KR100778174B1 - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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Publication number
KR100778174B1
KR100778174B1 KR1020010028965A KR20010028965A KR100778174B1 KR 100778174 B1 KR100778174 B1 KR 100778174B1 KR 1020010028965 A KR1020010028965 A KR 1020010028965A KR 20010028965 A KR20010028965 A KR 20010028965A KR 100778174 B1 KR100778174 B1 KR 100778174B1
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KR
South Korea
Prior art keywords
lead
leads
resin
semiconductor device
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020010028965A
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English (en)
Korean (ko)
Other versions
KR20020003082A (ko
Inventor
사이토마사히로
나가미네토루
시미즈이치오
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치세이사쿠쇼 filed Critical 가부시키가이샤 히타치세이사쿠쇼
Publication of KR20020003082A publication Critical patent/KR20020003082A/ko
Application granted granted Critical
Publication of KR100778174B1 publication Critical patent/KR100778174B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020010028965A 2000-06-30 2001-05-25 반도체장치 및 그 제조방법 Expired - Fee Related KR100778174B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-203057 2000-06-30
JP2000203057A JP2002026168A (ja) 2000-06-30 2000-06-30 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR20020003082A KR20020003082A (ko) 2002-01-10
KR100778174B1 true KR100778174B1 (ko) 2007-11-22

Family

ID=18700505

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010028965A Expired - Fee Related KR100778174B1 (ko) 2000-06-30 2001-05-25 반도체장치 및 그 제조방법

Country Status (4)

Country Link
US (1) US6710429B2 (https=)
JP (1) JP2002026168A (https=)
KR (1) KR100778174B1 (https=)
TW (1) TWI249834B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073600A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置およびその製造方法
DE102005038443A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
TWI405313B (zh) * 2010-03-31 2013-08-11 Quanta Comp Inc 具側邊接腳之積體電路封裝元件
TWI774221B (zh) * 2021-01-29 2022-08-11 隆達電子股份有限公司 發光裝置及其製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
JP3012816B2 (ja) 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging

Also Published As

Publication number Publication date
TWI249834B (en) 2006-02-21
KR20020003082A (ko) 2002-01-10
US20020000674A1 (en) 2002-01-03
US6710429B2 (en) 2004-03-23
JP2002026168A (ja) 2002-01-25

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