DE60207105T2 - Wafer-Transfervorrichtung mit elektrischer Leitfähigkeit und Verfahren zu dessen Herstellung - Google Patents

Wafer-Transfervorrichtung mit elektrischer Leitfähigkeit und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE60207105T2
DE60207105T2 DE60207105T DE60207105T DE60207105T2 DE 60207105 T2 DE60207105 T2 DE 60207105T2 DE 60207105 T DE60207105 T DE 60207105T DE 60207105 T DE60207105 T DE 60207105T DE 60207105 T2 DE60207105 T2 DE 60207105T2
Authority
DE
Germany
Prior art keywords
polymer
electrically conductive
carbon fibers
conductive polymer
transport element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60207105T
Other languages
German (de)
English (en)
Other versions
DE60207105D1 (de
Inventor
Shuji Sakai
L. Chris MILLER
Daisuke Uchida
Takashi Kobayashi
Kenichi Aoyagi
Shinji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Eneos Corp
EIDP Inc
Original Assignee
Ishihara Chemical Co Ltd
Nippon Oil Corp
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Nippon Oil Corp, EI Du Pont de Nemours and Co filed Critical Ishihara Chemical Co Ltd
Publication of DE60207105D1 publication Critical patent/DE60207105D1/de
Application granted granted Critical
Publication of DE60207105T2 publication Critical patent/DE60207105T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Robotics (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Crystal (AREA)
  • Moulding By Coating Moulds (AREA)
  • Conductive Materials (AREA)
DE60207105T 2001-12-03 2002-12-02 Wafer-Transfervorrichtung mit elektrischer Leitfähigkeit und Verfahren zu dessen Herstellung Expired - Lifetime DE60207105T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33458701P 2001-12-03 2001-12-03
US334587P 2001-12-03
PCT/US2002/041653 WO2003049157A1 (en) 2001-12-03 2002-12-02 Transfer member with electric conductivity and its manufacturing method

Publications (2)

Publication Number Publication Date
DE60207105D1 DE60207105D1 (de) 2005-12-08
DE60207105T2 true DE60207105T2 (de) 2006-07-27

Family

ID=23307891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60207105T Expired - Lifetime DE60207105T2 (de) 2001-12-03 2002-12-02 Wafer-Transfervorrichtung mit elektrischer Leitfähigkeit und Verfahren zu dessen Herstellung

Country Status (11)

Country Link
EP (1) EP1451854B1 (enExample)
JP (1) JP4383173B2 (enExample)
KR (1) KR100887126B1 (enExample)
CN (1) CN1332419C (enExample)
AT (1) ATE308799T1 (enExample)
AU (1) AU2002360823A1 (enExample)
CA (1) CA2469475C (enExample)
DE (1) DE60207105T2 (enExample)
ES (1) ES2251626T3 (enExample)
TW (1) TWI276194B (enExample)
WO (1) WO2003049157A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
DE10357698A1 (de) * 2003-12-09 2005-07-14 Schunk Kohlenstofftechnik Gmbh Träger für zu behandelnde Gegenstände sowie Verfahren zur Herstellung eines solchen
JP2006049384A (ja) * 2004-07-30 2006-02-16 Laserfront Technologies Inc ガントリー型ｘｙステージ
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2007201066A (ja) * 2006-01-25 2007-08-09 Murata Mach Ltd 枚葉搬送用トレイ及び枚葉搬送用トレイの保管又は搬送装置
JP4895635B2 (ja) * 2006-02-20 2012-03-14 セイコーインスツル株式会社 搬送装置
US20070221335A1 (en) * 2006-03-23 2007-09-27 Recif Technologies Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device
JP2008034723A (ja) * 2006-07-31 2008-02-14 Shin Etsu Polymer Co Ltd 半導体ウェーハ用接触部品
WO2017188377A1 (ja) * 2016-04-27 2017-11-02 京セラ株式会社 試料搬送部材
JP7093655B2 (ja) * 2018-03-20 2022-06-30 三菱重工業株式会社 複合材料構造体及び複合材料構造体の製造方法
CN108646395A (zh) * 2018-05-04 2018-10-12 江苏羿骏自动化科技有限公司 一种多工位移动型显微镜检测设备
JP7471743B2 (ja) * 2019-11-20 2024-04-22 株式会社ディスコ 搬送路
JP2022102893A (ja) * 2020-12-25 2022-07-07 京セラ株式会社 試料搬送部材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207651A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 静電防止型収容治具
JPS63133644A (ja) * 1986-11-26 1988-06-06 Hitachi Electronics Eng Co Ltd ウエハ搬送フオ−ク
JPH03296243A (ja) * 1990-04-13 1991-12-26 Toshiba Ceramics Co Ltd 半導体ウエハの取扱い用治具
JP2979194B2 (ja) * 1990-05-31 1999-11-15 京セラ株式会社 真空吸着装置
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
JPH08288190A (ja) * 1995-04-19 1996-11-01 Hitachi Ltd 物品取扱部材およびその製造方法および収納容器ならびに物品取扱装置
JP2000343476A (ja) * 1999-06-09 2000-12-12 Nippon Mitsubishi Oil Corp 搬送用部材
KR100760168B1 (ko) * 1999-06-09 2007-09-20 신닛뽄세키유 가부시키가이샤 반송용 부재
JP3565765B2 (ja) * 2000-05-17 2004-09-15 新日本石油株式会社 紫外線耐性を有する繊維強化複合材料製搬送用部材及びその製造方法

Also Published As

Publication number Publication date
KR20050044642A (ko) 2005-05-12
CN1599947A (zh) 2005-03-23
EP1451854B1 (en) 2005-11-02
TW200303064A (en) 2003-08-16
ATE308799T1 (de) 2005-11-15
DE60207105D1 (de) 2005-12-08
CA2469475C (en) 2012-06-26
TWI276194B (en) 2007-03-11
ES2251626T3 (es) 2006-05-01
KR100887126B1 (ko) 2009-03-04
AU2002360823A1 (en) 2003-06-17
WO2003049157A1 (en) 2003-06-12
JP2005512319A (ja) 2005-04-28
CN1332419C (zh) 2007-08-15
CA2469475A1 (en) 2003-06-12
JP4383173B2 (ja) 2009-12-16
EP1451854A1 (en) 2004-09-01

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