TWI247896B - X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging - Google Patents

X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging Download PDF

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Publication number
TWI247896B
TWI247896B TW093131432A TW93131432A TWI247896B TW I247896 B TWI247896 B TW I247896B TW 093131432 A TW093131432 A TW 093131432A TW 93131432 A TW93131432 A TW 93131432A TW I247896 B TWI247896 B TW I247896B
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Taiwan
Prior art keywords
sensor
frame
block
plane
wafer
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TW093131432A
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English (en)
Chinese (zh)
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TW200526961A (en
Inventor
Steve S Nasiri
Joseph Seeger
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Invensense Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02244Details of microelectro-mechanical resonators
    • H03H9/02338Suspension means
    • H03H2009/02346Anchors for ring resonators
    • H03H2009/02354Anchors for ring resonators applied along the periphery, e.g. at nodal points of the ring

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
TW093131432A 2003-10-20 2004-10-15 X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging TWI247896B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/690,224 US6892575B2 (en) 2003-10-20 2003-10-20 X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

Publications (2)

Publication Number Publication Date
TW200526961A TW200526961A (en) 2005-08-16
TWI247896B true TWI247896B (en) 2006-01-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131432A TWI247896B (en) 2003-10-20 2004-10-15 X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

Country Status (5)

Country Link
US (1) US6892575B2 (enExample)
EP (1) EP1676096B1 (enExample)
JP (1) JP5021312B2 (enExample)
TW (1) TWI247896B (enExample)
WO (1) WO2005043079A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9046367B2 (en) 2011-12-30 2015-06-02 Industrial Technology Research Institute Micro-electro-mechanical-system device with oscillating assembly

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Publication number Publication date
US6892575B2 (en) 2005-05-17
JP2007509346A (ja) 2007-04-12
EP1676096A4 (en) 2009-11-18
EP1676096A2 (en) 2006-07-05
WO2005043079A2 (en) 2005-05-12
TW200526961A (en) 2005-08-16
US20050081633A1 (en) 2005-04-21
WO2005043079A3 (en) 2005-08-11
JP5021312B2 (ja) 2012-09-05
EP1676096B1 (en) 2017-06-07

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