TWI257105B - Plane decoding method and device for three dimensional memories - Google Patents

Plane decoding method and device for three dimensional memories

Info

Publication number
TWI257105B
TWI257105B TW093138338A TW93138338A TWI257105B TW I257105 B TWI257105 B TW I257105B TW 093138338 A TW093138338 A TW 093138338A TW 93138338 A TW93138338 A TW 93138338A TW I257105 B TWI257105 B TW I257105B
Authority
TW
Taiwan
Prior art keywords
plane
core cells
memory core
drain
word
Prior art date
Application number
TW093138338A
Other languages
English (en)
Other versions
TW200539193A (en
Inventor
Hang-Ting Lue
Ming-Hsiu Lee
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Publication of TW200539193A publication Critical patent/TW200539193A/zh
Application granted granted Critical
Publication of TWI257105B publication Critical patent/TWI257105B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8221Three dimensional integrated circuits stacked in different levels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • H10B20/27ROM only
    • H10B20/30ROM only having the source region and the drain region on the same level, e.g. lateral transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
TW093138338A 2004-02-12 2004-12-10 Plane decoding method and device for three dimensional memories TWI257105B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/779,147 US6906940B1 (en) 2004-02-12 2004-02-12 Plane decoding method and device for three dimensional memories

Publications (2)

Publication Number Publication Date
TW200539193A TW200539193A (en) 2005-12-01
TWI257105B true TWI257105B (en) 2006-06-21

Family

ID=34634652

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093138338A TWI257105B (en) 2004-02-12 2004-12-10 Plane decoding method and device for three dimensional memories

Country Status (3)

Country Link
US (1) US6906940B1 (zh)
CN (1) CN100383973C (zh)
TW (1) TWI257105B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509717B (zh) * 2009-08-14 2015-11-21 Hewlett Packard Development Co 多層式電路

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060010625A1 (en) * 2004-07-14 2006-01-19 Zuko, Llc Cleansing system with disposable pads
JP4288376B2 (ja) 2007-04-24 2009-07-01 スパンション エルエルシー 不揮発性記憶装置およびその制御方法
JP2008276858A (ja) * 2007-04-27 2008-11-13 Spansion Llc 不揮発性記憶装置及びそのバイアス制御方法
US20080266925A1 (en) * 2007-04-30 2008-10-30 International Business Machines Corporation Array Split Across Three-Dimensional Interconnected Chips
US7420832B1 (en) * 2007-04-30 2008-09-02 International Business Machines Corporation Array split across three-dimensional interconnected chips
US20080273369A1 (en) * 2007-05-02 2008-11-06 Michael Angerbauer Integrated Circuit, Memory Module, Method of Operating an Integrated Circuit, and Computing System
TWI418020B (zh) * 2009-03-03 2013-12-01 Macronix Int Co Ltd 用於fn穿隧程式化及抹除之三維記憶體陣列
TWI433302B (zh) 2009-03-03 2014-04-01 Macronix Int Co Ltd 積體電路自對準三度空間記憶陣列及其製作方法
US8203187B2 (en) * 2009-03-03 2012-06-19 Macronix International Co., Ltd. 3D memory array arranged for FN tunneling program and erase
US8373440B2 (en) 2009-04-06 2013-02-12 Hewlett-Packard Development Company, L.P. Three dimensional multilayer circuit
KR101682662B1 (ko) * 2009-07-20 2016-12-06 삼성전자주식회사 3차원 메모리 장치 및 그것의 프로그램 방법
US8383512B2 (en) 2011-01-19 2013-02-26 Macronix International Co., Ltd. Method for making multilayer connection structure
US8154128B2 (en) * 2009-10-14 2012-04-10 Macronix International Co., Ltd. 3D integrated circuit layer interconnect
US7982504B1 (en) 2010-01-29 2011-07-19 Hewlett Packard Development Company, L.P. Interconnection architecture for multilayer circuits
WO2011093863A1 (en) 2010-01-29 2011-08-04 Hewlett-Packard Development Company, L.P. Three dimensional multilayer circuit
US8437192B2 (en) 2010-05-21 2013-05-07 Macronix International Co., Ltd. 3D two bit-per-cell NAND flash memory
US8890233B2 (en) 2010-07-06 2014-11-18 Macronix International Co., Ltd. 3D memory array with improved SSL and BL contact layout
US8659944B2 (en) 2010-09-01 2014-02-25 Macronix International Co., Ltd. Memory architecture of 3D array with diode in memory string
US8503213B2 (en) 2011-01-19 2013-08-06 Macronix International Co., Ltd. Memory architecture of 3D array with alternating memory string orientation and string select structures
US8598032B2 (en) 2011-01-19 2013-12-03 Macronix International Co., Ltd Reduced number of masks for IC device with stacked contact levels
US8724390B2 (en) 2011-01-19 2014-05-13 Macronix International Co., Ltd. Architecture for a 3D memory array
US8630114B2 (en) 2011-01-19 2014-01-14 Macronix International Co., Ltd. Memory architecture of 3D NOR array
TWI497496B (zh) * 2011-01-19 2015-08-21 Macronix Int Co Ltd 三維記憶體陣列架構
US8486791B2 (en) 2011-01-19 2013-07-16 Macronix International Co., Ltd. Mufti-layer single crystal 3D stackable memory
US8836137B2 (en) 2012-04-19 2014-09-16 Macronix International Co., Ltd. Method for creating a 3D stacked multichip module
JP2012244180A (ja) 2011-05-24 2012-12-10 Macronix Internatl Co Ltd 多層接続構造及びその製造方法
US8541882B2 (en) 2011-09-22 2013-09-24 Macronix International Co. Ltd. Stacked IC device with recessed conductive layers adjacent to interlevel conductors
US8574992B2 (en) 2011-09-22 2013-11-05 Macronix International Co., Ltd. Contact architecture for 3D memory array
US8994489B2 (en) 2011-10-19 2015-03-31 Micron Technology, Inc. Fuses, and methods of forming and using fuses
US9082656B2 (en) 2011-11-11 2015-07-14 Macronix International Co., Ltd. NAND flash with non-trapping switch transistors
US8723155B2 (en) 2011-11-17 2014-05-13 Micron Technology, Inc. Memory cells and integrated devices
US9252188B2 (en) 2011-11-17 2016-02-02 Micron Technology, Inc. Methods of forming memory cells
US8570806B2 (en) 2011-12-13 2013-10-29 Macronix International Co., Ltd. Z-direction decoding for three dimensional memory array
US9035275B2 (en) 2011-12-19 2015-05-19 Macronix International Co., Ltd. Three dimensional memory array adjacent to trench sidewalls
US8587998B2 (en) 2012-01-06 2013-11-19 Macronix International Co., Ltd. 3D memory array with read bit line shielding
US8951862B2 (en) * 2012-01-10 2015-02-10 Macronix International Co., Ltd. Damascene word line
EP2631947B1 (en) 2012-02-23 2014-12-31 Macronix International Co., Ltd. Damascene word line
US9136467B2 (en) 2012-04-30 2015-09-15 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
US8987098B2 (en) 2012-06-19 2015-03-24 Macronix International Co., Ltd. Damascene word line
US8633099B1 (en) 2012-07-19 2014-01-21 Macronix International Co., Ltd. Method for forming interlayer connectors in a three-dimensional stacked IC device
US8927957B2 (en) 2012-08-09 2015-01-06 Macronix International Co., Ltd. Sidewall diode driving device and memory using same
US8736069B2 (en) 2012-08-23 2014-05-27 Macronix International Co., Ltd. Multi-level vertical plug formation with stop layers of increasing thicknesses
US8841649B2 (en) 2012-08-31 2014-09-23 Micron Technology, Inc. Three dimensional memory array architecture
US8729523B2 (en) * 2012-08-31 2014-05-20 Micron Technology, Inc. Three dimensional memory array architecture
US9196315B2 (en) 2012-11-19 2015-11-24 Macronix International Co., Ltd. Three dimensional gate structures with horizontal extensions
US9502349B2 (en) 2014-01-17 2016-11-22 Macronix International Co., Ltd. Separated lower select line in 3D NAND architecture
US9219073B2 (en) 2014-01-17 2015-12-22 Macronix International Co., Ltd. Parallelogram cell design for high speed vertical channel 3D NAND memory
US9437605B2 (en) 2012-12-24 2016-09-06 Macronix International Co., Ltd. 3D NAND array architecture
US9224474B2 (en) 2013-01-09 2015-12-29 Macronix International Co., Ltd. P-channel 3D memory array and methods to program and erase the same at bit level and block level utilizing band-to-band and fowler-nordheim tunneling principals
US8759899B1 (en) 2013-01-11 2014-06-24 Macronix International Co., Ltd. Integration of 3D stacked IC device with peripheral circuits
US9171636B2 (en) 2013-01-29 2015-10-27 Macronix International Co. Ltd. Hot carrier generation and programming in NAND flash
US8987914B2 (en) 2013-02-07 2015-03-24 Macronix International Co., Ltd. Conductor structure and method
US9553262B2 (en) 2013-02-07 2017-01-24 Micron Technology, Inc. Arrays of memory cells and methods of forming an array of memory cells
US8976600B2 (en) 2013-03-11 2015-03-10 Macronix International Co., Ltd. Word line driver circuit for selecting and deselecting word lines
US8993429B2 (en) 2013-03-12 2015-03-31 Macronix International Co., Ltd. Interlayer conductor structure and method
US9214351B2 (en) 2013-03-12 2015-12-15 Macronix International Co., Ltd. Memory architecture of thin film 3D array
US9123778B2 (en) 2013-03-13 2015-09-01 Macronix International Co., Ltd. Damascene conductor for 3D array
US9379126B2 (en) 2013-03-14 2016-06-28 Macronix International Co., Ltd. Damascene conductor for a 3D device
US9117526B2 (en) 2013-07-08 2015-08-25 Macronix International Co., Ltd. Substrate connection of three dimensional NAND for improving erase performance
US9076535B2 (en) 2013-07-08 2015-07-07 Macronix International Co., Ltd. Array arrangement including carrier source
US9443763B2 (en) 2013-09-12 2016-09-13 Micron Technology, Inc. Methods for forming interconnections between top electrodes in memory cells by a two-step chemical-mechanical polishing (CMP) process
US9099538B2 (en) 2013-09-17 2015-08-04 Macronix International Co., Ltd. Conductor with a plurality of vertical extensions for a 3D device
US8970040B1 (en) 2013-09-26 2015-03-03 Macronix International Co., Ltd. Contact structure and forming method
US9070447B2 (en) 2013-09-26 2015-06-30 Macronix International Co., Ltd. Contact structure and forming method
US9875789B2 (en) * 2013-11-22 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. 3D structure for advanced SRAM design to avoid half-selected issue
US9679849B1 (en) 2014-01-17 2017-06-13 Macronix International Co., Ltd. 3D NAND array with sides having undulating shapes
US9698156B2 (en) 2015-03-03 2017-07-04 Macronix International Co., Ltd. Vertical thin-channel memory
US9373632B2 (en) 2014-01-17 2016-06-21 Macronix International Co., Ltd. Twisted array design for high speed vertical channel 3D NAND memory
US9343322B2 (en) 2014-01-17 2016-05-17 Macronix International Co., Ltd. Three dimensional stacking memory film structure
US9881971B2 (en) * 2014-04-01 2018-01-30 Micron Technology, Inc. Memory arrays
US9559113B2 (en) 2014-05-01 2017-01-31 Macronix International Co., Ltd. SSL/GSL gate oxide in 3D vertical channel NAND
US9196628B1 (en) 2014-05-08 2015-11-24 Macronix International Co., Ltd. 3D stacked IC device with stepped substack interlayer connectors
US9343506B2 (en) 2014-06-04 2016-05-17 Micron Technology, Inc. Memory arrays with polygonal memory cells having specific sidewall orientations
US9721964B2 (en) 2014-06-05 2017-08-01 Macronix International Co., Ltd. Low dielectric constant insulating material in 3D memory
US9356037B2 (en) 2014-07-07 2016-05-31 Macronix International Co., Ltd. Memory architecture of 3D array with interleaved control structures
US9373409B2 (en) 2014-07-08 2016-06-21 Macronix International Co., Ltd. Systems and methods for reduced program disturb for 3D NAND flash
US9589642B2 (en) 2014-08-07 2017-03-07 Macronix International Co., Ltd. Level shifter and decoder for memory
US9620217B2 (en) 2014-08-12 2017-04-11 Macronix International Co., Ltd. Sub-block erase
US9349745B2 (en) 2014-08-25 2016-05-24 Macronix International Co., Ltd. 3D NAND nonvolatile memory with staggered vertical gates
US9224473B1 (en) 2014-09-15 2015-12-29 Macronix International Co., Ltd. Word line repair for 3D vertical channel memory
US9589979B2 (en) 2014-11-19 2017-03-07 Macronix International Co., Ltd. Vertical and 3D memory devices and methods of manufacturing the same
US9455007B2 (en) 2014-12-01 2016-09-27 Macronix International Co., Ltd. Word line driver circuitry and compact memory using same
US9741569B2 (en) 2014-12-16 2017-08-22 Macronix International Co., Ltd. Forming memory using doped oxide
US9356105B1 (en) 2014-12-29 2016-05-31 Macronix International Co., Ltd. Ring gate transistor design for flash memory
US9418743B1 (en) 2015-02-17 2016-08-16 Macronix International Co., Ltd. 3D NAND memory with decoder and local word line drivers
US9530503B2 (en) 2015-02-19 2016-12-27 Macronix International Co., Ltd. And-type SGVC architecture for 3D NAND flash
US9524980B2 (en) 2015-03-03 2016-12-20 Macronix International Co., Ltd. U-shaped vertical thin-channel memory
US9490017B2 (en) 2015-03-10 2016-11-08 Macronix International Co., Ltd. Forced-bias method in sub-block erase
US9607702B2 (en) 2015-03-25 2017-03-28 Macronix International Co., Ltd. Sub-block page erase in 3D p-channel flash memory
US9379129B1 (en) 2015-04-13 2016-06-28 Macronix International Co., Ltd. Assist gate structures for three-dimensional (3D) vertical gate array memory structure
US9478259B1 (en) 2015-05-05 2016-10-25 Macronix International Co., Ltd. 3D voltage switching transistors for 3D vertical gate memory array
US9508446B1 (en) 2015-06-24 2016-11-29 Macronix International Co., Ltd. Temperature compensated reverse current for memory
US9373403B1 (en) 2015-07-02 2016-06-21 Macronix International Co., Ltd. 3D NAND memory device and operation thereof
US9412752B1 (en) 2015-09-22 2016-08-09 Macronix International Co., Ltd. Reference line and bit line structure for 3D memory
US9401371B1 (en) 2015-09-24 2016-07-26 Macronix International Co., Ltd. Sacrificial spin-on glass for air gap formation after bl isolation process in single gate vertical channel 3D NAND flash
TWI582964B (zh) 2015-12-30 2017-05-11 旺宏電子股份有限公司 記憶體元件及其製作方法
KR101811281B1 (ko) * 2017-04-17 2017-12-22 고려대학교 산학협력단 층 교차 기반 3차원 터보 곱 코드의 복호 방법 및 그 장치
US10461125B2 (en) 2017-08-29 2019-10-29 Micron Technology, Inc. Three dimensional memory arrays
US10777566B2 (en) 2017-11-10 2020-09-15 Macronix International Co., Ltd. 3D array arranged for memory and in-memory sum-of-products operations
US10957392B2 (en) 2018-01-17 2021-03-23 Macronix International Co., Ltd. 2D and 3D sum-of-products array for neuromorphic computing system
US10719296B2 (en) 2018-01-17 2020-07-21 Macronix International Co., Ltd. Sum-of-products accelerator array
US10242737B1 (en) 2018-02-13 2019-03-26 Macronix International Co., Ltd. Device structure for neuromorphic computing system
US10635398B2 (en) 2018-03-15 2020-04-28 Macronix International Co., Ltd. Voltage sensing type of matrix multiplication method for neuromorphic computing system
US10700004B2 (en) 2018-04-23 2020-06-30 Macronix International Co., Ltd. 3D NAND world line connection structure
US10840254B2 (en) 2018-05-22 2020-11-17 Macronix International Co., Ltd. Pitch scalable 3D NAND
US10664746B2 (en) 2018-07-17 2020-05-26 Macronix International Co., Ltd. Neural network system
US11138497B2 (en) 2018-07-17 2021-10-05 Macronix International Co., Ltd In-memory computing devices for neural networks
US10629608B2 (en) 2018-09-26 2020-04-21 Macronix International Co., Ltd. 3D vertical channel tri-gate NAND memory with tilted hemi-cylindrical structure
US11636325B2 (en) 2018-10-24 2023-04-25 Macronix International Co., Ltd. In-memory data pooling for machine learning
US10672469B1 (en) 2018-11-30 2020-06-02 Macronix International Co., Ltd. In-memory convolution for machine learning
US11562229B2 (en) 2018-11-30 2023-01-24 Macronix International Co., Ltd. Convolution accelerator using in-memory computation
US11934480B2 (en) 2018-12-18 2024-03-19 Macronix International Co., Ltd. NAND block architecture for in-memory multiply-and-accumulate operations
US11119674B2 (en) 2019-02-19 2021-09-14 Macronix International Co., Ltd. Memory devices and methods for operating the same
US10783963B1 (en) 2019-03-08 2020-09-22 Macronix International Co., Ltd. In-memory computation device with inter-page and intra-page data circuits
US11132176B2 (en) 2019-03-20 2021-09-28 Macronix International Co., Ltd. Non-volatile computing method in flash memory
US11037947B2 (en) 2019-04-15 2021-06-15 Macronix International Co., Ltd. Array of pillars located in a uniform pattern
US10910393B2 (en) 2019-04-25 2021-02-02 Macronix International Co., Ltd. 3D NOR memory having vertical source and drain structures
US11737274B2 (en) 2021-02-08 2023-08-22 Macronix International Co., Ltd. Curved channel 3D memory device
US11916011B2 (en) 2021-04-14 2024-02-27 Macronix International Co., Ltd. 3D virtual ground memory and manufacturing methods for same
US11710519B2 (en) 2021-07-06 2023-07-25 Macronix International Co., Ltd. High density memory with reference memory using grouped cells and corresponding operations
CN114242748A (zh) * 2021-12-20 2022-03-25 厦门半导体工业技术研发有限公司 一种存储单元组及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335878B1 (en) * 1998-07-28 2002-01-01 Hitachi, Ltd. Non-volatile multi-level semiconductor flash memory device and method of driving same
TW406419B (en) * 1998-01-15 2000-09-21 Siemens Ag Memory-cells arrangement and its production method
US6136650A (en) * 1999-10-21 2000-10-24 United Semiconductor Corp Method of forming three-dimensional flash memory structure
EP1104023A1 (en) * 1999-11-26 2001-05-30 STMicroelectronics S.r.l. Process for manufacturing electronic devices comprising non-volatile memory cells
US6882553B2 (en) * 2002-08-08 2005-04-19 Micron Technology Inc. Stacked columnar resistive memory structure and its method of formation and operation
US6879505B2 (en) * 2003-03-31 2005-04-12 Matrix Semiconductor, Inc. Word line arrangement having multi-layer word line segments for three-dimensional memory array

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509717B (zh) * 2009-08-14 2015-11-21 Hewlett Packard Development Co 多層式電路

Also Published As

Publication number Publication date
US6906940B1 (en) 2005-06-14
CN1655359A (zh) 2005-08-17
CN100383973C (zh) 2008-04-23
TW200539193A (en) 2005-12-01

Similar Documents

Publication Publication Date Title
TWI257105B (en) Plane decoding method and device for three dimensional memories
TW200509365A (en) Ultra low-cost solid-state memory
WO2005074091A3 (en) Method and apparatus for monitoring energy storage devices
TWI257171B (en) Memory with charge storage locations
WO2007028109A3 (en) Methods and apparatus of stacking drams
GB2441083A (en) Identical chips with different operations in a system
TW200744160A (en) Semiconductor device, embedded memory, and method of fabricating the same
TWI268626B (en) Magnetic random access memory devices including contact plugs between magnetic tunnel junction structures and substrates and related methods
TW200620281A (en) MRAM with staggered cell structure
US10163497B2 (en) Three dimensional dual-port bit cell and method of using same
AU2003296314A1 (en) Memory subsystem including memory modules having multiple banks
TW200518279A (en) Magnetic memory device and method of manufacturing the same
TW200601331A (en) Soft reference three conductor magnetic memory storage device
TW200729204A (en) Semiconductor memory device and electronic apparatus
TW200617982A (en) Sram array with improved cell stability
TW200725614A (en) Bit cell of organic memory
TW200729397A (en) Interlayer connecting structure
TW200625658A (en) Ferroelectric polymer memory device including polymer electrodes and method of fabricating same
WO2008051385A3 (en) Data allocation in memory chips
TW200507288A (en) A semiconductor memory device including the MOS transistor comprising the floating gate and the control gate
TW200717722A (en) Non-volatile memory and manufacturing method and operating method thereof
TW200737420A (en) Systems and methods for forming additional metal routing in semiconductor devices
TW200636737A (en) Three-dimensional memory devices and methods of manufacturing and operating the same
TW200518286A (en) Semiconductor memory device and driving method thereof
CN203661118U (zh) 一种手机卡及手机卡座