CN1332419C - 具有电导的转移部件及其制造方法 - Google Patents

具有电导的转移部件及其制造方法 Download PDF

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Publication number
CN1332419C
CN1332419C CNB028240294A CN02824029A CN1332419C CN 1332419 C CN1332419 C CN 1332419C CN B028240294 A CNB028240294 A CN B028240294A CN 02824029 A CN02824029 A CN 02824029A CN 1332419 C CN1332419 C CN 1332419C
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CN
China
Prior art keywords
polymer
carbon fiber
transfer
main body
conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028240294A
Other languages
English (en)
Chinese (zh)
Other versions
CN1599947A (zh
Inventor
酒井修司
C·L·米勒
内田大介
小林孝至
青柳健一
山本伸二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Eneos Corp
EIDP Inc
Original Assignee
Ishihara Chemical Co Ltd
Nippon Oil Corp
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Nippon Oil Corp, EI Du Pont de Nemours and Co filed Critical Ishihara Chemical Co Ltd
Publication of CN1599947A publication Critical patent/CN1599947A/zh
Application granted granted Critical
Publication of CN1332419C publication Critical patent/CN1332419C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulding By Coating Moulds (AREA)
  • Liquid Crystal (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Conductive Materials (AREA)
CNB028240294A 2001-12-03 2002-12-02 具有电导的转移部件及其制造方法 Expired - Fee Related CN1332419C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33458701P 2001-12-03 2001-12-03
US60/334,587 2001-12-03

Publications (2)

Publication Number Publication Date
CN1599947A CN1599947A (zh) 2005-03-23
CN1332419C true CN1332419C (zh) 2007-08-15

Family

ID=23307891

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028240294A Expired - Fee Related CN1332419C (zh) 2001-12-03 2002-12-02 具有电导的转移部件及其制造方法

Country Status (11)

Country Link
EP (1) EP1451854B1 (enExample)
JP (1) JP4383173B2 (enExample)
KR (1) KR100887126B1 (enExample)
CN (1) CN1332419C (enExample)
AT (1) ATE308799T1 (enExample)
AU (1) AU2002360823A1 (enExample)
CA (1) CA2469475C (enExample)
DE (1) DE60207105T2 (enExample)
ES (1) ES2251626T3 (enExample)
TW (1) TWI276194B (enExample)
WO (1) WO2003049157A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
DE10357698A1 (de) 2003-12-09 2005-07-14 Schunk Kohlenstofftechnik Gmbh Träger für zu behandelnde Gegenstände sowie Verfahren zur Herstellung eines solchen
JP2006049384A (ja) * 2004-07-30 2006-02-16 Laserfront Technologies Inc ガントリー型ｘｙステージ
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2007201066A (ja) * 2006-01-25 2007-08-09 Murata Mach Ltd 枚葉搬送用トレイ及び枚葉搬送用トレイの保管又は搬送装置
JP4895635B2 (ja) * 2006-02-20 2012-03-14 セイコーインスツル株式会社 搬送装置
US20070221335A1 (en) * 2006-03-23 2007-09-27 Recif Technologies Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device
JP2008034723A (ja) * 2006-07-31 2008-02-14 Shin Etsu Polymer Co Ltd 半導体ウェーハ用接触部品
US20190126495A1 (en) * 2016-04-27 2019-05-02 Kyocera Corporation Sample conveying member
JP7093655B2 (ja) * 2018-03-20 2022-06-30 三菱重工業株式会社 複合材料構造体及び複合材料構造体の製造方法
CN108646395A (zh) * 2018-05-04 2018-10-12 江苏羿骏自动化科技有限公司 一种多工位移动型显微镜检测设备
JP7471743B2 (ja) * 2019-11-20 2024-04-22 株式会社ディスコ 搬送路
JP2022102893A (ja) * 2020-12-25 2022-07-07 京セラ株式会社 試料搬送部材

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207651A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 静電防止型収容治具
JPS63133644A (ja) * 1986-11-26 1988-06-06 Hitachi Electronics Eng Co Ltd ウエハ搬送フオ−ク
JPH03296243A (ja) * 1990-04-13 1991-12-26 Toshiba Ceramics Co Ltd 半導体ウエハの取扱い用治具
JPH0435827A (ja) * 1990-05-31 1992-02-06 Kyocera Corp 真空吸着装置
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
JPH08288190A (ja) * 1995-04-19 1996-11-01 Hitachi Ltd 物品取扱部材およびその製造方法および収納容器ならびに物品取扱装置
JP2000343476A (ja) * 1999-06-09 2000-12-12 Nippon Mitsubishi Oil Corp 搬送用部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100760168B1 (ko) * 1999-06-09 2007-09-20 신닛뽄세키유 가부시키가이샤 반송용 부재
JP3565765B2 (ja) * 2000-05-17 2004-09-15 新日本石油株式会社 紫外線耐性を有する繊維強化複合材料製搬送用部材及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207651A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 静電防止型収容治具
JPS63133644A (ja) * 1986-11-26 1988-06-06 Hitachi Electronics Eng Co Ltd ウエハ搬送フオ−ク
JPH03296243A (ja) * 1990-04-13 1991-12-26 Toshiba Ceramics Co Ltd 半導体ウエハの取扱い用治具
JPH0435827A (ja) * 1990-05-31 1992-02-06 Kyocera Corp 真空吸着装置
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
JPH08288190A (ja) * 1995-04-19 1996-11-01 Hitachi Ltd 物品取扱部材およびその製造方法および収納容器ならびに物品取扱装置
JP2000343476A (ja) * 1999-06-09 2000-12-12 Nippon Mitsubishi Oil Corp 搬送用部材

Also Published As

Publication number Publication date
ATE308799T1 (de) 2005-11-15
KR20050044642A (ko) 2005-05-12
CA2469475A1 (en) 2003-06-12
ES2251626T3 (es) 2006-05-01
CA2469475C (en) 2012-06-26
JP2005512319A (ja) 2005-04-28
CN1599947A (zh) 2005-03-23
AU2002360823A1 (en) 2003-06-17
DE60207105D1 (de) 2005-12-08
TWI276194B (en) 2007-03-11
TW200303064A (en) 2003-08-16
EP1451854A1 (en) 2004-09-01
KR100887126B1 (ko) 2009-03-04
WO2003049157A1 (en) 2003-06-12
JP4383173B2 (ja) 2009-12-16
EP1451854B1 (en) 2005-11-02
DE60207105T2 (de) 2006-07-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: JX NIPPON OIL + ENERGY CORPORATION

Free format text: FORMER OWNER: E.I. DU PONT DE NEMOURS AND CO.

Effective date: 20140530

C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Wilmington, Delaware, USA

Patentee after: E. I. du Pont de Nemours and Co.

Patentee after: JX NIPPON OIL & ENERGY Corp.

Patentee after: ISHIHARA CHEMICAL Co.,Ltd.

Address before: Wilmington, Delaware, USA

Patentee before: E. I. du Pont de Nemours and Co.

Patentee before: NIPPON OIL Corp.

Patentee before: ISHIHARA CHEMICAL Co.,Ltd.

TR01 Transfer of patent right

Effective date of registration: 20140530

Address after: Tokyo, Japan

Patentee after: JX NIPPON OIL & ENERGY Corp.

Patentee after: ISHIHARA CHEMICAL Co.,Ltd.

Address before: Wilmington, Delaware, USA

Patentee before: E. I. du Pont de Nemours and Co.

Patentee before: JX NIPPON OIL & ENERGY Corp.

Patentee before: ISHIHARA CHEMICAL Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070815

Termination date: 20171202

CF01 Termination of patent right due to non-payment of annual fee