TWI272877B - Ring mechanism, and plasma processing device using the ring mechanism - Google Patents

Ring mechanism, and plasma processing device using the ring mechanism Download PDF

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Publication number
TWI272877B
TWI272877B TW091135997A TW91135997A TWI272877B TW I272877 B TWI272877 B TW I272877B TW 091135997 A TW091135997 A TW 091135997A TW 91135997 A TW91135997 A TW 91135997A TW I272877 B TWI272877 B TW I272877B
Authority
TW
Taiwan
Prior art keywords
ring
plasma
wafer
processing chamber
frequency power
Prior art date
Application number
TW091135997A
Other languages
English (en)
Chinese (zh)
Other versions
TW200302035A (en
Inventor
Akira Koshiishi
Mitsuru Hashimoto
Hideaki Tanaka
Shigeru Tahara
Kunihiko Hinata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority claimed from JP2002058833A external-priority patent/JP2003257935A/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200302035A publication Critical patent/TW200302035A/zh
Application granted granted Critical
Publication of TWI272877B publication Critical patent/TWI272877B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW091135997A 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism TWI272877B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001379375 2001-12-13
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
JP2002058833A JP2003257935A (ja) 2002-03-05 2002-03-05 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW200302035A TW200302035A (en) 2003-07-16
TWI272877B true TWI272877B (en) 2007-02-01

Family

ID=27347947

Family Applications (2)

Application Number Title Priority Date Filing Date
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism

Country Status (4)

Country Link
US (1) US7882800B2 (https=)
AU (1) AU2002366921A1 (https=)
TW (2) TWI272877B (https=)
WO (1) WO2003054947A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240395508A1 (en) * 2023-05-25 2024-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Plasma processing apparatus and method

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US12444580B2 (en) * 2023-05-25 2025-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. Plasma processing apparatus and method

Also Published As

Publication number Publication date
TW200626020A (en) 2006-07-16
US20050005859A1 (en) 2005-01-13
US7882800B2 (en) 2011-02-08
TW200302035A (en) 2003-07-16
WO2003054947A1 (fr) 2003-07-03
AU2002366921A1 (en) 2003-07-09
TWI301730B (https=) 2008-10-01

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