TW411593B - Plastic carrier mold with magnetic inserting article - Google Patents

Plastic carrier mold with magnetic inserting article Download PDF

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Publication number
TW411593B
TW411593B TW088110401A TW88110401A TW411593B TW 411593 B TW411593 B TW 411593B TW 088110401 A TW088110401 A TW 088110401A TW 88110401 A TW88110401 A TW 88110401A TW 411593 B TW411593 B TW 411593B
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TW
Taiwan
Prior art keywords
mold
magnetic
magnetic insert
patent application
item
Prior art date
Application number
TW088110401A
Other languages
Chinese (zh)
Inventor
De-Jung Jang
Chuan-De Huang
Pei-Hua Tsau
Original Assignee
Vanguard Int Semiconduct Corp
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Priority to TW088110401A priority Critical patent/TW411593B/en
Application granted granted Critical
Publication of TW411593B publication Critical patent/TW411593B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

A plastic carrier mold with a magnetic inserting article is provided in semiconductor package process for manufacturing a pre-mold plastic chip carrier. The magnetic inserting mold includes: an upper mold, a magnetic inserting article and a bottom mold. A leading pin and a wafer seat are located on the upper surface of the bottom mold. A bonding area is formed between the upper mold and the leading pin, and between the upper mold and the wafer seat. The magnetic inserting article is positioned on the bonding area located on the wafer seat, and the inner ring of the bonding area is located on the leading pin. The magnetic inserting article can be a permanent magnet or electromagnet. The size of the magnetic inserting article depends on the actual requirement.

Description

經濟部智慧財產局員工消f合作社印製 A7 _______B7___ 五、發明說明() 發明頜迠: 本發明係關於半導體封裝中之塑膠載具先模(Pre- mo ldPlasticCh ipCarrier) 之鑄模 (molding cavity) , 特別是關於在鑄模中具有避免溢膠在鑄模接腳區域形成 的堪性被:入物之鑄模(Magnetic Inserting Molding Cavity) - 發明昔景: 應用薄膜積體電路製程技術在矽或砷化鎵等晶片上 製成的i C元件尺寸極為微小脆弱,因此必須運用一套適 當的方法將它們”包裝,,起來,以防止外力或環境因素導致 的破壞;同時IC元件也必須與其它必須之元件組合以成 為一具備特定功能的產品,電子構裝(Electr〇nic Packaging) ’也稱為電子封裝,即是一門將uc晶片加以 黏結固定並密封保護之,並且與其它必須的元件組合成為 一項電子成品的科學技術。 其中塑膠構裝為一具有低成本、薄型化、製程較為簡 單、適合自動化生產等優點,它的應用範圍很廣,從一般 的消費性電子產品到精密的超高速電腦中隨處可見也是 目前為電子工業使用最多的構裝方法。塑膠構裝雖然較陶 瓷構裝簡單,但其構裝之完成與許多製程與材料之因素, 如構裝配置與1C晶片尺寸、導體與鈍態保護層材料之選 ___ 第2頁 本紙張尺度適用中國國家標準(CNS)A4規格⑽x 297公笼1 ------------ _______________^ _____ (請先閱讀背面之注意事項再填寫本頁) i訂---------^ 411593 A7 B7 ___ 五、發明說明() (諝先閱讀背面之注意事項再填寫本頁) 擇、晶片的黏結方法鑄模樹脂材料、引腳架的設計、鎮模 成型製程條件(溫度、壓力、時間、烘烤硬化條件)等均 有所關聯。而塑膠構裝的製程可以利用轉移铸模 (Transfer Molding)、軸向喷灑塗膠(Radial-spray Coating )與反應射出成型(Reaction-injectionEmployees of the Intellectual Property Bureau of the Ministry of Economic Affairs printed A7 _______B7___ V. Description of the invention () Inventive jaw: This invention relates to a molding cavity for a plastic mold in a semiconductor package (Pre-mold PlasticCh ipCarrier). In particular, in the mold, it is possible to prevent the formation of glue overflow in the mold pin area: Magnetic Inserting Molding Cavity-Invention of the past: Application of thin film integrated circuit process technology in silicon or gallium arsenide, etc. The IC components made on the chip are extremely small and fragile. Therefore, they must be "packaged" by a suitable method to prevent damage caused by external forces or environmental factors. At the same time, the IC components must be combined with other necessary components. In order to become a product with specific functions, Electron Packaging (also known as electronic packaging) is a method of bonding and fixing the uc chip and sealing it, and combining it with other necessary components to form an electronic device. Science and technology of the finished product. Among them, the plastic structure is a low-cost, thin, simple process. It is suitable for automated production and other advantages. It has a wide range of applications. It can be seen everywhere from general consumer electronics products to sophisticated ultra-high-speed computers. It is also the most commonly used construction method for the electronics industry. Simple, but the completion of its structure and many process and material factors, such as the configuration of the configuration and the size of the 1C chip, the choice of conductor and passive protective layer material ___ page 2 This paper applies Chinese National Standard (CNS) A4 Specifications ⑽ x 297 male cage 1 ------------ _______________ ^ _____ (Please read the precautions on the back before filling out this page) i Order --------- ^ 411593 A7 B7 ___ V. Description of the invention () (谞 Please read the precautions on the back before filling in this page) Selection, wafer bonding method, mold resin material, lead frame design, and town molding process conditions (temperature, pressure, time, baking hardening) Conditions), etc. are all related. And the process of plastic packaging can use Transfer Molding, Radial-spray Coating and Reaction-injection

Mo 1 d i n tg ; RIΜ )等方法製成,雖然製程有別,但原料的準 備與特性之需求有共通之處。如第la、第lb圊所示為塑 膠構裝元件;第la圖為雙列式塑膠構裝的平面截面圈, 包含:1C晶片10、晶片座(DiePad) 11、玲模塑膠材料 1 2、打線接合1 3,以及引腳1 4 ;第1 b圖則為一塑踢晶片 載具(PLCC)。 經濟部智慧財產局員工消費合作社印5农 而轉移鑄棋是塑膠構裝最常見的密封製程技術,其設 備與方法如第2圖所示。已完成晶片黏結及打線接合的a 晶片與引腳架置於一可加熱的鑄孔(Cavity)21十,再由 镇模機的擠製桿(Ram) 22將軟化之鎮模材料壓入镑妹 (Pot) 23’經輸送道(Runner)傳送至元件結構所在的 鑄孔後’進行約175°C、卜3分鐘的熱處理使鑄模材料產生 硬化成型反應。構裝元件自鑄模中退出後,一般必須再施 予4-6小時' 175aC的熱處理使鑄模完全硬化。 鑄模機中模具的設計將影響成品的良率與可靠度;模 具可區分為上、下兩部分’如第3圖所示為一塑膠載具先 模之鑄模’分為上模31、下模32 ;上模31 —般為固定, 由下模32往上合模;鎮模的方法是,上下合模之後注入 膠質’加熱硬化之後再開模,形成塑膠載具先模,如第4 第3頁 本紙張尺度適用4*國國家標準(CNS)A4規格(210 X 297公笼) 411593 A7 -B7 五、發明說明() 圖所示’塑膠載具先模包含:鑄模塑膠材料4卜引腳42, 以及晶片座43’其中引腳42係1C晶片用以和外界連結的 接腳。然而’在合模的製程中由於注入膠質具有一定的液 壓’封膠Cencapsulant filling)合模的過程中容易在 接合區域(Bonding area) 44處產生溢膠,而覆蓋在引腳 42的表面上,造成1C與外界接觸不良。因此,一般會在 封膠合模之後再利用化學、電性,或者(和)機械刮除這 些在引腳42表面上的溢膠;但是這些增加的步驟同時也 會對傷及1C或其與外界的連結,並降低生產的產量 (throughput)’ 以及產品的良率(pr〇duct yield )。 因此’如何減少引腳42或1C晶片座43上的淤移情 形*以簡化生產步驟(如:省略化學、電性或機械到除的 步驟)進而增加產量與良率’乃是1C生產中一個重要的 步驟。有鑑於上述習知技術的困難,本發明提出一個在引 腳42,以及(或)在1C座上加強合模作用力,使得溢朦 不易在其上形成的方法’將在下文中之目的、以及詳細說 明中,對於本發明的優點、特點,以及發明内容等,配合 相關圖示說明之。 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 發明目的及概述: 本發明之目的為,提供一磁性嵌入物之鑄模e即在缚 模座(molddie)、1C座槽(chase),或模具陰模(cavity bar )的製程中,於上模31 (如第3圖所示)中加入磁性 第4頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 * 297公蜚) 經濟部智慧財產局員工消費合作社印製 411593 a7 _B7_ 五、發明說明() 彼入物,如第5圖磁性嵌入物51所示。由於一般的引腳 42為鎮合金,可藉由加入之磁性物質增加上模31與晶片 座4 3,以及上模3 1和引腳4 2之間的接合力,因此當膠質 注入時不會由於膠質的衝力、或液壓造成引腳42和上模 31產生一微小的缝隙,而使得膠質在其上形成溢膠;因此 可以避免結合區域4 4的溢膠。 本發明的另一目的為,提供一種半導體封裝中之塑膠 載具先模鑄模的方法:本鑄模方法係利用在填充膠質之 前,於上模3 1内結合區域4 4上加裝磁性物質,以增皆結 合區域44的接合力,並減少淤膠的形成。 有關本發明之發明内容、較佳實施例,以及其優點 將以下配合圖示、圖號,詳細說明之。 圖忒簡單說明: 第la圖為雙列式塑膠構裝(P-D IP)的平面載面圖。 第lb圖為塑膠晶片載具(PLCC )。 第2圖為轉移鑄模塑膠構裝機的構造圖。 第3圖為塑膠載具先模之鑄模的側視圖。 第4圖為利用第3圖之鑄模所製成之塑膠載具先模的側視 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公芨) I* tj* n i n I n n I ^ * i I I n n 一6JI ϋ J I n K 1 ί I (請先閱讀背面之汰意事項再填寫本頁) A7Mo 1 d i n tg; RIM) and other methods. Although the manufacturing process is different, the preparation of raw materials and the requirements of characteristics have similarities. As shown in Figures la and lb 圊, plastic components are shown. Figure la is a double-row plastic structured planar cross-section ring, which includes: 1C chip 10, DiePad 11, and Lingmo plastic material 1 2. Wire bonding 13 and pins 1 4; Figure 1b shows a plastic kick chip carrier (PLCC). Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperatives, and 5 farmers, and the transfer of cast chess is the most common sealed process technology for plastic construction. Its equipment and methods are shown in Figure 2. The wafer bonding and wire bonding have been completed. The a chip and the lead frame are placed in a heatable casting hole (Cavity) 21, and then the softened mold material is pressed into the pound by the extrusion rod (Ram) 22 of the mold press. Sister (Pot) 23 'is transferred to the casting hole where the component structure is located via a runner', and then heat-treated at about 175 ° C for 3 minutes to produce a hardening reaction for the mold material. After the component is withdrawn from the mold, it is generally necessary to apply a heat treatment of 175aC for 4-6 hours to completely harden the mold. The design of the mold in the casting machine will affect the yield and reliability of the finished product; the mold can be divided into upper and lower parts 'as shown in Figure 3, the mold of a plastic carrier first mold' is divided into upper mold 31 and lower mold 32; upper mold 31 is generally fixed, and the mold is closed from the lower mold 32; the method of town mold is to inject gelatin after the upper and lower molds are closed, and then open the mold to form a plastic carrier first mold, as in the 4th and the 3rd. The paper size of this page is applicable to 4 * National Standard (CNS) A4 specifications (210 X 297 male cage) 411593 A7 -B7 V. Description of the invention () The first mold of the plastic carrier shown in the figure includes: plastic material of the mold 4 pins 42, and the chip holder 43 ', in which the pin 42 is a pin of the 1C chip for connection with the outside world. However, in the process of “clamping due to the injection of glue into the mold, there is a certain amount of hydraulic pressure”. During the sealing process of Cencapsulant filling, it is easy to produce overflow at the bonding area 44 and cover the surface of the pin 42. Cause 1C poor contact with the outside world. Therefore, chemical, electrical, or (and) mechanical scraping of the glue on the surface of pin 42 is generally used after sealing the mold; however, these additional steps will also hurt 1C or its external environment. And reduce the throughput 'and the yield of the product. Therefore, 'how to reduce the silting on the lead 42 or 1C chip holder 43 * to simplify the production steps (such as omitting the steps of chemical, electrical or mechanical removal) to increase the yield and yield is one of the 1C production Important steps. In view of the difficulties of the above-mentioned conventional techniques, the present invention proposes a method for strengthening the clamping force on the pin 42, and / or on the 1C seat, so that the haze cannot be easily formed thereon. The purpose will be hereinafter, and In the detailed description, the advantages, features, and content of the present invention will be described in conjunction with the related drawings. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Purpose and Summary of the Invention: The purpose of the present invention is to provide a mold for magnetic inserts, namely the molddie. In the manufacturing process of 1C chase or cavity bar, add magnetism to the upper mold 31 (as shown in Fig. 3). Page 4 This paper applies the Chinese National Standard (CNS) A4 specification. (210 * 297 gong) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 411593 a7 _B7_ V. Description of the invention () The other object is shown in Figure 5 as the magnetic insert 51. Since the common pin 42 is a ballast alloy, the bonding force between the upper mold 31 and the wafer holder 4 3, and the upper mold 3 1 and the pin 4 2 can be increased by the added magnetic substance, so it will not be affected when the gel is injected. Because the pin 42 and the upper mold 31 generate a tiny gap due to colloidal impulse or hydraulic pressure, the colloid will form overflow glue thereon; therefore, overflow of glue in the bonding area 44 can be avoided. Another object of the present invention is to provide a method for first molding a plastic carrier in a semiconductor package. The method for molding uses a magnetic substance to be added to the bonding area 4 4 in the upper mold 31 before filling the rubber, so that Increasing the bonding force of the bonding regions 44 and reducing the formation of silt. Regarding the invention content, preferred embodiments, and advantages of the present invention, it will be described in detail with reference to the figures and figures below. Figure 忒 Brief description: Figure la is a plan view of a double-row plastic structure (P-D IP). Figure lb shows a plastic chip carrier (PLCC). Fig. 2 is a structural diagram of a transfer mold plastic construction machine. Fig. 3 is a side view of a casting mold of a plastic carrier. Figure 4 is a side view of a plastic carrier pre-mold made using the mold of Figure 3. Page 5 This paper is sized for China National Standard (CNS) A4 (210 x 297 cm) I * tj * nin I nn I ^ * i II nn 一 6JI ϋ JI n K 1 ί I (Please read the notice on the back before filling this page) A7

411593 經濟部智慧財產局員工消费合作社印製 圖。 第5圖以發明之塑膠載具先模之铸模上模的側視圈。 第6囿為本發明之塑膠載具先模之鑄棋上模的下梘圖。 第7圖為本發明之塑膠載具先模之鑄模上下合模的側視 圖。 第8圖為本發明之具有嵌入磁性物鑄棋所製造之應用於 CMOS影像感測器的塑膠載具之構造圖。 圖號.對照說明: 10 1C晶片 11 晶片座 12 鑄模塑膠材料 13 打線接合 14 引腳 21 鑄孔 22 擠製桿 23 鑄缽 31 上模 32 下模 41 鑄模塑膠材料 42 引腳 43 晶片座 44 接合區域 45 突出部位 51 磁性敌入物 52 凹槽 81 C0MS影像感測1C晶片 82 透光窗口 83 連接線 第6頁 本紙張尺度適用t國國家標準(CNS)A4規格(210 X 297公藿) A7 B7 411593 五、發明說明( 84 結合劑 發明钵細說明i 為了方便說明,幫助瞭解本發明之内容,以及其特 點,在下文之詳細說明中,相同之元件或作用性質相同 者,並使用相同之標號。 如第la圏所示,為一般塑膠構裝的平面截面圖,ic 晶片透過塑膠構裝可以避免外力的破壞。為了滿足IC製 成的自動化,一般會先製成IC塑膠載具先模,如第4圖 所示,此塑膠載具先模包含,鑄模塑膠材料41、引腳42, 以及晶片座4 3 ’其中引腳4 2係I C晶片用以和外界連結的 接腳。1C自動化生產的過程中,ic晶片精確的放置在晶 片座43上’接著在1C與引腳42之間打線連結,完成IC 與外界連結的工作。 本發明之磁性嵌入物鑄模,如第5至第7困所示, 即是用來製造塑膝載具先模(如第4圊所示)。在上、 下模進行合模之前’先於上模内位於接合區域44(第4 圊所示)置入磁性嵌入物51(如第5、第6,以及第7 圖所示)’其中此磁性嵌入物51係為一般的磁性物質, 或由電磁所產生之電磁鐵材料,且其大小可以視需要做 任意的組合;合模之後並注入膠質’形成塑膠載具先模。 由於加入之磁性喪入物51和鎮合金之引腳42之間有較 強之作用力,故當注入膠質時,引腳42和上模31之間 第7頁 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) I I n n I ^ n ϋ (請先閱讀背面之沒意事項再填寫本頁} 經濟部智慧財產局員工消費合作社印製411593 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Fig. 5 is a side view circle of the upper mold of the first mold of the invented plastic carrier. Fig. 6 is a bottom view of the upper mold of the chess piece of the plastic mold of the present invention. Fig. 7 is a side view of the upper and lower molds of the mold of the first mold of the plastic carrier of the present invention. FIG. 8 is a structural diagram of a plastic carrier applied to a CMOS image sensor manufactured by the present invention with embedded magnetic objects. Fig. Comparative description: 10 1C wafer 11 Wafer holder 12 Mold plastic material 13 Wire bonding 14 Pin 21 Cast hole 22 Extruded rod 23 Casting bowl 31 Upper mold 32 Lower mold 41 Mold plastic material 42 Pin 43 Wafer 44 Bonding Area 45 Protruding part 51 Magnetic enemy entry 52 Groove 81 C0MS image sensing 1C chip 82 Light transmitting window 83 Connecting line Page 6 This paper is applicable to the national standard (CNS) A4 specification (210 X 297 cm) A7 B7 411593 V. Description of the invention (84 Detailed description of the binder invention bowl i In order to facilitate the explanation and help to understand the content of the invention and its characteristics, in the detailed description below, the same elements or the same nature of action, and use the same As shown in Figure la 圏, it is a plane cross-sectional view of a general plastic structure. The IC chip can avoid the damage of external forces through the plastic structure. In order to meet the automation of IC manufacturing, IC plastic carriers are usually made first. As shown in FIG. 4, the plastic carrier first mold includes: a mold plastic material 41, a pin 42, and a chip holder 4 3 ', wherein the pin 4 2 is an IC chip used to connect with the outside world. In the 1C automated production process, the IC chip is accurately placed on the wafer holder 43 ', and then a wire connection is made between the 1C and the pin 42 to complete the connection between the IC and the outside. The magnetic insert mold of the present invention, as 5 to 7 are shown, that is, used to make the first mold of the plastic knee carrier (as shown in Figure 4). Before the upper and lower molds are closed, they are located in the joint area 44 (the 4th in the upper mold). (Shown in 圊) Insert a magnetic insert 51 (as shown in Figures 5, 6, and 7) 'wherein this magnetic insert 51 is a general magnetic substance, or an electromagnet material generated by electromagnetic, and The size can be any combination as needed; after the mold is closed, a gelatin is injected to form a plastic carrier first mold. Because of the strong force between the magnetic funnel 51 and the pin 42 of the town alloy, it should be When injecting colloid, page 7 between pin 42 and upper mold 31. The paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) II nn I ^ n 请 (Please read the unintentional on the back first) Fill out this page again for matters} Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

— I—-^DJ· ϋ I ^ I n I I I I - ! i i I ^ I I I n n 1 I I I E f ._' ] I. I 411593 五、發明說明() 的缝隙更為微小,因此可以降低膠質在接合區域44的淤 膠情形。本發明之磁性嵌入物之鑄模,其結搆(參考第7 圖)至少包含:上模31、磁性嵌入物51,以及下模32; 其中可視需要而加入引腳42’和(或)晶片座43。 其中第5至第7圖為本發明之較佳實施例;此磁性 嵌入物鑄模之上模31’如第5圖所示具有磁性嵌入物51 和一凹槽52;此凹槽52在注入膠質硬化之後形成一突 出部位45 ;此突出部位45係用於外部連结(inter-connect )打線用或當成支撐架用(參考第8圖之應用)。 由此上模31之上視圖(如第6圖所示),磁性嵌入物之 中心部位對應至晶片座4 3的上方,而外圈則對應至引線 4 2的内圈部分。然而’嵌入之磁性物大小、位置可是需 要做變化,第5至第7圖的形狀、大小並非用以限定本 發明之範圍。 第8圊為利用本發明之具有磁性嵌入物鑄模所製成 之塑膠載具,此塑膠載具可應用於CMOS之影像感測器 (CMOS Image Sensor)上。®中標號41至45即是利用 本發明之磁性嵌入物鑄模所製成之塑膠載具,其中並包 含:一 C0MS影像感測1C晶片8卜透光窗口( transparent window) 82、連接線(inter-connect) 83’ 以及結合劑 (adhesive) 84。 以上所述僅為本發明之較佳實施例而已’並非用以 限定本發明之申請專利範圍;凡其它未脫離本發明所揭 示之精神下所完成之等效改變或修飾,均應包含在下述 第8頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公蹵) (請先閱讀背面之注意事項再填寫本頁) -------訂i n i lap I ·Ι _ 經濟部智慧財產局員工消費合作社印製 411593 A7 ____B7 五、發明說明() 之申請專利範圍内a (請先閲讀背面之注意事項再填寫本頁) !!訂---------f 經濟部智慧財產局員工消費合作杜印製 頁 9第 本纸張尺度適用中國國家標準(CNS)A4規格<210 X 297公釐)— I —- ^ DJ · ϋ I ^ I n IIII-! Ii I ^ III nn 1 IIIE f ._ '] I. I 411593 V. The description of the invention () The gap is even smaller, so it can reduce the glue in the joint area 44's sizing situation. The mold of the magnetic insert of the present invention has a structure (refer to FIG. 7) including at least: an upper mold 31, a magnetic insert 51, and a lower mold 32; wherein pins 42 ′ and / or a wafer holder 43 may be added as required. . 5 to 7 are preferred embodiments of the present invention; the upper mold 31 ′ of the magnetic insert mold has a magnetic insert 51 and a groove 52 as shown in FIG. 5; After curing, a protruding portion 45 is formed; this protruding portion 45 is used for inter-connect wiring or as a support frame (refer to the application of FIG. 8). From the upper view of the upper mold 31 (as shown in FIG. 6), the center portion of the magnetic insert corresponds to the upper part of the wafer holder 43, and the outer ring corresponds to the inner ring portion of the lead 42. However, the size and position of the embedded magnetic objects need to be changed, and the shapes and sizes of Figs. 5 to 7 are not used to limit the scope of the present invention. The eighth item is a plastic carrier made by using the magnetic insert mold of the present invention. This plastic carrier can be applied to a CMOS image sensor. The numbers 41 to 45 in ® are plastic carriers made of the magnetic insert mold of the present invention, which include: a COMS image sensor 1C chip 8 transparent window 82, a connection line (inter -connect 83 'and adhesive 84. The above are merely preferred embodiments of the present invention and are not intended to limit the scope of patent application for the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention shall be included in the following Page 8 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 cm) (Please read the precautions on the back before filling this page) ------- Order ini lap I · I _ Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives 411593 A7 ____B7 5. Within the scope of patent application for invention description (a) (Please read the precautions on the back before filling this page) !! Order --------- f Consumers' cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed on page 9 This paper size applies to China National Standard (CNS) A4 specifications < 210 X 297 mm)

Claims (1)

411593 il C8 ____D8六、申請專利範圍 申請專利範圍 h —種具有磁性嵌入物鑄模,係用於半導體封裝中之塑膠 載具先模的製程,該磁性嵌入物之鑄模至少包含: 一上模; 磁性嵌入物位於該上模之内部;以及 一下模位於該磁性嵌入物和該上模之下,其大小並對 應該上模。 2 ’如申請專利範圍第1項之磁性嵌入物鑄模,其令該下 更包含引腳於該下模之上表面周圍,該引腳係為錦合金 3·如申請專利範圍第1項之磁性嵌入物鑄模,其中該下 更包含晶片座於該下模之上表的中心部位,該晶片座用 承接該晶片。 模 模 以 4·如申請專利範圍第I項之磁性嵌入物鑄模,更包含接人 區域位於該上棋與該引腳之間,以及位於該上棋與該s 座之間。 BEI 片 請 先 Η 讀 背 面. 之 項 再 頁 裝 訂 線 經濟部中央樣率局貝工消費合作社印装 5.如申請專利範圍第1項之磁性嵌入物鑄模,复 ’、τ琢堵 银入物為一永久磁鐵,該磁性嵌入物分成兩部分,分别 於該晶片座之上方之接合區域,以及該引腳上方接入 之内圏。 磁性 ik 區域 第ίο頁 本纸張尺度逡用中國國家#準(CNS ) A4洗格(210X297公釐) 經濟部中夬橾隼局員工消費合作杜印製 A8 411593 ?s D8___ __ 六、申請專利範圍 6·如申凊專利圍第5項之磁性欲入物鸽模,其中該磁性 嵌入物為一電磁鐵。 7. —種具有磁性嵌入物鑄模’係用於半導體封裝中之塑膠 載具先模的製程’該磁性嵌入物之鋒模至少包含_· 一上模; 磁性嵌入物位於該上模之内部; 一下模位於該磁性嵌入物和該上模之下,其大小並對 應該上模; 引腳位於該下模之上表面周圍;以及 _晶片座位於該下模之上表面中心處。 8. 如申請專利範圍第7項之磁性嵌入物鑄模,其令該引腳 為錄合金。 9. 如申請專利範圍第7項之磁性嵌入物鑄模,更包含接合 區域位於該上模與該引腳之間,以及位於該上模與該晶片 座之間。 10. 如申請專利範圍第7項之磁性嵌入物鑄祺,其中該磁 性嵌入物為一永久磁鐵,該磁性嵌入物分成兩部分’分別 位於該晶片座上方之接合區域,以及該引腳上方接合區域 之内圈。 第11頁 本紙浪尺度速用中國國家標率(CNS ) A4it格(210X297公釐) n n i I m - I n I I —Μ M ' I. , In I tl ί (锖先閲讀背面之注意事項再填容本I ) 411593 ------- 、申請專利範圍 u’如申請專利範圍第1〇項之磁性嵌入物鑄模其中該磁 f生嵌入物為—電磁鐵。 12. —種半導體封裝中之塑膠載具先模製程的方法,該方 法至少包含: 固定一上模; 於該上模之中至入—磁性嵌入物; 接合一下模至該上模和該磁性入物下方; 注入谬質材料; 加熱固化該膠質材料;以及 開模’分開該上模與該下模,並形成該塑膠載具。 13. 如申請專利範圍第ι2項之方法,其中該接合之該下模 更包含引腳位於該下模之上表面周圍β 14. 如申請專利範圍第12項之方法,其中該接合之該下模 更包含晶片座位於該下模之上表面中心部位。 經濟部中央揉率局負工消費合作社印製 15. 如申請專利範圍第12項之方法,其中該上模和該引 腳’以及該晶片座之間的接觸區域形成接合區域。 16. 如申請專利範圍第12項之方法,其中該置入之該磁性 嵌入物為一永久磁鐵,且該磁性嵌入物分成兩部分,分別 第12頁 本纸張尺度速用中國國家揲準(CNS ) Α4规格(210X29^D 411593 I D8 #、申請專利範圍 位於該晶片座之上方該接合區域,以及該引腳上方該接合 區域的内圈。 17‘如申請專利範圍第16項之方法,其中該置入之該磁性 嵌入物為一電磁鐵。 ---------裝---_!J訂------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標率局員工消費合作社印策 第13頁 本紙張尺度逍用中國國家#準(CNS ) A4規格(210X297公釐)411593 il C8 ____D8 VI. Patent application scope Application patent scope h — A mold with magnetic inserts, which is a process for the first molding of plastic carriers in semiconductor packages. The mold of the magnetic inserts includes at least: an upper mold; magnetic The insert is located inside the upper mold; and the lower mold is located below the magnetic insert and the upper mold, and its size should correspond to the upper mold. 2 'If the magnetic insert mold of item 1 of the scope of patent application, the lower part further includes a pin around the upper surface of the lower mold, and the pin is a brocade alloy 3. If the magnetic property of item 1 of the scope of patent application The insert mold, wherein the lower part further includes a wafer holder at the center of the upper table of the lower mold, and the wafer holder receives the wafer. The mold is cast with a magnetic insert as in item I of the patent application scope, and further includes an access area between the chess piece and the pin, and between the chess piece and the s-seat. Please read the back of the BEI sheet first. The item is printed on the gutter and printed by the Central Sample Rate Department of the Ministry of Economic Affairs, the Shell Cooperative Consumer Cooperatives. It is a permanent magnet, and the magnetic insert is divided into two parts, respectively, a bonding area above the chip holder, and an inner cavity inserted above the pin. Magnetic ik area page ίο The paper size of this paper uses China National Standards (CNS) A4 Washing (210X297 mm) Employees of the China Economic and Trade Bureau, Ministry of Economic Affairs, Consumer Consumption Du A8 411593? S D8___ __ VI. Patent Application Scope 6. The magnetic dove model as described in item 5 of the Shen Ye patent, wherein the magnetic insert is an electromagnet. 7. —A mold with a magnetic insert 'is a process for the first molding of a plastic carrier in a semiconductor package' The front mold of the magnetic insert includes at least one upper mold; the magnetic insert is located inside the upper mold; The lower die is located below the magnetic insert and the upper die, and its size should correspond to the upper die; the pins are located around the upper surface of the lower die; and the wafer holder is located at the center of the upper surface of the lower die. 8. If the magnetic insert mold of item 7 of the patent application is applied, the pin is made of alloy. 9. If the magnetic insert mold of item 7 of the patent application scope further includes a bonding area between the upper mold and the pin, and between the upper mold and the wafer holder. 10. For example, the magnetic insert casting of item 7 of the patent application scope, wherein the magnetic insert is a permanent magnet, and the magnetic insert is divided into two parts, which are respectively located in a bonding area above the chip holder, and a bonding above the pin. The inner circle of the area. Page 11 Quick-Test Chinese Paper Standard (CNS) A4it grid (210X297 mm) nni I m-I n II —Μ M 'I., In I tl ί (锖 Please read the notes on the back before filling Rongben I) 411593 -------, the patent application scope u ', such as the magnetic insert mold of the patent application item 10, wherein the magnetic insert is-electromagnet. 12. A method of first molding a plastic carrier in a semiconductor package, the method includes at least: fixing an upper mold; inserting the upper mold into the magnetic insert; bonding the lower mold to the upper mold and the magnetic Underneath the object; injecting a false material; heating and curing the gel material; and opening a mold to separate the upper mold and the lower mold and form the plastic carrier. 13. If the method of applying for the scope item 2 of the patent application, wherein the lower mold of the joint further includes the pins located around the upper surface of the lower mold β 14. As the method of applying for the scope of the patent application item 12, wherein the joint of the lower mold The mold further includes a wafer holder located at a center portion of the upper surface of the lower mold. Printed by the Central Consumer Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 15. The method of claim 12 in which the contact area between the upper mold and the pin 'and the wafer holder forms a joint area. 16. For the method of applying for the item 12 of the patent scope, wherein the inserted magnetic insert is a permanent magnet, and the magnetic insert is divided into two parts, respectively, on page 12 of this paper. CNS) A4 specification (210X29 ^ D 411593 I D8 #, the patent application scope is located in the bonding area above the wafer holder, and the inner circle of the bonding area above the pin. The magnetic insert to be inserted is an electromagnet. --------- Installation ---_! J Order ------ Wire (Please read the precautions on the back before filling this page ) Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, page 13 This paper is based on the Chinese National Standard #CNS (CNS) A4 (210X297 mm)
TW088110401A 1999-06-22 1999-06-22 Plastic carrier mold with magnetic inserting article TW411593B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002056366A1 (en) * 2001-01-10 2002-07-18 Silverbrook Research Pty. Ltd. Use of protective caps as masks at a wafer scale
WO2002056031A1 (en) * 2001-01-10 2002-07-18 Silverbrook Research Pty. Ltd. Accelerometer protected by caps applied at the wafer scale
AU2002218866B2 (en) * 2001-01-10 2004-03-25 Silverbrook Research Pty Ltd Use of protective caps as masks at a wafer scale
AU2004202412B2 (en) * 2001-01-10 2005-08-18 Silverbrook Research Pty Ltd A method of separating a plurality of micro-fabricated devices on a common substrate
CN106783636A (en) * 2016-12-10 2017-05-31 无锡中微高科电子有限公司 The preparation method of integrated circuit Plastic Package

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002056366A1 (en) * 2001-01-10 2002-07-18 Silverbrook Research Pty. Ltd. Use of protective caps as masks at a wafer scale
WO2002056031A1 (en) * 2001-01-10 2002-07-18 Silverbrook Research Pty. Ltd. Accelerometer protected by caps applied at the wafer scale
AU2002218866B2 (en) * 2001-01-10 2004-03-25 Silverbrook Research Pty Ltd Use of protective caps as masks at a wafer scale
US6925875B2 (en) 2001-01-10 2005-08-09 Silverbrook Research Pty Ltd Packaged accelerometer
AU2004202412B2 (en) * 2001-01-10 2005-08-18 Silverbrook Research Pty Ltd A method of separating a plurality of micro-fabricated devices on a common substrate
US7001793B2 (en) 2001-01-10 2006-02-21 Silverbrook Research Pty Ltd Method of protecting microfabricated devices with protective caps
US7284976B2 (en) 2001-01-10 2007-10-23 Silverbrook Research Pty Ltd Moulding assembly for forming at least one protective cap
CN106783636A (en) * 2016-12-10 2017-05-31 无锡中微高科电子有限公司 The preparation method of integrated circuit Plastic Package

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