TWI257745B - Connector and connector groove - Google Patents
Connector and connector groove Download PDFInfo
- Publication number
- TWI257745B TWI257745B TW093136947A TW93136947A TWI257745B TW I257745 B TWI257745 B TW I257745B TW 093136947 A TW093136947 A TW 093136947A TW 93136947 A TW93136947 A TW 93136947A TW I257745 B TWI257745 B TW I257745B
- Authority
- TW
- Taiwan
- Prior art keywords
- connector
- unit
- lead parts
- resin
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
- H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
1257745 A8 B8 C8 D8 第83105588號專利申請案 .(98年12月18日) 六、申請專利範圍 自前述封裝單元(5),將經樹脂包封過電子元件 取出於外部之機構之電子元件之樹脂包封成形裝置, 其特徵在: 對業已具備之前述封裝單元(5),以裝卸自如狀 態裝設另外之封裝單元(5a、5b或5c),而以增減自如 之形態調整封裝單元之數目者。 5.如申請專利範圍第4項之電子元件之樹脂包封成形裝 置,其中,對前述封裝單元(5· 5a· 5b· 5c)供應裝著 有*電子元:件之未經樹脂包封前引線架(14)及樹脂粒 (21)之前述機構係包含:供應裝著有電子元件之多數 未經樹脂包封前引線架(14)之供應單元(1)、 令前述各未經樹脂封前引線架向規定方向整形 排列之引線架整列單元(2)、 樹脂粒(21)供應單元(3)、 令樹脂粒(21)整形排列並將其搬出之樹脂粒搬 出單元(4)、以及, 將整列後之未經樹脂包封前引線架(14)及樹脂 粒(21)移送至前述封裝單元(5· 5a· 5b· 5c)之裝載機 構單元(6);其中, 將已經樹脂包封之電子元件,自前述封裝機構 單元(5· 5a· 5b· 5 c)取出於外部之前述機構包含: 將經樹脂包封過之引線架取出之卸載機構單元 ⑺, 鋼模之清潔機構單元(8)、 經樹脂包封過之引線架之移送單元(9)、 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ297公釐) 32 36984(修正本) (請先朗讀背面之注意事項再填寫本頁) -ti n Bn n t— I— · aBBl ϋ ϋ aiai ~ 經濟部智慧財產局員工消費合作社印製 1257745 A8B8C8D8 第831〇5588號專利申請索 • (98 年 12 月 18 “') *六、申請專利範圍 * 將經樹脂包封過之引線架之注入口除去之注入 口消除單元(10)、 - 將已除去入型口之各經齒脂包封過引線架各別 加以繫著之拾取單元(11)、以及 將已繫著之各個經樹脂包封過引線架各別加以 收容之引線架收容單元(12); 更進一步亦具備有連續且自動控制前述各單元 之各種動作之控制單元(13)者。 6.如申請專利範圍第4項之電子元件之樹脂包封成形裝 置,其中,業已具備之前述封裝單元(5)及前述另外 之封裝單元(5a、5b或5c)係各自應用在將不同種類之 製品之樹脂包封成形用者。 <锖先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 * 297公変) 33 36984 (修正本)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003402296A JP4084291B2 (ja) | 2003-12-01 | 2003-12-01 | コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200531363A TW200531363A (en) | 2005-09-16 |
TWI257745B true TWI257745B (en) | 2006-07-01 |
Family
ID=34463947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093136947A TWI257745B (en) | 2003-12-01 | 2004-11-30 | Connector and connector groove |
Country Status (7)
Country | Link |
---|---|
US (1) | US7001218B2 (zh) |
EP (1) | EP1538711B1 (zh) |
JP (1) | JP4084291B2 (zh) |
KR (1) | KR101092960B1 (zh) |
CN (1) | CN100461538C (zh) |
DE (1) | DE602004029860D1 (zh) |
TW (1) | TWI257745B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2916998Y (zh) * | 2006-06-09 | 2007-06-27 | 富士康(昆山)电脑接插件有限公司 | 电子卡连接器 |
CN109979674A (zh) * | 2019-04-30 | 2019-07-05 | 青岛罗博飞海洋探测装备应用技术研究院有限公司 | 一种水下光电复合缆及其应用 |
CN116157964A (zh) * | 2020-07-29 | 2023-05-23 | 美国卡勒斯玻璃有限责任公司 | 玻璃产品、连接器以及安装连接器的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5116263A (en) | 1988-03-30 | 1992-05-26 | Amp Incorporated | Connector for posted terminals |
JP2860362B2 (ja) * | 1990-03-17 | 1999-02-24 | アムフェノル―トゥヘル、エレクトロニクス、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング | 接触装置、特に加入者識別モジュールの接触装置 |
TW370305U (en) * | 1996-04-09 | 1999-09-11 | Hon Hai Prec Ind Co Ltd | Mold for cartridge connectors |
WO1998028821A1 (en) * | 1996-12-20 | 1998-07-02 | The Whitaker Corporation | Memory card connector and contact retention system therefor and method of assembly thereof |
JP3431554B2 (ja) | 1999-11-09 | 2003-07-28 | 山一電機株式会社 | カードコネクタ |
JP3530460B2 (ja) | 2000-04-27 | 2004-05-24 | 山一電機株式会社 | カードコネクタ |
JP2001313128A (ja) * | 2000-04-27 | 2001-11-09 | Yamaichi Electronics Co Ltd | カードコネクタ |
JP3507787B2 (ja) | 2000-10-19 | 2004-03-15 | 山一電機株式会社 | カードコネクタ |
TW563941U (en) * | 2001-04-30 | 2003-11-21 | Hon Hai Prec Ind Co Ltd | Electronic card connector |
JP4297633B2 (ja) * | 2001-07-12 | 2009-07-15 | アルプス電気株式会社 | カード用コネクタ装置 |
TWM249145U (en) * | 2003-12-02 | 2004-11-01 | Kingconn Technology Co Ltd | Plugging slot structure of storage medium for multiple types of memory cards |
-
2003
- 2003-12-01 JP JP2003402296A patent/JP4084291B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-30 TW TW093136947A patent/TWI257745B/zh not_active IP Right Cessation
- 2004-11-30 KR KR1020040098929A patent/KR101092960B1/ko not_active IP Right Cessation
- 2004-11-30 DE DE602004029860T patent/DE602004029860D1/de active Active
- 2004-11-30 EP EP04028328A patent/EP1538711B1/en not_active Expired - Fee Related
- 2004-12-01 US US11/000,078 patent/US7001218B2/en not_active Expired - Fee Related
- 2004-12-01 CN CNB2004100912691A patent/CN100461538C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101092960B1 (ko) | 2011-12-12 |
CN1624986A (zh) | 2005-06-08 |
EP1538711A3 (en) | 2008-03-26 |
EP1538711A2 (en) | 2005-06-08 |
DE602004029860D1 (de) | 2010-12-16 |
EP1538711B1 (en) | 2010-11-03 |
JP2005166378A (ja) | 2005-06-23 |
TW200531363A (en) | 2005-09-16 |
CN100461538C (zh) | 2009-02-11 |
KR20050053005A (ko) | 2005-06-07 |
JP4084291B2 (ja) | 2008-04-30 |
US7001218B2 (en) | 2006-02-21 |
US20050142921A1 (en) | 2005-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |