TWI266153B - Lithographic projection apparatus and lithographic manufacturing method - Google Patents

Lithographic projection apparatus and lithographic manufacturing method

Info

Publication number
TWI266153B
TWI266153B TW93121911A TW93121911A TWI266153B TW I266153 B TWI266153 B TW I266153B TW 93121911 A TW93121911 A TW 93121911A TW 93121911 A TW93121911 A TW 93121911A TW I266153 B TWI266153 B TW I266153B
Authority
TW
Taiwan
Prior art keywords
patterning device
lithographic
substrate
projection apparatus
radiation
Prior art date
Application number
TW93121911A
Other languages
English (en)
Other versions
TW200515105A (en
Inventor
De Ven Bastiaan Lambertus Van
Gert-Jan Heerens
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP03077308A external-priority patent/EP1500980A1/en
Priority claimed from US10/740,822 external-priority patent/US7084961B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200515105A publication Critical patent/TW200515105A/zh
Application granted granted Critical
Publication of TWI266153B publication Critical patent/TWI266153B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741Handling masks outside exposure position, e.g. reticle libraries
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70783Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW93121911A 2003-07-22 2004-07-22 Lithographic projection apparatus and lithographic manufacturing method TWI266153B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03077308A EP1500980A1 (en) 2003-07-22 2003-07-22 Lithographic apparatus, device manufacturing method, and device manufactured thereby
US10/740,822 US7084961B2 (en) 2003-12-22 2003-12-22 Safety mechanism for a lithographic patterning device

Publications (2)

Publication Number Publication Date
TW200515105A TW200515105A (en) 2005-05-01
TWI266153B true TWI266153B (en) 2006-11-11

Family

ID=34276734

Family Applications (2)

Application Number Title Priority Date Filing Date
TW93120547A TWI245170B (en) 2003-07-22 2004-07-09 Lithographic apparatus, device manufacturing method, and device manufactured thereby
TW93121911A TWI266153B (en) 2003-07-22 2004-07-22 Lithographic projection apparatus and lithographic manufacturing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW93120547A TWI245170B (en) 2003-07-22 2004-07-09 Lithographic apparatus, device manufacturing method, and device manufactured thereby

Country Status (6)

Country Link
EP (2) EP1500985B1 (zh)
JP (5) JP4116598B2 (zh)
KR (2) KR100748445B1 (zh)
CN (2) CN1577108B (zh)
SG (2) SG109002A1 (zh)
TW (2) TWI245170B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675260B (zh) * 2011-06-20 2019-10-21 日商尼康股份有限公司 多葉片夾持裝置及裝置製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755742B2 (en) * 2005-10-11 2010-07-13 Asml Netherlands B.V. Lithographic apparatus with mounted sensor
KR101312862B1 (ko) * 2006-01-19 2013-09-30 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
JPWO2008007521A1 (ja) * 2006-07-11 2009-12-10 株式会社ニコン レチクル保持部材、レチクル・ステージ、露光装置、投影露光方法およびデバイス製造方法
US7869003B2 (en) 2006-07-12 2011-01-11 Asml Holding Nv Lithographic apparatus and device manufacturing method with reticle gripper
US8760187B2 (en) * 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
WO2018019626A1 (en) * 2016-07-29 2018-02-01 Asml Holding N.V. A membrane assembly and particle trap
DE102017200636A1 (de) 2017-01-17 2018-07-19 Carl Zeiss Smt Gmbh Optische Anordnung, insbesondere Lithographiesystem, mit einer Transportsicherung
CN109856917A (zh) * 2017-11-30 2019-06-07 上海微电子装备(集团)股份有限公司 安全装置、工件台及光刻机
CN108362771A (zh) * 2018-02-13 2018-08-03 京东方科技集团股份有限公司 一种损伤监测装置及系统
WO2020099126A1 (en) * 2018-11-16 2020-05-22 Asml Holding N.V. Multiple-pad reticle bumpers to distribute impact load
WO2020126813A2 (en) * 2018-12-21 2020-06-25 Asml Holding N.V. Direct drive reticle safety latch
WO2020225151A1 (en) * 2019-05-09 2020-11-12 Asml Holding N.V. Bumper apparatus
WO2021160423A1 (en) * 2020-02-14 2021-08-19 Asml Holding N.V. Reticle gripper damper and isolation system for lithographic apparatuses

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JPS6012550A (ja) 1983-07-04 1985-01-22 Nippon Kogaku Kk <Nikon> 露光転写装置用マスク供給装置
US4820930A (en) 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
US4760429A (en) * 1986-11-05 1988-07-26 The Perkin-Elmer Corporation High speed reticle change system
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
JPH03273663A (ja) * 1990-03-23 1991-12-04 Canon Inc 基板保持装置
US5296891A (en) 1990-05-02 1994-03-22 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Illumination device
JP2699629B2 (ja) * 1990-09-07 1998-01-19 ヤマハ株式会社 楽音信号生成装置
US5253012A (en) 1990-10-05 1993-10-12 Canon Kabushiki Kaisha Substrate holding apparatus for vertically holding a substrate in an exposure apparatus
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
US5608773A (en) 1993-11-30 1997-03-04 Canon Kabushiki Kaisha Mask holding device, and an exposure apparatus and a device manufacturing method using the device
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
IL119213A (en) * 1996-09-06 2000-08-31 Orbot Instr Ltd Universal chuck for holding plates of various sizes
US6172738B1 (en) * 1996-09-24 2001-01-09 Canon Kabushiki Kaisha Scanning exposure apparatus and device manufacturing method using the same
JP4072212B2 (ja) * 1996-11-19 2008-04-09 キヤノン株式会社 走査露光装置
JPH10116780A (ja) * 1996-10-14 1998-05-06 Nikon Corp 縦型基板保持装置
DE69735016T2 (de) 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
AU2048097A (en) 1997-01-29 1998-08-18 Micronic Laser Systems Ab Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate
SE509062C2 (sv) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster
DE69829614T2 (de) 1997-03-10 2006-03-09 Asml Netherlands B.V. Lithographiegerät mit einer positioniervorrichtung mit zwei objekthaltern
JP3928232B2 (ja) * 1997-12-24 2007-06-13 ウシオ電機株式会社 露光装置におけるマスク保持装置
US6211945B1 (en) * 1998-05-19 2001-04-03 Orc Technologies, Inc. Apparatus and method for exposing substrates
DE60032568T2 (de) * 1999-12-01 2007-10-04 Asml Netherlands B.V. Positionierungsapparat und damit versehener lithographischer Apparat
JP2001203145A (ja) 2000-01-20 2001-07-27 Nikon Corp 露光装置
US6717159B2 (en) * 2000-10-18 2004-04-06 Nikon Corporation Low distortion kinematic reticle support
KR100597035B1 (ko) * 2001-03-01 2006-07-04 에이에스엠엘 네델란즈 비.브이. 마스크핸들링방법, 마스크, 그를 위한 그리퍼를 포함하는기구 또는 장치, 디바이스 제조방법 및 그 디바이스
EP1237045B1 (en) 2001-03-01 2007-05-02 ASML Netherlands B.V. Method of taking over a lithographic mask
JP2003203847A (ja) 2002-01-08 2003-07-18 Canon Inc 露光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675260B (zh) * 2011-06-20 2019-10-21 日商尼康股份有限公司 多葉片夾持裝置及裝置製造方法

Also Published As

Publication number Publication date
SG108972A1 (en) 2005-02-28
JP2008022034A (ja) 2008-01-31
JP2005045254A (ja) 2005-02-17
JP4468980B2 (ja) 2010-05-26
KR100748445B1 (ko) 2007-08-10
TW200510964A (en) 2005-03-16
KR100614955B1 (ko) 2006-08-25
EP1517185A1 (en) 2005-03-23
JP2005045253A (ja) 2005-02-17
CN1289969C (zh) 2006-12-13
KR20050011702A (ko) 2005-01-29
TW200515105A (en) 2005-05-01
CN1577108B (zh) 2010-10-06
KR20050011713A (ko) 2005-01-29
EP1500985A3 (en) 2009-05-06
SG109002A1 (en) 2005-02-28
JP4797036B2 (ja) 2011-10-19
EP1500985B1 (en) 2014-02-26
CN1577108A (zh) 2005-02-09
JP2008205479A (ja) 2008-09-04
JP4116598B2 (ja) 2008-07-09
JP4112533B2 (ja) 2008-07-02
EP1500985A2 (en) 2005-01-26
CN1577094A (zh) 2005-02-09
JP2008053741A (ja) 2008-03-06
TWI245170B (en) 2005-12-11

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