and is environmental friendly.
TW093103048A 2003-02-11 2004-02-10 Ag paste composition for microelectrode formation and microelectrode formed using the same TWI280077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030008451A KR100581971B1 (en) 2003-02-11 2003-02-11 An Ag paste composition for forming micro-electrode and the micro-electrode manufactured using the same

Publications (2)

Publication Number Publication Date
TW200501835A true TW200501835A (en) 2005-01-01
TWI280077B TWI280077B (en) 2007-04-21

Family

ID=32866876

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103048A TWI280077B (en) 2003-02-11 2004-02-10 Ag paste composition for microelectrode formation and microelectrode formed using the same

Country Status (3)

Country Link
KR (1) KR100581971B1 (en)
TW (1) TWI280077B (en)
WO (1) WO2004072736A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640971B2 (en) * 2005-09-08 2011-03-02 東京応化工業株式会社 Photosensitive resin composition for light shielding pattern formation of plasma display
KR100871075B1 (en) * 2006-04-18 2008-11-28 주식회사 동진쎄미켐 Paste composition for printing
CN100435366C (en) * 2006-06-08 2008-11-19 天津大学 Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste
US7655864B2 (en) * 2006-07-13 2010-02-02 E.I Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
KR101280489B1 (en) * 2007-05-09 2013-07-01 주식회사 동진쎄미켐 A paste for producing electrode of solar cell
KR100978736B1 (en) * 2008-05-01 2010-08-30 주식회사 엘 앤 에프 A conductive paste composition for PDP electrode and manufacturing method thereof
US20120234384A1 (en) * 2011-03-15 2012-09-20 E.I. Du Pont Nemours And Company Conductive metal paste for a metal-wrap-through silicon solar cell
US20120234383A1 (en) * 2011-03-15 2012-09-20 E.I.Du Pont De Nemours And Company Conductive metal paste for a metal-wrap-through silicon solar cell
JP6646643B2 (en) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド Photosensitive composition and its use

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3758220B2 (en) * 1995-11-17 2006-03-22 東レ株式会社 Photosensitive conductive paste and electrode manufacturing method
JPH1074419A (en) * 1996-06-25 1998-03-17 Du Pont Kk Conductive paste composition for terminal electrode of chip resistor
JPH11120818A (en) * 1997-10-16 1999-04-30 Tdk Corp Conductive paste and irreversible circuit element using this paste
JPH11154417A (en) * 1997-11-21 1999-06-08 Dainippon Printing Co Ltd Silver paste for forming electrode
WO2000040632A1 (en) * 1998-12-28 2000-07-13 Daicel Chemical Industries, Ltd. Curable resin composition, modified copolymer and resin composition, and alkali development type photocurable glass paste
KR100351230B1 (en) * 2000-06-09 2002-09-05 대주정밀화학 주식회사 Conductive paste composition for electrodes
KR100390345B1 (en) * 2000-12-29 2003-07-07 엘지마이크론 주식회사 Electrode paste for rear panel of plasma display panel
JP2002311581A (en) * 2001-04-16 2002-10-23 Sumitomo Bakelite Co Ltd Photosensitive silver paste and image display using the same
JP2002323756A (en) * 2001-04-25 2002-11-08 Kansai Paint Co Ltd Negative type energy beam sensitive paste, and pattern forming method using the same

Also Published As

Publication number Publication date
KR20040072809A (en) 2004-08-19
TWI280077B (en) 2007-04-21
KR100581971B1 (en) 2006-05-22
WO2004072736A1 (en) 2004-08-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees