TWI257118B - System and method for scheduling the movement of wafers in a wafer-processing tool - Google Patents

System and method for scheduling the movement of wafers in a wafer-processing tool

Info

Publication number
TWI257118B
TWI257118B TW091107269A TW91107269A TWI257118B TW I257118 B TWI257118 B TW I257118B TW 091107269 A TW091107269 A TW 091107269A TW 91107269 A TW91107269 A TW 91107269A TW I257118 B TWI257118 B TW I257118B
Authority
TW
Taiwan
Prior art keywords
wafer
wafers
processing tool
movement
scheduling
Prior art date
Application number
TW091107269A
Other languages
English (en)
Inventor
Kentaro Joma
Tatsuya Ogi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TWI257118B publication Critical patent/TWI257118B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32265—Waiting, queue time, buffer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32277—Agv schedule integrated into cell schedule
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32304—Minimize flow time, tact, shortest processing, machining time
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
TW091107269A 2001-04-26 2002-04-10 System and method for scheduling the movement of wafers in a wafer-processing tool TWI257118B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/844,582 US6535784B2 (en) 2001-04-26 2001-04-26 System and method for scheduling the movement of wafers in a wafer-processing tool

Publications (1)

Publication Number Publication Date
TWI257118B true TWI257118B (en) 2006-06-21

Family

ID=25293127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091107269A TWI257118B (en) 2001-04-26 2002-04-10 System and method for scheduling the movement of wafers in a wafer-processing tool

Country Status (4)

Country Link
US (2) US6535784B2 (zh)
JP (3) JP2004526263A (zh)
TW (1) TWI257118B (zh)
WO (1) WO2002088859A2 (zh)

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US20030171972A1 (en) * 2002-01-28 2003-09-11 James Heskin Scheduling system and method
EP1387249B1 (en) 2002-07-31 2019-03-13 Texas Instruments Incorporated RISC processor having a stack and register architecture
JP4233908B2 (ja) * 2003-04-02 2009-03-04 東京エレクトロン株式会社 基板処理システム
JP4272494B2 (ja) * 2003-08-20 2009-06-03 パナソニック株式会社 製造プロセスの開発方法
JP4279102B2 (ja) * 2003-09-22 2009-06-17 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
US7269469B2 (en) * 2004-03-09 2007-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for scheduling manufacturing jobs for a semiconductor manufacturing tool
US7487448B2 (en) * 2004-04-30 2009-02-03 Microsoft Corporation Document mark up methods and systems
US7308329B2 (en) * 2004-12-28 2007-12-11 Olympus Corporation Method and apparatus for inspecting semiconductor wafer
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
JP4884801B2 (ja) * 2005-10-06 2012-02-29 東京エレクトロン株式会社 処理システム
US7206653B1 (en) * 2005-11-29 2007-04-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer-based planning methods and systems for batch-based processing tools
ATE476737T1 (de) * 2007-03-02 2010-08-15 Singulus Mastering B V Steuerungsverfahren für ein integrales mastering- system
US8206197B2 (en) * 2007-04-20 2012-06-26 Ebara Corporation Polishing apparatus and program thereof
DE102007046848A1 (de) * 2007-09-29 2009-04-02 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern der Transportsequenzen in einer Prozessanlage mittels eines vorausschauenden Modus
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
JP5359285B2 (ja) * 2009-01-07 2013-12-04 東京エレクトロン株式会社 処理装置及び処理装置の運転方法
CN101763098B (zh) * 2009-12-24 2012-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 一种硅片优化调度的方法和装置
JP5168300B2 (ja) * 2010-02-24 2013-03-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
CN102800563B (zh) * 2011-05-26 2014-11-05 中芯国际集成电路制造(上海)有限公司 晶片投片方法与晶片投片装置
US20130079913A1 (en) * 2011-09-28 2013-03-28 Globalfoundries Inc. Methods and systems for semiconductor fabrication with local processing management
JP6105982B2 (ja) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法
US20140236651A1 (en) * 2013-02-15 2014-08-21 The Boeing Company Display of Process-Plan Execution
CN105824293B (zh) * 2015-01-06 2019-05-28 中芯国际集成电路制造(上海)有限公司 一种光罩派工方法及系统
CN111489986B (zh) * 2019-01-28 2024-03-22 东京毅力科创株式会社 基片处理装置和基片处理方法
JP2022072570A (ja) * 2020-10-30 2022-05-17 株式会社荏原製作所 基板処理装置においてカセットからの基板の取り出しタイミングを決定する方法、装置、プログラム、および基板処理装置

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Also Published As

Publication number Publication date
WO2002088859A2 (en) 2002-11-07
JP2012124499A (ja) 2012-06-28
WO2002088859A3 (en) 2003-09-25
US6535784B2 (en) 2003-03-18
JP2007005822A (ja) 2007-01-11
JP5449310B2 (ja) 2014-03-19
JP2004526263A (ja) 2004-08-26
US20020160621A1 (en) 2002-10-31
US6711454B2 (en) 2004-03-23
US20030120371A1 (en) 2003-06-26

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