TWI249559B - Room temperature curable silicone rubber composition - Google Patents

Room temperature curable silicone rubber composition Download PDF

Info

Publication number
TWI249559B
TWI249559B TW089125339A TW89125339A TWI249559B TW I249559 B TWI249559 B TW I249559B TW 089125339 A TW089125339 A TW 089125339A TW 89125339 A TW89125339 A TW 89125339A TW I249559 B TWI249559 B TW I249559B
Authority
TW
Taiwan
Prior art keywords
weight
parts
room temperature
component
rubber composition
Prior art date
Application number
TW089125339A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Adachi
Norio Sato
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Application granted granted Critical
Publication of TWI249559B publication Critical patent/TWI249559B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
TW089125339A 1999-11-29 2000-11-29 Room temperature curable silicone rubber composition TWI249559B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33809099A JP5101762B2 (ja) 1999-11-29 1999-11-29 室温硬化性シリコーンゴム組成物

Publications (1)

Publication Number Publication Date
TWI249559B true TWI249559B (en) 2006-02-21

Family

ID=18314820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089125339A TWI249559B (en) 1999-11-29 2000-11-29 Room temperature curable silicone rubber composition

Country Status (9)

Country Link
EP (1) EP1104787B1 (enExample)
JP (1) JP5101762B2 (enExample)
KR (1) KR100675021B1 (enExample)
CN (1) CN1255478C (enExample)
AT (1) ATE266701T1 (enExample)
BR (1) BR0009620A (enExample)
DE (1) DE60010627T2 (enExample)
ES (1) ES2220349T3 (enExample)
TW (1) TWI249559B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4809518B2 (ja) * 2000-07-31 2011-11-09 東レ・ダウコーニング株式会社 防振性シリコーン組成物
JP2002069300A (ja) * 2000-08-31 2002-03-08 Dow Corning Toray Silicone Co Ltd 防振性シリコーンコンパウンド
DE10139132A1 (de) * 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
US7329474B2 (en) 2003-03-31 2008-02-12 Shin-Estu Chemical Co., Ltd. Photomask blank, photomask, and method of manufacture
JP3962926B2 (ja) * 2003-04-01 2007-08-22 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
FR2855179B1 (fr) * 2003-04-04 2007-04-06 Rhodia Chimie Sa Agglomere de particules, notamment de liege, comprenant un liant silicone vulcanise, utilisation de cet agglomere pour la fabrication de bouchons
JP4438937B2 (ja) * 2004-02-05 2010-03-24 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4530136B2 (ja) * 2004-04-06 2010-08-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及びその製造方法
JP4781779B2 (ja) * 2005-10-27 2011-09-28 信越化学工業株式会社 高分子量オルガノポリシロキサンの製造方法、該高分子量オルガノポリシロキサンを含む組成物およびその硬化物で封止された光半導体装置
US7625976B2 (en) * 2006-01-09 2009-12-01 Momemtive Performance Materials Inc. Room temperature curable organopolysiloxane composition
US20070179236A1 (en) * 2006-02-01 2007-08-02 Landon Shayne J Sealant composition having reduced permeability to gas
JP5015476B2 (ja) * 2006-03-01 2012-08-29 東レ・ダウコーニング株式会社 電極・電気回路の保護剤組成物
JP4912754B2 (ja) 2006-06-05 2012-04-11 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4530177B2 (ja) 2006-12-11 2010-08-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP5284631B2 (ja) * 2007-12-11 2013-09-11 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
GB0808682D0 (en) * 2008-05-14 2008-06-18 Dow Corning Silicone rubber compositions
JP4984086B2 (ja) * 2008-05-14 2012-07-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
CN102162720B (zh) * 2010-12-27 2012-06-20 天津钢管集团股份有限公司 应用缩聚二次印模硅橡胶测量标准样管人工u型伤的方法
JP2012219113A (ja) * 2011-04-04 2012-11-12 Dow Corning Toray Co Ltd 室温硬化性シリコーンゴム組成物
CN104471012B (zh) 2012-07-30 2017-03-29 道康宁公司 导热缩合反应可固化聚有机硅氧烷组合物及该组合物的制备和使用方法
BR112015001337B1 (pt) 2012-08-10 2021-02-23 Sika Technology Ag formulação de silicone de um ou dois componentes, uso da mesma, método para preencher um espaço entre dois substratos, e, arranjo compreendendo a dita formulação
US10072151B2 (en) 2013-12-27 2018-09-11 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, and the use thereof
CN109690367A (zh) * 2016-09-07 2019-04-26 住友化学株式会社 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法
KR101864504B1 (ko) * 2016-11-11 2018-06-29 주식회사 케이씨씨 유기폴리실록산 조성물
CN110982482B (zh) * 2019-12-25 2021-08-17 广西华纳新材料科技有限公司 一种低模量高伸长率粘接性好的硅酮密封胶及其制备方法
CN120677205A (zh) 2023-01-31 2025-09-19 迈图高新材料日本合同公司 室温固化型硅酮组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051455A (en) * 1990-01-16 1991-09-24 Dow Corning Corporation Adhesion of silicone sealants
GB9124833D0 (en) * 1991-11-22 1992-01-15 Dow Corning Sa Curable filled polysiloxane compositions
TW252146B (enExample) * 1992-08-25 1995-07-21 Dow Corning

Also Published As

Publication number Publication date
CN1255478C (zh) 2006-05-10
CN1304952A (zh) 2001-07-25
DE60010627T2 (de) 2005-09-01
JP2001152020A (ja) 2001-06-05
KR20010051993A (ko) 2001-06-25
DE60010627D1 (de) 2004-06-17
BR0009620A (pt) 2002-04-23
EP1104787A3 (en) 2001-12-19
EP1104787A2 (en) 2001-06-06
ATE266701T1 (de) 2004-05-15
ES2220349T3 (es) 2004-12-16
KR100675021B1 (ko) 2007-01-29
EP1104787B1 (en) 2004-05-12
JP5101762B2 (ja) 2012-12-19

Similar Documents

Publication Publication Date Title
TWI249559B (en) Room temperature curable silicone rubber composition
JP4948105B2 (ja) 多成分型室温硬化性シリコーンゴム組成物
WO2006051798A1 (ja) 硬化性組成物
WO2001083629A1 (en) Method of bonding adherend
TW201245335A (en) Room-temperature-curable silicone rubber composition
JP7576978B2 (ja) 湿分硬化性組成物
WO2002085985A1 (en) Curable composition
CN115485337A (zh) 用于聚合物固化的固化催化剂及其制造方法、湿气固化型组合物、固化物的制造方法
JP2006198466A (ja) 光触媒性シートおよびこれを用いた照明装置
TWI335348B (enExample)
KR101127301B1 (ko) 실온 경화성 오르가노폴리실록산 조성물
TWI417344B (zh) Room temperature hardened organopolysiloxane composition
JP2007145900A (ja) 室温硬化性ポリオルガノシロキサン組成物
US20060173126A1 (en) Room temperature curable organopolysiloxane compositions
US20240400829A1 (en) Moisture curable compositions
JP4902190B2 (ja) 室温硬化性ポリオルガノシロキサン組成物
US20240400830A1 (en) Moisture curable compositions
US12180397B2 (en) Polyorganosiloxane composition for use in adhesion of a polyphenylene sulfide resin
TWI534206B (zh) Hardened organopolysiloxane composition
CN115151610A (zh) 能够光固化的有机硅组合物及其固化产物
JP2006265372A (ja) 室温硬化性オルガノポリシロキサン組成物
WO2021085230A1 (ja) ポリフェニレンスルフィド樹脂接着用ポリオルガノシロキサン組成物
WO2025151977A1 (en) Moisture and heat curable composition, preparation method and use of the same
JP2002348476A (ja) 室温硬化性ポリオルガノシロキサン組成物
US20240409696A1 (en) Moisture curable compositions

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees