TWI276194B - Transfer member with electric conductivity and its manufacturing method - Google Patents
Transfer member with electric conductivity and its manufacturing method Download PDFInfo
- Publication number
- TWI276194B TWI276194B TW091134929A TW91134929A TWI276194B TW I276194 B TWI276194 B TW I276194B TW 091134929 A TW091134929 A TW 091134929A TW 91134929 A TW91134929 A TW 91134929A TW I276194 B TWI276194 B TW I276194B
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer
- transfer member
- electrically conductive
- carbon fiber
- polyether
- Prior art date
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 119
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229920000642 polymer Polymers 0.000 claims abstract description 142
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 120
- 239000004917 carbon fiber Substances 0.000 claims abstract description 118
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 75
- 239000011208 reinforced composite material Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 25
- 229920001940 conductive polymer Polymers 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 39
- 125000003118 aryl group Chemical group 0.000 claims description 34
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 23
- 229920000768 polyamine Polymers 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 22
- 229920000728 polyester Polymers 0.000 claims description 22
- -1 polypropylene Polymers 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 15
- 239000000835 fiber Substances 0.000 claims description 15
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 13
- 239000004202 carbamide Substances 0.000 claims description 13
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 12
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 12
- 229920002313 fluoropolymer Polymers 0.000 claims description 12
- 239000004811 fluoropolymer Substances 0.000 claims description 12
- 229920001778 nylon Polymers 0.000 claims description 12
- 229920000877 Melamine resin Polymers 0.000 claims description 11
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 11
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 11
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 11
- 239000004760 aramid Substances 0.000 claims description 11
- 229920003235 aromatic polyamide Polymers 0.000 claims description 11
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 11
- 150000002923 oximes Chemical class 0.000 claims description 11
- 229920000570 polyether Polymers 0.000 claims description 11
- 229920002530 polyetherether ketone Polymers 0.000 claims description 11
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 11
- 229920001155 polypropylene Polymers 0.000 claims description 11
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 10
- 229920006324 polyoxymethylene Polymers 0.000 claims description 10
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 10
- 229920002098 polyfluorene Polymers 0.000 claims description 9
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 8
- 239000004800 polyvinyl chloride Substances 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 3
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 3
- 150000002466 imines Chemical class 0.000 claims description 3
- 229920005601 base polymer Polymers 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000052 vinegar Substances 0.000 claims description 2
- 235000021419 vinegar Nutrition 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims 10
- 150000001875 compounds Chemical class 0.000 claims 10
- 238000006116 polymerization reaction Methods 0.000 claims 10
- 229920006305 unsaturated polyester Polymers 0.000 claims 8
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 claims 5
- 229920000151 polyglycol Polymers 0.000 claims 4
- 239000010695 polyglycol Substances 0.000 claims 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 3
- 229920002492 poly(sulfone) Polymers 0.000 claims 3
- ODHUFJLMXDXVRC-UHFFFAOYSA-N tripropyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCOC(=O)CC(O)(C(=O)OCCC)CC(=O)OCCC ODHUFJLMXDXVRC-UHFFFAOYSA-N 0.000 claims 3
- 229920002554 vinyl polymer Polymers 0.000 claims 3
- QGVQOXWNOSEKGM-UHFFFAOYSA-N 2-hydroxyacetic acid;prop-1-ene Chemical compound CC=C.OCC(O)=O QGVQOXWNOSEKGM-UHFFFAOYSA-N 0.000 claims 2
- 241000510672 Cuminum Species 0.000 claims 2
- 235000007129 Cuminum cyminum Nutrition 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 239000004793 Polystyrene Substances 0.000 claims 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 2
- 150000007974 melamines Chemical class 0.000 claims 2
- 229920002223 polystyrene Polymers 0.000 claims 2
- 229910052707 ruthenium Inorganic materials 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910052779 Neodymium Inorganic materials 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000005864 Sulphur Substances 0.000 claims 1
- HABAXTXIECRCKH-UHFFFAOYSA-N bis(prop-2-enyl) butanedioate Chemical compound C=CCOC(=O)CCC(=O)OCC=C HABAXTXIECRCKH-UHFFFAOYSA-N 0.000 claims 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 claims 1
- 229940106681 chloroacetic acid Drugs 0.000 claims 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 claims 1
- MQHNKCZKNAJROC-UHFFFAOYSA-N dipropyl phthalate Chemical compound CCCOC(=O)C1=CC=CC=C1C(=O)OCCC MQHNKCZKNAJROC-UHFFFAOYSA-N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims 1
- 229920000767 polyaniline Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims 1
- 229920001567 vinyl ester resin Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract description 14
- 230000003068 static effect Effects 0.000 abstract description 14
- 235000012431 wafers Nutrition 0.000 abstract description 11
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 15
- 239000002344 surface layer Substances 0.000 description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 229910052799 carbon Inorganic materials 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 239000004634 thermosetting polymer Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012792 core layer Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 7
- 238000006386 neutralization reaction Methods 0.000 description 6
- 239000010426 asphalt Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 239000003733 fiber-reinforced composite Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000010079 rubber tapping Methods 0.000 description 3
- 239000010455 vermiculite Substances 0.000 description 3
- 229910052902 vermiculite Inorganic materials 0.000 description 3
- 235000019354 vermiculite Nutrition 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011301 petroleum pitch Substances 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011300 coal pitch Substances 0.000 description 1
- 239000011294 coal tar pitch Substances 0.000 description 1
- 239000011365 complex material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011302 mesophase pitch Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- JCBJVAJGLKENNC-UHFFFAOYSA-M potassium ethyl xanthate Chemical compound [K+].CCOC([S-])=S JCBJVAJGLKENNC-UHFFFAOYSA-M 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000006833 reintegration Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Crystal (AREA)
- Moulding By Coating Moulds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33458701P | 2001-12-03 | 2001-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200303064A TW200303064A (en) | 2003-08-16 |
| TWI276194B true TWI276194B (en) | 2007-03-11 |
Family
ID=23307891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091134929A TWI276194B (en) | 2001-12-03 | 2002-12-02 | Transfer member with electric conductivity and its manufacturing method |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1451854B1 (enExample) |
| JP (1) | JP4383173B2 (enExample) |
| KR (1) | KR100887126B1 (enExample) |
| CN (1) | CN1332419C (enExample) |
| AT (1) | ATE308799T1 (enExample) |
| AU (1) | AU2002360823A1 (enExample) |
| CA (1) | CA2469475C (enExample) |
| DE (1) | DE60207105T2 (enExample) |
| ES (1) | ES2251626T3 (enExample) |
| TW (1) | TWI276194B (enExample) |
| WO (1) | WO2003049157A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6794662B1 (en) * | 2003-10-07 | 2004-09-21 | Ibis Technology Corporation | Thermosetting resin wafer-holding pin |
| DE10357698A1 (de) * | 2003-12-09 | 2005-07-14 | Schunk Kohlenstofftechnik Gmbh | Träger für zu behandelnde Gegenstände sowie Verfahren zur Herstellung eines solchen |
| JP2006049384A (ja) * | 2004-07-30 | 2006-02-16 | Laserfront Technologies Inc | ガントリー型ｘｙステージ |
| JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
| JP2007201066A (ja) * | 2006-01-25 | 2007-08-09 | Murata Mach Ltd | 枚葉搬送用トレイ及び枚葉搬送用トレイの保管又は搬送装置 |
| JP4895635B2 (ja) * | 2006-02-20 | 2012-03-14 | セイコーインスツル株式会社 | 搬送装置 |
| US20070221335A1 (en) * | 2006-03-23 | 2007-09-27 | Recif Technologies | Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device |
| JP2008034723A (ja) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | 半導体ウェーハ用接触部品 |
| WO2017188377A1 (ja) * | 2016-04-27 | 2017-11-02 | 京セラ株式会社 | 試料搬送部材 |
| JP7093655B2 (ja) * | 2018-03-20 | 2022-06-30 | 三菱重工業株式会社 | 複合材料構造体及び複合材料構造体の製造方法 |
| CN108646395A (zh) * | 2018-05-04 | 2018-10-12 | 江苏羿骏自动化科技有限公司 | 一种多工位移动型显微镜检测设备 |
| JP7471743B2 (ja) * | 2019-11-20 | 2024-04-22 | 株式会社ディスコ | 搬送路 |
| JP2022102893A (ja) * | 2020-12-25 | 2022-07-07 | 京セラ株式会社 | 試料搬送部材 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58207651A (ja) * | 1982-05-28 | 1983-12-03 | Hitachi Ltd | 静電防止型収容治具 |
| JPS63133644A (ja) * | 1986-11-26 | 1988-06-06 | Hitachi Electronics Eng Co Ltd | ウエハ搬送フオ−ク |
| JPH03296243A (ja) * | 1990-04-13 | 1991-12-26 | Toshiba Ceramics Co Ltd | 半導体ウエハの取扱い用治具 |
| JP2979194B2 (ja) * | 1990-05-31 | 1999-11-15 | 京セラ株式会社 | 真空吸着装置 |
| US5280979A (en) * | 1991-06-20 | 1994-01-25 | Recif, S.A. | Tip for a vacuum pipette with improved electrostatic discharge properties |
| JPH08288190A (ja) * | 1995-04-19 | 1996-11-01 | Hitachi Ltd | 物品取扱部材およびその製造方法および収納容器ならびに物品取扱装置 |
| JP2000343476A (ja) * | 1999-06-09 | 2000-12-12 | Nippon Mitsubishi Oil Corp | 搬送用部材 |
| KR100760168B1 (ko) * | 1999-06-09 | 2007-09-20 | 신닛뽄세키유 가부시키가이샤 | 반송용 부재 |
| JP3565765B2 (ja) * | 2000-05-17 | 2004-09-15 | 新日本石油株式会社 | 紫外線耐性を有する繊維強化複合材料製搬送用部材及びその製造方法 |
-
2002
- 2002-12-02 WO PCT/US2002/041653 patent/WO2003049157A1/en not_active Ceased
- 2002-12-02 CN CNB028240294A patent/CN1332419C/zh not_active Expired - Fee Related
- 2002-12-02 ES ES02796108T patent/ES2251626T3/es not_active Expired - Lifetime
- 2002-12-02 DE DE60207105T patent/DE60207105T2/de not_active Expired - Lifetime
- 2002-12-02 CA CA2469475A patent/CA2469475C/en not_active Expired - Fee Related
- 2002-12-02 AT AT02796108T patent/ATE308799T1/de active
- 2002-12-02 EP EP02796108A patent/EP1451854B1/en not_active Expired - Lifetime
- 2002-12-02 JP JP2003550262A patent/JP4383173B2/ja not_active Expired - Fee Related
- 2002-12-02 AU AU2002360823A patent/AU2002360823A1/en not_active Abandoned
- 2002-12-02 TW TW091134929A patent/TWI276194B/zh not_active IP Right Cessation
- 2002-12-02 KR KR1020047008426A patent/KR100887126B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050044642A (ko) | 2005-05-12 |
| CN1599947A (zh) | 2005-03-23 |
| EP1451854B1 (en) | 2005-11-02 |
| TW200303064A (en) | 2003-08-16 |
| ATE308799T1 (de) | 2005-11-15 |
| DE60207105D1 (de) | 2005-12-08 |
| DE60207105T2 (de) | 2006-07-27 |
| CA2469475C (en) | 2012-06-26 |
| ES2251626T3 (es) | 2006-05-01 |
| KR100887126B1 (ko) | 2009-03-04 |
| AU2002360823A1 (en) | 2003-06-17 |
| WO2003049157A1 (en) | 2003-06-12 |
| JP2005512319A (ja) | 2005-04-28 |
| CN1332419C (zh) | 2007-08-15 |
| CA2469475A1 (en) | 2003-06-12 |
| JP4383173B2 (ja) | 2009-12-16 |
| EP1451854A1 (en) | 2004-09-01 |
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Legal Events
| Date | Code | Title | Description |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |