TWI249834B - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method Download PDF

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Publication number
TWI249834B
TWI249834B TW090111982A TW90111982A TWI249834B TW I249834 B TWI249834 B TW I249834B TW 090111982 A TW090111982 A TW 090111982A TW 90111982 A TW90111982 A TW 90111982A TW I249834 B TWI249834 B TW I249834B
Authority
TW
Taiwan
Prior art keywords
wires
wire
semiconductor device
resin
exposed
Prior art date
Application number
TW090111982A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiro Saito
Toru Nagamine
Ichio Shimizu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TWI249834B publication Critical patent/TWI249834B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW090111982A 2000-06-30 2001-05-18 Semiconductor device and its manufacturing method TWI249834B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TWI249834B true TWI249834B (en) 2006-02-21

Family

ID=18700505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090111982A TWI249834B (en) 2000-06-30 2001-05-18 Semiconductor device and its manufacturing method

Country Status (4)

Country Link
US (1) US6710429B2 (https=)
JP (1) JP2002026168A (https=)
KR (1) KR100778174B1 (https=)
TW (1) TWI249834B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073600A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置およびその製造方法
DE102005038443A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
TWI405313B (zh) * 2010-03-31 2013-08-11 Quanta Comp Inc 具側邊接腳之積體電路封裝元件
TWI774221B (zh) * 2021-01-29 2022-08-11 隆達電子股份有限公司 發光裝置及其製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
JP3012816B2 (ja) 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging

Also Published As

Publication number Publication date
KR20020003082A (ko) 2002-01-10
US20020000674A1 (en) 2002-01-03
US6710429B2 (en) 2004-03-23
JP2002026168A (ja) 2002-01-25
KR100778174B1 (ko) 2007-11-22

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