JP2002026168A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JP2002026168A
JP2002026168A JP2000203057A JP2000203057A JP2002026168A JP 2002026168 A JP2002026168 A JP 2002026168A JP 2000203057 A JP2000203057 A JP 2000203057A JP 2000203057 A JP2000203057 A JP 2000203057A JP 2002026168 A JP2002026168 A JP 2002026168A
Authority
JP
Japan
Prior art keywords
leads
lead
semiconductor device
sealing body
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000203057A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026168A5 (https=
Inventor
Masahiro Saito
雅浩 斉藤
Toru Nagamine
徹 長峰
Kazuo Shimizu
一男 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000203057A priority Critical patent/JP2002026168A/ja
Priority to TW090111982A priority patent/TWI249834B/zh
Priority to KR1020010028965A priority patent/KR100778174B1/ko
Priority to US09/881,716 priority patent/US6710429B2/en
Publication of JP2002026168A publication Critical patent/JP2002026168A/ja
Publication of JP2002026168A5 publication Critical patent/JP2002026168A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2000203057A 2000-06-30 2000-06-30 半導体装置およびその製造方法 Pending JP2002026168A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法
TW090111982A TWI249834B (en) 2000-06-30 2001-05-18 Semiconductor device and its manufacturing method
KR1020010028965A KR100778174B1 (ko) 2000-06-30 2001-05-25 반도체장치 및 그 제조방법
US09/881,716 US6710429B2 (en) 2000-06-30 2001-06-18 Semiconductor device and process for production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2002026168A true JP2002026168A (ja) 2002-01-25
JP2002026168A5 JP2002026168A5 (https=) 2005-06-30

Family

ID=18700505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000203057A Pending JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Country Status (4)

Country Link
US (1) US6710429B2 (https=)
JP (1) JP2002026168A (https=)
KR (1) KR100778174B1 (https=)
TW (1) TWI249834B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073600A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置およびその製造方法
DE102005038443A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
TWI405313B (zh) * 2010-03-31 2013-08-11 Quanta Comp Inc 具側邊接腳之積體電路封裝元件
TWI774221B (zh) * 2021-01-29 2022-08-11 隆達電子股份有限公司 發光裝置及其製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
JP3012816B2 (ja) 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging

Also Published As

Publication number Publication date
TWI249834B (en) 2006-02-21
KR20020003082A (ko) 2002-01-10
US20020000674A1 (en) 2002-01-03
US6710429B2 (en) 2004-03-23
KR100778174B1 (ko) 2007-11-22

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