201030498 六、發明說明： 【發明所屬之技術領域】 尤指一種用於主機板上方便拆換的 本發明係關於一種組件， 組件。 【先前技術】201030498 VI. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a component, assembly for convenient replacement of a motherboard. [Prior Art]
基於大量生產為前提而設計的錢板結構，無論是使用於電 ，、伺服器、工作站、或是其他系統\次系統設備，多是以表面黏 著技術(Surface Mount Technology，SMT)將所有的元件焊接在主機 板上。經過以SMT製程而裝置於主機板上面的電子元件，卻有著 .曰後難以讓使用者自行更換的問題。隨著資訊產業的蓬勃發展， -些控制晶片推陳出新的週期已經遠低於—般主機板正常 壽命；再加上週邊設備’例如記憶體模_是介面卡，也因應軟 體操作上的要求而需要不_升級，因此，f訊產品的玩家或是 領先使用纽需要經常自行更換域板上_重要元件，因應而 生的更換接座相繼問世。 目别市面上的可更換型元件’例如cpu或是控制器，其更換 方式並不_於設備機殼⑽有限空間與操作環境^了^間的 限制，而難崎行較複雜的操作步驟之外，使时於更換主機板 的元件時，更有者谷易將身上的靜電釋放到脆弱的電子元件 而k成7L件毀損、難以施力、以及受到視覺或操作環境所限而 難以將元件精確地放準位置等等困難。 盥j疋之故’發明人鑑於習知技術之設計缺失，乃經悉心試驗 ，、研究’並—本鎮而不捨之精神，發明出本案「用於主機板上方 201030498 便拆換的組件」，以下為本案之簡要說明。 【發明内容】 者# 目r在於提供—種透過載體結構的設計，而讓使用 置之後’报容易的將該載體放回正確的位 態》此外，紐_構具钱蓋細所 =:避免使用者於主機板上面更換該=== 裝置時，於#作過程之中不_接觸而 ::機r操作概減少-者誤傷及主機=電:元 有-第-心 位於對應於該載體之一預定位置；以及 ^匕3凹槽， 係設置於該座體上，對應於哕。，該第二部位 相互吸引。對應於对部位’並與該第-部位磁輕合 較佳地’本發明提出之組件，其中 其係配合該凹槽使該載體置入該預定位置_更包含一置入結構， 較佳地，本發.出之組件，其中該 .無接腳封㈣態之㈣電路元件。 料具有_ 較佳地，本發明提出之組件，其㈣裁體更具有-裝卸機構， 201030498 用以裝卸該電子元件。 較佳地，本㈣灿德件，其巾該龜更 =由該絲連齡料她，使辦技姐喊 構，mm其中該載_含-熱傳導機 較佳地’本發明提出之組件，其中 -記憶體模組。 ％付件為—介面卡或 較佳地’本發明提出之組件，其中該載體更 :經由該舰連結敎，使該電子元件透贼傳輸電路電而路運 較佳地’树贿^組件，射該麵 PCIe、PCI-X 或 DIMM 插槽。 5地，本發明提出之組件，其中該第—部位與該第二部位 至少其中之一包含一磁鐵。 ❿ 較佳地，本發明提出之组件，其中該_更具有— 用以遮蓋該功能裝置。 較佳地’本伽提出之組件，射該第二部錄於該凹槽之 内。 如前述本發明之方便拆換的裝置或組件，得藉由下列實施例 及圖示說明，俾得本領域具—般知識者更深人之了解其實施方式 與優點： 【實施方式】 201030498 本發明之技術手段將詳細說明如下’相信本發明之目的、特 .徵與特點，當可由此得一深入且具體之了解，然而下列實施例與 圖示僅提供參考與說明用，並非用來對本發明加以限制。 、 首先請參閱第一圖，其係為本發明之用於主機板上方便拆換 的組件之一實施例的結構示意圖，該組件丨位於主機板1〇〇之上， 包含一電子元件11，一載體12，以及一座體10，其中該座體1〇 包含-凹槽14。該電子元件n通常是—具有薄型無接腳封裝型態 j ' PGA、LGA、DFN等等）之積體電路元件，例如cpu二 是其他的控制晶片。該載體12另具有—裝卸機構17，用以装卸該 電子元件11。其功能相當於門蓋或是扣件的裝卸機構口將電子元 ，件11固定於載體12之内，如第一圖所示。配置於載體12底部的 -傳輸 18 ’可連接魏座體1G ’並使該電子元件u底部的 接觸端點(未顯示)透過該傳輸電路18經由該賴1〇錢一步以 本領域f知的介面連制域板的電路系統，讓電子元件u 正常運作。 ❿㈣續參閱第—圖，在座體10上面設計為該載體12的預定 社有一凹槽14,而載體12預定置入凹槽14的部位具有一置 16 ’其尺寸與該哺14相配合，使 12可以很容易的 ^置於該預定位置。#承載著電子猶u的載體η裝置於凹 ’載體12底部傳輸電路18的針狀電子信號傳接頭就各 同的」凹槽14裡面的接觸端點(未顯示）；相反的，為了達到相 點，、本實翻亦可在傳輸電路18的底部配置平的接觸端 體u…凹槽14裡面配置針狀電子錢傳接頭。哺14引導載 、置，使各個針狀電子信號傳接頭對準其相對應的接觸端 7 201030498 為了讓载體12安穩的座落在凹槽14上面，使得上述的各個 針狀電子信號傳接頭與其相對應的接觸端點保持有效 觸’該載體12具有至少-個第一部位13，另外在座體上 ，對應於該第一部位13處，則設置一第二部位15。第一部位η與 第二部位15以磁耦合相互吸引，也就是說，該第一部二13與該 第二部位15至少其中之-包含一磁鐵。如第一圖所示，該第^ 罄位15通常配置於凹槽Η之内，但是也可以搭配载體12的結構設 計而配置於其他位置。 請參閱第二圖，其係為本伽之鎌主機板上方便拆換的植 件之另一實施例的結構示意圖，該組件2位於主機板2〇之上，包 含-電子元件21，一載體22，以及-座體20，其中該座體2〇 = 含至少-凹槽24。該電子元件21通常是一具有薄型無接腳封裝型 態（QFN、PGA、LGA、DFN等等）之積體電路元件，例如cpu 或是其他的控制晶片。該載體22另具有一熱傳導機構29,例如散 ❿熱片(heat smk)或散熱管(heat pipe) ’用以提供該電子元件21之熱 傳導。如第二圖所示，通常電子元件21的頂部貼在載體22下方、 使電子元件21運作時所產生的熱可經由熱傳導機構29而被帶出。 請繼續參閱第二圖，在座體2〇上面設計為該載體22的預定 位置上至少設有一凹槽24，而載體22預定置入凹槽24的相對部 位則有一置入結構26 ,其尺寸與該凹槽24相配合，使裁體22可 以很容易的被放置於該預定位置。圖面雖然以兩組凹槽24對應兩 組置入結構26為例，然而本領域具一般知識者可以據以推知其他 數目的置入結構26與凹槽24的配置方式。當裝載著電子元件21 8 201030498 示凹』5置於凹槽24之上，電子元件21底部的接觸端點(未顯 接觸IHJi#獅所配置的魏個針狀電子健傳接頭28作導電 24引導載體22的位置，使各個針狀電子信號傳接= 子广號值垃目情的接觸端點。凹槽24裡面所配置的複數個針狀電The money board structure designed on the premise of mass production, whether it is used in electricity, servers, workstations, or other systems/sub-system equipment, mostly using Surface Mount Technology (SMT) Solder on the motherboard. After the electronic components mounted on the motherboard by the SMT process, there is a problem that it is difficult for the user to replace it afterwards. With the booming of the information industry, the new cycle of controlling the chip has been much lower than the normal life of the motherboard; plus peripheral devices such as memory modals are interface cards, which are also required in response to software operation requirements. Not _ upgrade, therefore, the players of the f-products or the leading use of the New Zealand need to frequently replace the _ important components on the domain board, and the replacement sockets that have been born in succession have come out one after another. Look at the replaceable components on the market, such as cpu or controller, the replacement method is not limited to the limited space between the equipment casing (10) and the operating environment, and the difficult operation steps are difficult. In addition, when replacing the components of the motherboard, it is more likely that the static electricity of the body is released to the fragile electronic components, and the 7L pieces are damaged, difficult to apply, and limited by the visual or operating environment. It is difficult to accurately position the position and so on. In the absence of the design of the prior art, the inventor has carefully tested and researched the spirit of the town and invented the "components for the 201030498 above the motherboard". The following is a brief description of the case. SUMMARY OF THE INVENTION The object is to provide a design through the structure of the carrier, and to make it easy to return the carrier to the correct position after use. In addition, the New Zealand structure has a fine cover =: avoid When the user replaces the === device on the motherboard, it does not contact during the process of the #::: the operation of the machine r is reduced - the accidental injury and the host = electricity: the element has - the first - the heart is located corresponding to the carrier One of the predetermined positions; and the ^3 groove, is disposed on the seat body, corresponding to the 哕. The second part is attracted to each other. Corresponding to the assembly of the portion 'and the magnetically coupled with the first portion', preferably the assembly of the present invention, wherein the groove is engaged with the groove to place the carrier in the predetermined position - further comprising an insertion structure, preferably The components of the present invention, which are the circuit components of the four-state (four) state. Preferably, the assembly of the present invention has a (4) cut-off body having a loading and unloading mechanism, and 201030498 is for loading and unloading the electronic component. Preferably, the (four) Chande piece, the towel of the turtle is more than the silk age, let the technical sister shout, mm, the load-containing heat transfer machine preferably 'the component proposed by the present invention, Among them - memory module. % is a component card or preferably a component proposed by the present invention, wherein the carrier is further connected to the electronic component through the ship, so that the electronic component is better connected to the thief transmission circuit. Shoot the PCIe, PCI-X, or DIMM slot on the side. 5, the assembly of the present invention, wherein at least one of the first portion and the second portion comprises a magnet. Preferably, the assembly of the present invention, wherein the _ more has - is used to cover the functional device. Preferably, the assembly of the present invention is recorded in the recess. The apparatus and components of the present invention are described in the following embodiments and illustrations, and those skilled in the art have a better understanding of the embodiments and advantages thereof. [Embodiment] 201030498 The technical means will be described in detail below. 'I believe that the purpose, features and characteristics of the present invention are obtained from the detailed and specific understanding. However, the following embodiments and illustrations are only provided for reference and explanation, and are not intended to be used for the present invention. Limit it. First, please refer to the first figure, which is a structural schematic diagram of an embodiment of the present invention for easy replacement of a motherboard, the component 丨 being located on the motherboard 1 ,, comprising an electronic component 11 A carrier 12, and a body 10, wherein the body 1 includes a groove 14. The electronic component n is typically an integrated circuit component having a thin pinless package type j 'PGA, LGA, DFN, etc., for example, cpu 2 is another control chip. The carrier 12 further has a loading and unloading mechanism 17 for attaching and detaching the electronic component 11. The function is equivalent to the door cover or the loading and unloading mechanism port of the fastener, and the electronic component 11 is fixed in the carrier 12 as shown in the first figure. The transmission 18' disposed at the bottom of the carrier 12 can be connected to the socket body 1G' and the contact end (not shown) at the bottom of the electronic component u is transmitted through the transmission circuit 18 via the The interface is connected to the circuitry of the domain board to allow the electronic component u to function properly.四 (4) Continuing to refer to the first figure, a predetermined structure of the carrier 12 is provided with a recess 14 on the seat body 10, and the portion of the carrier 12 intended to be placed in the recess 14 has a portion 16' which is sized to cooperate with the feed 14 12 can be easily placed in the predetermined position. The carrier η carrying the electrons u is placed at the contact end point (not shown) in the groove 14 of the recessed carrier 12 at the bottom of the transmission circuit 18; otherwise, in order to achieve the phase The point, the real turn can also be arranged at the bottom of the transmission circuit 18 with a flat contact end body u... the groove 14 is provided with a needle-shaped electronic money transfer joint. Feeding 14 guides, positioning, so that each needle-shaped electronic signal transmission connector is aligned with its corresponding contact end 7 201030498 In order to allow the carrier 12 to sit securely on the groove 14, the above-mentioned various needle-shaped electronic signal transmission joints The contact end point corresponding thereto remains in contact with the carrier 12 having at least one first portion 13, and on the seat body, corresponding to the first portion 13, a second portion 15 is provided. The first portion η and the second portion 15 are attracted to each other by magnetic coupling, that is, the first portion 23 and the second portion 15 contain at least one magnet. As shown in the first figure, the first position 15 is usually disposed in the groove ,, but may be disposed at other positions in conjunction with the structural design of the carrier 12. Please refer to the second figure, which is a structural schematic diagram of another embodiment of the planting piece which is conveniently replaced on the motherboard of the gantry. The component 2 is located on the motherboard 2 ,, and includes an electronic component 21 and a carrier. 22, and - the seat body 20, wherein the seat body 2 〇 = at least - the groove 24 is included. The electronic component 21 is typically an integrated circuit component having a thin strapless package type (QFN, PGA, LGA, DFN, etc.), such as a cpu or other control chip. The carrier 22 further has a heat transfer mechanism 29, such as a heat smk or heat pipe, for providing heat transfer of the electronic component 21. As shown in the second figure, generally, the heat generated by the top of the electronic component 21 under the carrier 22 and the operation of the electronic component 21 can be carried out via the heat conduction mechanism 29. Referring to the second figure, at least a recess 24 is formed on the seat body 2 at a predetermined position of the carrier 22, and the opposite portion of the carrier 22 intended to be inserted into the recess 24 has an insertion structure 26 of a size and The recesses 24 cooperate to allow the cutting body 22 to be easily placed in the predetermined position. Although the two sets of grooves 24 correspond to the two sets of implant structures 26, those of ordinary skill in the art can infer the arrangement of other numbers of the insert structures 26 and the grooves 24. When the electronic component 21 8 201030498 is placed on the recess 24, the contact end of the bottom of the electronic component 21 (the contact pin 28 of the IHJi# lion is not in contact with the electroacoustic connector 28 of the IHJi# lion. The position of the carrier 22 is guided so that the respective acicular electronic signals are transmitted = the contact end point of the sub-wide value. The plurality of acicular electrodes disposed in the recess 24
相同的’為了讓載體22安穩的座落在凹槽Μ上面，使上 :=^個針狀電子魏傳麵28與其相對朗__保持有效 的導電接觸’該載體22具有至少一個第-部位23，另外在座體 2〇上方相對應於該第一部位23處，則設置一第二部位25。各組 第-部位23與第二部位25⑽麵合相互則，也就是說，該第 -部位23與該第二部位25至少其中之—包含—磁鐵。如第二困 所不’該第二部位25通常配置於凹槽24之内，但是也可以搭配 載體22的結構設計而配置於其他位置。 請參閱第三圖’其係為本發明之用於主機板上方便拆換的組 件之又一實施例的結構示意圖’該組件3位於主機板3〇〇之上， 包含一功能裝置3卜-載體32 ’以及-座體30，其中該座體3〇 包含至少—凹槽34。該功能裝置31為一介面卡或一記憶體模組。 該載體32另具有一金屬外殼39，提供使用者握取，並用以遮蓋該 功能裝置，避免使用者誤碰觸該功能裝置31内的電子元件而造^ 損壞。該金屬外殼39另具備導引靜電與屏蔽電磁輻射的功用^搭 配該功能裝置31的接腳型態，例如第三圖中所顯示的金手指或其 他類型的接腳，該載體32具有一插槽37。插槽37的規格 包含PCI、PCIe、PCI-X、DIMM或其他本領域所習知的規 201030498 格。配置於載體32底部的一傳輸電路38，可經由該座體3〇連 :接於該主機板300,並使該功能裝置31透過該載體32而進一步以 本領域習知的介面連接到主機板300的電路系統，讓功能裝置31 正常運作。 在座體30上面設計為該載體32的預定位置上至少設有一 凹槽34，而載體32預定置入凹槽34的相對部位則有一置入結構 .36，其尺寸與該凹槽34相配合，使載體32可以很容易的被放置 ❹於該職位置。圖面雖触兩組凹槽34對應兩組置人結構％為 例，然而本領域具一般知識者可以據以推知其他數目的置入結構 36與凹槽34的配置方式。當承載著功能震置31城體32裝^於 凹槽34之上時，載體32底部傳輸電路38的針狀電子信號傳接頭 就分別接觸到座體30上方的接觸端點(未顯示）；相反的，為了達 ，到相同的效果’本實施例亦可在傳輸電路38的底部配置為平的接 觸端點，而於座體30上方的相辦位配置針狀電子信號傳接頭。 凹槽34引導載體32的位置，使各個針狀電子信號傳接頭對準其 參 相對應的接觸端點。 為了讓载體32安穩的座落在座體3〇上方的預定位置，使得 上述的傳輸電路38與其相對應的接觸端點保持有效的導電接觸， 該載體32具有至少-個第一部位33，另外在座體3〇上方相對應 於該第一部位33處，則設置一第二部位35。各組第一部位％ ^ 第二部位35以磁耦合相互吸引，也就是說，該第一部位汩與^ 第一β卩位35至少其中之一包含一磁鐵。如第三囷所示，該第二部 位35通常配置於凹槽34之内，但是也可以搭配載體32的結構設 計而配置於其他位置。 201030498 雖然本發明已以數個較佳實施例揭露如上，然 =本發明，任域習此技藝者，在减離本翻之精神和範圍内: 許之更動與潤飾，因此本發明之保護範圍當視後附之申 *月專利範圍所界定者為準。 【圖式簡單說明】 上方便拆換的組件之-實施例的結 •=:意:發明之驗機板上方便拆換的組件之™ .發㈣於主機板上方便拆換的組件之又-實施例的 【主要元件符號說明】 1、2、3組件 10、20、30 座體 • ll·、21電子元件 12'22、32 載體 13、 23、33第一部位 14、 24、34 凹槽 Μ、25、35第二部位 16'26、36置入結構 17震卸機構 18、38傳輸電路 28電子信號傳接頭 :29熱傳導機構 31功能裝置 201030498 • 37插槽 39金屬外殼 100、200、300 主機板The same 'in order for the carrier 22 to sit securely on the groove ,, the upper:=^ acicular electron-transmitting surface 28 maintains an effective conductive contact with its relative __the carrier 22 has at least one first-part 23, in addition to the first portion 23 above the base 2, a second portion 25 is provided. Each of the first portion 23 and the second portion 25 (10) face each other, that is, the first portion 23 and the second portion 25 include at least a magnet. The second portion 25 is generally disposed within the recess 24, but may be disposed at other locations along with the structural design of the carrier 22. Please refer to the third figure, which is a structural schematic diagram of another embodiment of the present invention for the easy replacement of the main board. The assembly 3 is located on the motherboard 3A and includes a functional device 3b. The carrier 32' and the base 30, wherein the base 3 includes at least a recess 34. The function device 31 is an interface card or a memory module. The carrier 32 further has a metal casing 39 for the user to grip and cover the functional device to prevent the user from accidentally touching the electronic components in the functional device 31 to cause damage. The metal casing 39 is further provided with a function of guiding static electricity and shielding electromagnetic radiation, and a pin type of the functional device 31, such as a gold finger or other type of pin shown in the third figure, the carrier 32 has a plug. Slot 37. The specifications for slot 37 include PCI, PCIe, PCI-X, DIMM, or other specifications known in the art as 201030498. A transmission circuit 38 disposed at the bottom of the carrier 32 can be connected to the motherboard through the base 3, and the functional device 31 is further connected to the motherboard through the carrier 32. The circuit system of 300 allows the functional device 31 to operate normally. At least a recess 34 is formed on the seat body 30 at a predetermined position of the carrier 32, and the opposite portion of the carrier 32 intended to be inserted into the recess 34 has an insertion structure 36 which is sized to cooperate with the recess 34. The carrier 32 can be easily placed in the position. Although the drawing touches the two sets of grooves 34 corresponding to the two sets of the structure of the human body, the person skilled in the art can infer the arrangement of the other number of the inserted structures 36 and the grooves 34. When the function housing 31 is mounted on the recess 34, the pin-shaped electronic signal transmission connectors of the bottom transmission circuit 38 of the carrier 32 respectively contact the contact terminals (not shown) above the base 30; Conversely, in order to achieve the same effect, the present embodiment can also be configured as a flat contact end at the bottom of the transmission circuit 38, and a needle-shaped electronic signal transmission connector is disposed at the opposite position above the base 30. The recess 34 guides the position of the carrier 32 such that the individual acicular electrical signal contacts are aligned with their corresponding contact terminals. In order to allow the carrier 32 to be seated securely at a predetermined position above the base 3, such that the transmission circuit 38 maintains an effective conductive contact with its corresponding contact end, the carrier 32 has at least a first portion 33, in addition A second portion 35 is disposed at a position corresponding to the first portion 33 above the seat body 3''. The first portion of each group % ^ the second portion 35 is attracted to each other by magnetic coupling, that is, at least one of the first portion 汩 and the first β 卩 position 35 includes a magnet. As shown in the third row, the second portion 35 is usually disposed within the recess 34, but may be disposed at other locations in conjunction with the design of the carrier 32. 201030498 Although the present invention has been disclosed above in several preferred embodiments, the present invention is intended to be within the spirit and scope of the present invention. It shall be subject to the definition of the scope of the patent application attached to the application. [Simple diagram of the diagram] The components that are easy to be replaced - the knot of the embodiment ==: Meaning: TM of the component that is easy to be replaced on the inspection board of the invention. (4) The component that is easily replaced on the motherboard - Description of main components and symbols of the embodiment 1. 1, 2, 3 components 10, 20, 30 Seat body • ll·, 21 electronic component 12'22, 32 Carrier 13, 23, 33 first part 14, 24, 34 concave The second portion 16'26, 36 of the groove, 25, 35 is placed into the structure 17 the shock absorbing mechanism 18, 38 the transmission circuit 28 electronic signal transmission joint: 29 heat conduction mechanism 31 function device 201030498 • 37 slot 39 metal shell 100, 200, 300 motherboard