AU2003208099A1 - Adhesive resin composition and use thereof - Google Patents

Adhesive resin composition and use thereof

Info

Publication number
AU2003208099A1
AU2003208099A1 AU2003208099A AU2003208099A AU2003208099A1 AU 2003208099 A1 AU2003208099 A1 AU 2003208099A1 AU 2003208099 A AU2003208099 A AU 2003208099A AU 2003208099 A AU2003208099 A AU 2003208099A AU 2003208099 A1 AU2003208099 A1 AU 2003208099A1
Authority
AU
Australia
Prior art keywords
resin composition
adhesive resin
adhesive
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003208099A
Inventor
Mahito Fujita
Toshiyuki Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of AU2003208099A1 publication Critical patent/AU2003208099A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
AU2003208099A 2002-02-07 2003-02-03 Adhesive resin composition and use thereof Abandoned AU2003208099A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002030739 2002-02-07
JP2002/30739 2002-02-07
PCT/JP2003/001044 WO2003066771A1 (en) 2002-02-07 2003-02-03 Adhesive resin composition and use thereof

Publications (1)

Publication Number Publication Date
AU2003208099A1 true AU2003208099A1 (en) 2003-09-02

Family

ID=27677911

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003208099A Abandoned AU2003208099A1 (en) 2002-02-07 2003-02-03 Adhesive resin composition and use thereof

Country Status (5)

Country Link
KR (1) KR20040088052A (en)
CN (1) CN1290958C (en)
AU (1) AU2003208099A1 (en)
TW (1) TWI263666B (en)
WO (1) WO2003066771A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422601B (en) * 2007-11-29 2014-01-11 Sumitomo Chemical Co Thermosetting resin composition
JP6068236B2 (en) * 2013-04-02 2017-01-25 富士フイルム株式会社 Laminated film, back sheet for solar cell module, and solar cell module
CN103627336A (en) * 2013-05-14 2014-03-12 苏州邦立达新材料有限公司 Pressure sensitive adhesive tape and preparation method thereof
CN104497905A (en) * 2014-12-11 2015-04-08 安徽明讯新材料科技股份有限公司 Low-viscosity protective film and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614574A (en) * 1979-07-16 1981-02-12 Hitachi Chem Co Ltd Self-adhesive or adhesive tape
JPS6414235A (en) * 1987-07-08 1989-01-18 Showa Denko Kk Crosslinked ethylenic copolymer mixture
JPH0543855A (en) * 1991-08-13 1993-02-23 Nippon Synthetic Chem Ind Co Ltd:The Releasable self-adhesive composition
JP2970963B2 (en) * 1991-08-14 1999-11-02 日東電工株式会社 Peelable pressure-sensitive adhesive and adhesive member thereof
JP2898480B2 (en) * 1992-09-14 1999-06-02 日東電工株式会社 Heat-peelable adhesive and adhesive member
JPH07133472A (en) * 1993-11-11 1995-05-23 Sekisui Chem Co Ltd Adhesive composition
JPH107719A (en) * 1996-06-28 1998-01-13 Mitsui Petrochem Ind Ltd Modifier comprising olefin-polar monomer copolymer
JP2002069422A (en) * 2000-08-30 2002-03-08 Toyo Chem Co Ltd Thermally foamed type pressure sensitive adhesive and its pressure sensitive adhesion member
JP4703833B2 (en) * 2000-10-18 2011-06-15 日東電工株式会社 Energy ray-curable heat-peelable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
JP2002146326A (en) * 2000-11-02 2002-05-22 Three M Innovative Properties Co Adhesive sheet
JP2002249744A (en) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd Photocurable adhesive composition, adhesive and method for peeling the same

Also Published As

Publication number Publication date
KR20040088052A (en) 2004-10-15
TWI263666B (en) 2006-10-11
CN1628163A (en) 2005-06-15
CN1290958C (en) 2006-12-20
TW200401019A (en) 2004-01-16
WO2003066771A1 (en) 2003-08-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase