TWI257745B - Connector and connector groove - Google Patents

Connector and connector groove Download PDF

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Publication number
TWI257745B
TWI257745B TW093136947A TW93136947A TWI257745B TW I257745 B TWI257745 B TW I257745B TW 093136947 A TW093136947 A TW 093136947A TW 93136947 A TW93136947 A TW 93136947A TW I257745 B TWI257745 B TW I257745B
Authority
TW
Taiwan
Prior art keywords
connector
unit
lead parts
resin
circuit board
Prior art date
Application number
TW093136947A
Other languages
Chinese (zh)
Other versions
TW200531363A (en
Inventor
Masato Kato
Hiroshi Fukuzaki
Tsuyoshi Fukami
Yoichi Kasamaru
Masaharu Takai
Original Assignee
J S T Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J S T Mfg Co Ltd filed Critical J S T Mfg Co Ltd
Publication of TW200531363A publication Critical patent/TW200531363A/en
Application granted granted Critical
Publication of TWI257745B publication Critical patent/TWI257745B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

Abstract

The present invention provides a connector capable of being easily and reliably coupled to a printed circuit board. A connector (10) comprises two sets of a plurality of lead parts (31) and a plurality of lead parts (41) extending from one side surface (11) of a housing (1) to be opposite to each other. A printed circuit board (20) includes slot (21) abutting on the side surfaces (11) to (13) of the housing (1), and edge connectors (22A) and (22B) are formed on both surfaces of an edge abutting on the one side surface (11). The edge connectors (22A) and (22B) are inserted between the lead parts (31) and (41), and the lead parts (31) and (41) are soldered to the edge connectors (22A) and (22B), respectively. In a pair of first protrusions (14A) and (15B), a recess (140) for gripping the printed circuit board (20) is formed, and the recess (140) is aligned in the same row as the opposing gap between the lead parts (31) and (41). The second protrusions (15A) and (15B) each have a supporting surface abutting on one surface of the printed circuit board (20), and respectively protrude from the side surfaces (12) and (13) arranged opposite to each other.

Description

1257745 A8 B8 C8 D8 第83105588號專利申請案 .(98年12月18日） 六、申請專利範圍 自前述封裝單元（5)，將經樹脂包封過電子元件 取出於外部之機構之電子元件之樹脂包封成形裝置， 其特徵在： 對業已具備之前述封裝單元（5)，以裝卸自如狀 態裝設另外之封裝單元（5a、5b或5c)，而以增減自如 之形態調整封裝單元之數目者。 5.如申請專利範圍第4項之電子元件之樹脂包封成形裝 置，其中，對前述封裝單元（5· 5a· 5b· 5c)供應裝著 有*電子元：件之未經樹脂包封前引線架（14)及樹脂粒 (21)之前述機構係包含：供應裝著有電子元件之多數 未經樹脂包封前引線架（14)之供應單元（1)、 令前述各未經樹脂封前引線架向規定方向整形 排列之引線架整列單元（2)、 樹脂粒（21)供應單元（3)、 令樹脂粒（21)整形排列並將其搬出之樹脂粒搬 出單元（4)、以及， 將整列後之未經樹脂包封前引線架（14)及樹脂 粒（21)移送至前述封裝單元（5· 5a· 5b· 5c)之裝載機 構單元（6);其中， 將已經樹脂包封之電子元件，自前述封裝機構 單元（5· 5a· 5b· 5 c)取出於外部之前述機構包含： 將經樹脂包封過之引線架取出之卸載機構單元 ⑺， 鋼模之清潔機構單元（8)、 經樹脂包封過之引線架之移送單元（9)、 本紙張尺度適用中國國家標準（CNS)A4規格（21〇χ297公釐） 32 36984(修正本） (請先朗讀背面之注意事項再填寫本頁) -ti n Bn n t— I— · aBBl ϋ ϋ aiai ~ 經濟部智慧財產局員工消費合作社印製 1257745 A8B8C8D8 第831〇5588號專利申請索 • (98 年 12 月 18 “') *六、申請專利範圍 * 將經樹脂包封過之引線架之注入口除去之注入 口消除單元（10)、 - 將已除去入型口之各經齒脂包封過引線架各別 加以繫著之拾取單元（11)、以及 將已繫著之各個經樹脂包封過引線架各別加以 收容之引線架收容單元（12); 更進一步亦具備有連續且自動控制前述各單元 之各種動作之控制單元（13)者。 6.如申請專利範圍第4項之電子元件之樹脂包封成形裝 置，其中，業已具備之前述封裝單元（5)及前述另外 之封裝單元（5a、5b或5c)係各自應用在將不同種類之 製品之樹脂包封成形用者。 <锖先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公変） 33 36984 (修正本)1257745 A8 B8 C8 D8 Patent Application No. 83105588 (December 18, 1998) VI. Patent application range from the above-mentioned package unit (5), the electronic component of the mechanism in which the resin-encapsulated electronic component is taken out to the outside The resin encapsulation molding device is characterized in that: the package unit (5) which is already provided is provided with another package unit (5a, 5b or 5c) in a detachable state, and the package unit is adjusted in a freely decreasing manner. The number. 5. The resin encapsulation molding apparatus for an electronic component according to claim 4, wherein the package unit (5·5a·5b· 5c) is supplied with an *electronic element: before being encapsulated without resin The foregoing mechanism of the lead frame (14) and the resin pellet (21) includes: supplying a supply unit (1) containing a plurality of unencapsulated front lead frames (14) with electronic components, and the foregoing unsealed resin seals a lead frame alignment unit (2), a resin pellet (21) supply unit (3), a resin pellet carrying unit (4) for shaping the resin pellets (21) and moving the resin pellets (21), and a resin pellet carrying unit (4), and a resin pellet (21) , the entire loading unit (6) and the resin pellets (21) are transferred to the loading unit (5) of the packaging unit (5·5a·5b·5c); The sealed electronic component, which is taken out from the package mechanism unit (5·5a·5b· 5 c), includes: an unloading mechanism unit (7) for taking out the resin-encapsulated lead frame, and a cleaning mechanism unit for the steel mold (8) Transfer unit of lead frame that has been encapsulated by resin (9) This paper scale applies to China National Standard (CNS) A4 specification (21〇χ297 mm) 32 36984 (Revised) (Please read the back note first and then fill out this page) -ti n Bn nt— I— · aBBl ϋ ϋ Aiai ~ Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 1257745 A8B8C8D8 Patent Application No. 831〇5588 • (December 18, 1998 “') * VI. Patent Application Scope* Note on the lead frame that has been encapsulated by resin The inlet removing unit (10) for removing the inlet, the picking unit (11) for attaching each of the toothed seals of the removed inlet port to the lead frame, and the respective resin packs to be attached The lead frame accommodating unit (12) for accommodating the lead frames is further provided; and further comprising a control unit (13) for continuously and automatically controlling various operations of the respective units. 6. As claimed in claim 4 A resin encapsulation molding apparatus for an electronic component, wherein the package unit (5) and the other package unit (5a, 5b, or 5c) which are already provided are each used for encapsulating a resin of a different type of product. <锖Read the back of the precautions to fill out this page) Ministry of Economic Affairs Intellectual Property Office employees consumer cooperatives printed in this paper scale applicable Chinese National Standard (CNS) A4 size (210 * 297 public Bian) 3,336,984 (Revised)

TW093136947A 2003-12-01 2004-11-30 Connector and connector groove TWI257745B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402296A JP4084291B2 (en) 2003-12-01 2003-12-01 connector

Publications (2)

Publication Number Publication Date
TW200531363A TW200531363A (en) 2005-09-16
TWI257745B true TWI257745B (en) 2006-07-01

Family

ID=34463947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136947A TWI257745B (en) 2003-12-01 2004-11-30 Connector and connector groove

Country Status (7)

Country Link
US (1) US7001218B2 (en)
EP (1) EP1538711B1 (en)
JP (1) JP4084291B2 (en)
KR (1) KR101092960B1 (en)
CN (1) CN100461538C (en)
DE (1) DE602004029860D1 (en)
TW (1) TWI257745B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2916998Y (en) * 2006-06-09 2007-06-27 富士康(昆山)电脑接插件有限公司 Electronic card connector
CN109979674A (en) * 2019-04-30 2019-07-05 青岛罗博飞海洋探测装备应用技术研究院有限公司 A kind of underwater optoelectronic composite cable and its application
US20230299517A1 (en) * 2020-07-29 2023-09-21 Carlex Glass America, Llc Glass product, connector, and method of installing connector

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116263A (en) 1988-03-30 1992-05-26 Amp Incorporated Connector for posted terminals
EP0472692B2 (en) * 1990-03-17 2000-08-23 AMPHENOL-TUCHEL ELECTRONICS GmbH Contactor device, especially for an sim
TW370305U (en) * 1996-04-09 1999-09-11 Hon Hai Prec Ind Co Ltd Mold for cartridge connectors
CN1118897C (en) * 1996-12-20 2003-08-20 惠特克公司 Memory card connector and contact retention system therefor and method of assembly thereof
JP3431554B2 (en) 1999-11-09 2003-07-28 山一電機株式会社 Card connector
JP3530460B2 (en) 2000-04-27 2004-05-24 山一電機株式会社 Card connector
JP2001313128A (en) * 2000-04-27 2001-11-09 Yamaichi Electronics Co Ltd Card connector
JP3507787B2 (en) 2000-10-19 2004-03-15 山一電機株式会社 Card connector
TW563941U (en) * 2001-04-30 2003-11-21 Hon Hai Prec Ind Co Ltd Electronic card connector
JP4297633B2 (en) * 2001-07-12 2009-07-15 アルプス電気株式会社 Card connector device
TWM249145U (en) * 2003-12-02 2004-11-01 Kingconn Technology Co Ltd Plugging slot structure of storage medium for multiple types of memory cards

Also Published As

Publication number Publication date
KR20050053005A (en) 2005-06-07
EP1538711B1 (en) 2010-11-03
KR101092960B1 (en) 2011-12-12
CN1624986A (en) 2005-06-08
EP1538711A3 (en) 2008-03-26
JP2005166378A (en) 2005-06-23
US7001218B2 (en) 2006-02-21
US20050142921A1 (en) 2005-06-30
TW200531363A (en) 2005-09-16
EP1538711A2 (en) 2005-06-08
CN100461538C (en) 2009-02-11
DE602004029860D1 (en) 2010-12-16
JP4084291B2 (en) 2008-04-30

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MM4A Annulment or lapse of patent due to non-payment of fees