TWI274867B - Printed circuit board inspection apparatus - Google Patents

Printed circuit board inspection apparatus Download PDF

Info

Publication number
TWI274867B
TWI274867B TW094109949A TW94109949A TWI274867B TW I274867 B TWI274867 B TW I274867B TW 094109949 A TW094109949 A TW 094109949A TW 94109949 A TW94109949 A TW 94109949A TW I274867 B TWI274867 B TW I274867B
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
format
display
area
Prior art date
Application number
TW094109949A
Other languages
English (en)
Chinese (zh)
Other versions
TW200535412A (en
Inventor
Tsuyoshi Kimura
Osamu Takada
Katsuyuki Suzuki
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Publication of TW200535412A publication Critical patent/TW200535412A/zh
Application granted granted Critical
Publication of TWI274867B publication Critical patent/TWI274867B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW094109949A 2004-03-31 2005-03-30 Printed circuit board inspection apparatus TWI274867B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004103597A JP3895334B2 (ja) 2004-03-31 2004-03-31 プリント基板検査装置

Publications (2)

Publication Number Publication Date
TW200535412A TW200535412A (en) 2005-11-01
TWI274867B true TWI274867B (en) 2007-03-01

Family

ID=35324872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109949A TWI274867B (en) 2004-03-31 2005-03-30 Printed circuit board inspection apparatus

Country Status (4)

Country Link
JP (1) JP3895334B2 (ja)
KR (1) KR100644023B1 (ja)
CN (1) CN100552439C (ja)
TW (1) TWI274867B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4103921B2 (ja) * 2006-08-11 2008-06-18 オムロン株式会社 フィレット検査のための検査基準データの設定方法、およびこの方法を用いた基板外観検査装置
CN101477063B (zh) * 2009-01-22 2011-02-16 北京星河泰视特科技有限公司 印刷电路板的检测方法及光学检测仪
JP5182122B2 (ja) * 2009-01-27 2013-04-10 オムロン株式会社 部品実装基板の品質管理用の情報表示システムおよび情報表示方法
JP2011061047A (ja) * 2009-09-11 2011-03-24 Hitachi High-Technologies Corp 欠陥レビュー支援装置，欠陥レビュー装置および検査支援装置
TWI582629B (zh) * 2016-08-19 2017-05-11 和碩聯合科技股份有限公司 干涉檢查方法及其檢測裝置
KR102024562B1 (ko) * 2017-09-06 2019-09-24 정성욱 Vcm 방식의 렌즈 액츄에이터와 htcc 기판의 솔더링 상태 자동 검사 시스템
JP7281942B2 (ja) * 2019-03-29 2023-05-26 Juki株式会社 検査装置及び検査方法
CN113670949A (zh) * 2021-08-27 2021-11-19 惠州市特创电子科技股份有限公司 一种大型电路板步进检查机的分区检查方法
CN114155367B (zh) * 2022-02-09 2022-05-13 北京阿丘科技有限公司 印制电路板缺陷检测方法、装置、设备及存储介质

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3189308B2 (ja) * 1991-07-16 2001-07-16 オムロン株式会社 はんだ付検査結果の表示方法およびその装置，はんだ付不良の修正方法，ならびにはんだ付検査装置

Also Published As

Publication number Publication date
KR20060045037A (ko) 2006-05-16
JP3895334B2 (ja) 2007-03-22
JP2005291761A (ja) 2005-10-20
CN100552439C (zh) 2009-10-21
CN1677096A (zh) 2005-10-05
KR100644023B1 (ko) 2006-11-10
TW200535412A (en) 2005-11-01

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MM4A Annulment or lapse of patent due to non-payment of fees