TWI263666B - Adhesive resin composition and the use thereof - Google Patents

Adhesive resin composition and the use thereof

Info

Publication number
TWI263666B
TWI263666B TW092102301A TW92102301A TWI263666B TW I263666 B TWI263666 B TW I263666B TW 092102301 A TW092102301 A TW 092102301A TW 92102301 A TW92102301 A TW 92102301A TW I263666 B TWI263666 B TW I263666B
Authority
TW
Taiwan
Prior art keywords
adhesive
adherend
film
laminate
resin composition
Prior art date
Application number
TW092102301A
Other languages
English (en)
Other versions
TW200401019A (en
Inventor
Mahito Fujita
Toshiyuki Hasegawa
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200401019A publication Critical patent/TW200401019A/zh
Application granted granted Critical
Publication of TWI263666B publication Critical patent/TWI263666B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
TW092102301A 2002-02-07 2003-01-30 Adhesive resin composition and the use thereof TWI263666B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002030739 2002-02-07

Publications (2)

Publication Number Publication Date
TW200401019A TW200401019A (en) 2004-01-16
TWI263666B true TWI263666B (en) 2006-10-11

Family

ID=27677911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092102301A TWI263666B (en) 2002-02-07 2003-01-30 Adhesive resin composition and the use thereof

Country Status (5)

Country Link
KR (1) KR20040088052A (zh)
CN (1) CN1290958C (zh)
AU (1) AU2003208099A1 (zh)
TW (1) TWI263666B (zh)
WO (1) WO2003066771A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422601B (zh) * 2007-11-29 2014-01-11 Sumitomo Chemical Co Thermosetting resin composition
JP6068236B2 (ja) * 2013-04-02 2017-01-25 富士フイルム株式会社 積層フィルム、太陽電池モジュール用バックシート及び太陽電池モジュール
CN103627336A (zh) * 2013-05-14 2014-03-12 苏州邦立达新材料有限公司 一种压敏胶带及其制备方法
CN104497905A (zh) * 2014-12-11 2015-04-08 安徽明讯新材料科技股份有限公司 一种低粘性保护膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614574A (en) * 1979-07-16 1981-02-12 Hitachi Chem Co Ltd Self-adhesive or adhesive tape
JPS6414235A (en) * 1987-07-08 1989-01-18 Showa Denko Kk Crosslinked ethylenic copolymer mixture
JPH0543855A (ja) * 1991-08-13 1993-02-23 Nippon Synthetic Chem Ind Co Ltd:The 剥離性粘着剤組成物
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JP2898480B2 (ja) * 1992-09-14 1999-06-02 日東電工株式会社 加熱剥離性接着剤及び粘着部材
JPH07133472A (ja) * 1993-11-11 1995-05-23 Sekisui Chem Co Ltd 粘着剤組成物
JPH107719A (ja) * 1996-06-28 1998-01-13 Mitsui Petrochem Ind Ltd オレフィン・極性モノマー共重合体からなる改質剤
JP2002069422A (ja) * 2000-08-30 2002-03-08 Toyo Chem Co Ltd 熱発泡型粘着剤及びその粘着部材
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2002146326A (ja) * 2000-11-02 2002-05-22 Three M Innovative Properties Co 接着シート
JP2002249744A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 光硬化型粘接着剤組成物、粘接着剤及び粘接着剤の剥離方法

Also Published As

Publication number Publication date
CN1290958C (zh) 2006-12-20
AU2003208099A1 (en) 2003-09-02
CN1628163A (zh) 2005-06-15
TW200401019A (en) 2004-01-16
KR20040088052A (ko) 2004-10-15
WO2003066771A1 (fr) 2003-08-14

Similar Documents

Publication Publication Date Title
TW200704736A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
EP1201422A3 (en) Laminate with a peelable top layer and method of peeling off the top layer from the laminate
HK1058943A1 (en) Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive tape
TW200611951A (en) Cohesive tape for dicing/die bonding
WO2005005161A3 (en) Multilayer film
MY123407A (en) Double-faced pressure-sensitive adhesive sheet and pressure-sensitive adhesive member
CA2012670A1 (en) Multilayer film and laminate for use in producing printed circuit boards
MX2008012616A (es) Laminados adhesivos sensibles a la presion (psa).
WO2009079182A3 (en) High temperature composite tape and method for manufacturing the same
EP1966341A4 (en) ADHESIVE ARTICLE, COMPOSITE ARTICLE AND METHODS OF MANUFACTURING THESE ARTICLES
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
TW200639580A (en) Pellicles having low adhesive residue
MY113123A (en) A polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine
EP0336431A3 (en) Pressure-sensitive adhesive material
JP2016526088A (ja) 熱活性化可能な接着剤を用いた接着方法
TWI263666B (en) Adhesive resin composition and the use thereof
MY141886A (en) Adhesive sheet for tire and method of manufacturing the same
NO20060488L (no) Dekorativ selvklebende laminert plate
US20060088715A1 (en) Method for gluing fpcb's
TW200740947A (en) Multilayer film, laminated body using the multilayer film and laminated body manufacturing method
EP1146101A4 (en) COPPER SHEET COATED WITH ADHESIVE, LAMINATE COPPER PLATE AND PRINTED CIRCUIT BOARD HAVING THE SAME
KR101717418B1 (ko) 점착 시트 및 이를 이용한 유기전자장치의 봉지 방법
CN104039908A (zh) 光学用透明粘合片的制造方法、光学用透明粘合片及使用它的显示装置
US10081162B2 (en) Adhesive bonding process
US20060121272A1 (en) Thermo-activated adhesive material for fpcb agglutinations

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees