JP5021312B2 - 角速度センサ及びその製造方法 - Google Patents
角速度センサ及びその製造方法 Download PDFInfo
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- JP5021312B2 JP5021312B2 JP2006536699A JP2006536699A JP5021312B2 JP 5021312 B2 JP5021312 B2 JP 5021312B2 JP 2006536699 A JP2006536699 A JP 2006536699A JP 2006536699 A JP2006536699 A JP 2006536699A JP 5021312 B2 JP5021312 B2 JP 5021312B2
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
- G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
- H03H2009/02346—Anchors for ring resonators
- H03H2009/02354—Anchors for ring resonators applied along the periphery, e.g. at nodal points of the ring
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/690,224 | 2003-10-20 | ||
| US10/690,224 US6892575B2 (en) | 2003-10-20 | 2003-10-20 | X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
| PCT/US2004/034431 WO2005043079A2 (en) | 2003-10-20 | 2004-10-12 | X-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007509346A JP2007509346A (ja) | 2007-04-12 |
| JP2007509346A5 JP2007509346A5 (enExample) | 2007-05-31 |
| JP5021312B2 true JP5021312B2 (ja) | 2012-09-05 |
Family
ID=34521583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006536699A Expired - Fee Related JP5021312B2 (ja) | 2003-10-20 | 2004-10-12 | 角速度センサ及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6892575B2 (enExample) |
| EP (1) | EP1676096B1 (enExample) |
| JP (1) | JP5021312B2 (enExample) |
| TW (1) | TWI247896B (enExample) |
| WO (1) | WO2005043079A2 (enExample) |
Families Citing this family (120)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7458263B2 (en) * | 2003-10-20 | 2008-12-02 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
| KR100652952B1 (ko) * | 2004-07-19 | 2006-12-06 | 삼성전자주식회사 | 커플링 스프링을 구비한 멤스 자이로스코프 |
| FR2876180B1 (fr) * | 2004-10-06 | 2006-12-08 | Commissariat Energie Atomique | Resonateur a masses oscillantes. |
| FI116544B (fi) * | 2004-12-31 | 2005-12-15 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
| FI116543B (fi) * | 2004-12-31 | 2005-12-15 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
| US7442570B2 (en) | 2005-03-18 | 2008-10-28 | Invensence Inc. | Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom |
| US7240552B2 (en) * | 2005-06-06 | 2007-07-10 | Bei Technologies, Inc. | Torsional rate sensor with momentum balance and mode decoupling |
| US7621183B2 (en) * | 2005-11-18 | 2009-11-24 | Invensense Inc. | X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
| EP2899502B1 (en) | 2006-01-24 | 2017-04-05 | Panasonic Corporation | Inertial force sensor |
| JP4974340B2 (ja) * | 2006-05-15 | 2012-07-11 | 住友精密工業株式会社 | 角速度センサ |
| JP4310325B2 (ja) * | 2006-05-24 | 2009-08-05 | 日立金属株式会社 | 角速度センサ |
| US7434464B2 (en) * | 2006-09-29 | 2008-10-14 | Freescale Semiconductor, Inc. | Methods and apparatus for a MEMS gyro sensor |
| DE102006046772A1 (de) * | 2006-09-29 | 2008-04-03 | Siemens Ag | Anordnung zur Messung einer Drehrate mit einem Vibrationssensor |
| US7461552B2 (en) * | 2006-10-23 | 2008-12-09 | Custom Sensors & Technologies, Inc. | Dual axis rate sensor |
| JP4942470B2 (ja) * | 2006-12-20 | 2012-05-30 | 住友精密工業株式会社 | 2軸角速度センサ |
| US8250921B2 (en) | 2007-07-06 | 2012-08-28 | Invensense, Inc. | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics |
| US8508039B1 (en) * | 2008-05-08 | 2013-08-13 | Invensense, Inc. | Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics |
| US8462109B2 (en) | 2007-01-05 | 2013-06-11 | Invensense, Inc. | Controlling and accessing content using motion processing on mobile devices |
| US7796872B2 (en) * | 2007-01-05 | 2010-09-14 | Invensense, Inc. | Method and apparatus for producing a sharp image from a handheld device containing a gyroscope |
| US20090262074A1 (en) * | 2007-01-05 | 2009-10-22 | Invensense Inc. | Controlling and accessing content using motion processing on mobile devices |
| US8047075B2 (en) | 2007-06-21 | 2011-11-01 | Invensense, Inc. | Vertically integrated 3-axis MEMS accelerometer with electronics |
| US8020441B2 (en) | 2008-02-05 | 2011-09-20 | Invensense, Inc. | Dual mode sensing for vibratory gyroscope |
| US20090265671A1 (en) * | 2008-04-21 | 2009-10-22 | Invensense | Mobile devices with motion gesture recognition |
| US8141424B2 (en) | 2008-09-12 | 2012-03-27 | Invensense, Inc. | Low inertia frame for detecting coriolis acceleration |
| US20100071467A1 (en) * | 2008-09-24 | 2010-03-25 | Invensense | Integrated multiaxis motion sensor |
| US8952832B2 (en) | 2008-01-18 | 2015-02-10 | Invensense, Inc. | Interfacing application programs and motion sensors of a device |
| US7934423B2 (en) | 2007-12-10 | 2011-05-03 | Invensense, Inc. | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics |
| JP4792143B2 (ja) * | 2007-02-22 | 2011-10-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
| RU2445635C2 (ru) * | 2007-04-13 | 2012-03-20 | Кинетик, Инк. | Силовой датчик и способ определения радиуса поворота движущегося объекта |
| KR100856293B1 (ko) * | 2007-05-04 | 2008-09-03 | 삼성전기주식회사 | 수정 진동자 제조방법 |
| EP2011762B1 (en) * | 2007-07-02 | 2015-09-30 | Denso Corporation | Semiconductor device with a sensor connected to an external element |
| US20090085194A1 (en) * | 2007-09-28 | 2009-04-02 | Honeywell International Inc. | Wafer level packaged mems device |
| US7677099B2 (en) * | 2007-11-05 | 2010-03-16 | Invensense Inc. | Integrated microelectromechanical systems (MEMS) vibrating mass Z-axis rate sensor |
| US8089518B2 (en) * | 2007-11-16 | 2012-01-03 | Samsung Electronics Co., Ltd. | System and method for automatic image capture in a handheld camera with a multiple-axis actuating mechanism |
| US8125512B2 (en) * | 2007-11-16 | 2012-02-28 | Samsung Electronics Co., Ltd. | System and method for moving object selection in a handheld image capture device |
| JP5450451B2 (ja) * | 2008-02-05 | 2014-03-26 | インベンセンス,インク. | 垂直方向に集積した電子回路およびウェハスケール密封包装を含むx−y軸二重質量音叉ジャイロスコープ |
| US7971483B2 (en) * | 2008-03-28 | 2011-07-05 | Honeywell International Inc. | Systems and methods for acceleration and rotational determination from an out-of-plane MEMS device |
| US7984648B2 (en) | 2008-04-10 | 2011-07-26 | Honeywell International Inc. | Systems and methods for acceleration and rotational determination from an in-plane and out-of-plane MEMS device |
| US8011247B2 (en) * | 2008-06-26 | 2011-09-06 | Honeywell International Inc. | Multistage proof-mass movement deceleration within MEMS structures |
| KR101001666B1 (ko) * | 2008-07-08 | 2010-12-15 | 광주과학기술원 | 마이크로 수직 구조체의 제조 방법 |
| US8682606B2 (en) * | 2008-10-07 | 2014-03-25 | Qualcomm Incorporated | Generating virtual buttons using motion sensors |
| JP2010117292A (ja) * | 2008-11-14 | 2010-05-27 | Alps Electric Co Ltd | 角速度センサ |
| DE102008043796B4 (de) * | 2008-11-17 | 2023-12-21 | Robert Bosch Gmbh | Drehratensensor |
| US8351910B2 (en) * | 2008-12-02 | 2013-01-08 | Qualcomm Incorporated | Method and apparatus for determining a user input from inertial sensors |
| DE102009001244A1 (de) * | 2009-02-27 | 2010-09-02 | Sensordynamics Ag | Mikro-Gyroskop zur Ermittlung von Rotationsbewegungen um eine x-, y- oder z-Achse |
| FI20095201A0 (fi) * | 2009-03-02 | 2009-03-02 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
| US8151641B2 (en) | 2009-05-21 | 2012-04-10 | Analog Devices, Inc. | Mode-matching apparatus and method for micromachined inertial sensors |
| US8266961B2 (en) * | 2009-08-04 | 2012-09-18 | Analog Devices, Inc. | Inertial sensors with reduced sensitivity to quadrature errors and micromachining inaccuracies |
| WO2011019702A1 (en) * | 2009-08-13 | 2011-02-17 | Analog Devices, Inc. | Mems in-plane resonators |
| US8783103B2 (en) * | 2009-08-21 | 2014-07-22 | Analog Devices, Inc. | Offset detection and compensation for micromachined inertial sensors |
| EP2475959B1 (de) | 2009-09-09 | 2015-07-08 | Continental Teves AG & Co. oHG | Doppelaxialer, schockrobuster, drehratensensor mit linearen und rotatorischen seismischen elementen |
| US8534127B2 (en) * | 2009-09-11 | 2013-09-17 | Invensense, Inc. | Extension-mode angular velocity sensor |
| US9097524B2 (en) * | 2009-09-11 | 2015-08-04 | Invensense, Inc. | MEMS device with improved spring system |
| US8701459B2 (en) * | 2009-10-20 | 2014-04-22 | Analog Devices, Inc. | Apparatus and method for calibrating MEMS inertial sensors |
| US8516887B2 (en) * | 2010-04-30 | 2013-08-27 | Qualcomm Mems Technologies, Inc. | Micromachined piezoelectric z-axis gyroscope |
| US8966400B2 (en) | 2010-06-07 | 2015-02-24 | Empire Technology Development Llc | User movement interpretation in computer generated reality |
| TWI434803B (zh) | 2010-06-30 | 2014-04-21 | Ind Tech Res Inst | 微機電元件與電路晶片之整合裝置及其製造方法 |
| US8395381B2 (en) | 2010-07-09 | 2013-03-12 | Invensense, Inc. | Micromachined magnetic field sensors |
| US20120007597A1 (en) * | 2010-07-09 | 2012-01-12 | Invensense, Inc. | Micromachined offset reduction structures for magnetic field sensing |
| US8567246B2 (en) | 2010-10-12 | 2013-10-29 | Invensense, Inc. | Integrated MEMS device and method of use |
| US8631700B2 (en) | 2010-11-05 | 2014-01-21 | Analog Devices, Inc. | Resonating sensor with mechanical constraints |
| US8616056B2 (en) | 2010-11-05 | 2013-12-31 | Analog Devices, Inc. | BAW gyroscope with bottom electrode |
| US9091544B2 (en) | 2010-11-05 | 2015-07-28 | Analog Devices, Inc. | XY-axis shell-type gyroscopes with reduced cross-talk sensitivity and/or mode matching |
| US8604663B2 (en) * | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Motion controlled actuator |
| DE102010062056B4 (de) | 2010-11-26 | 2018-09-27 | Robert Bosch Gmbh | Mikromechanisches Bauteil |
| EP2646773B1 (en) | 2010-12-01 | 2015-06-24 | Analog Devices, Inc. | Apparatus and method for anchoring electrodes in mems devices |
| US9664750B2 (en) | 2011-01-11 | 2017-05-30 | Invensense, Inc. | In-plane sensing Lorentz force magnetometer |
| US8860409B2 (en) | 2011-01-11 | 2014-10-14 | Invensense, Inc. | Micromachined resonant magnetic field sensors |
| US8947081B2 (en) | 2011-01-11 | 2015-02-03 | Invensense, Inc. | Micromachined resonant magnetic field sensors |
| JP5790915B2 (ja) * | 2011-01-13 | 2015-10-07 | セイコーエプソン株式会社 | 物理量センサー及び電子機器 |
| US9039976B2 (en) | 2011-01-31 | 2015-05-26 | Analog Devices, Inc. | MEMS sensors with closed nodal anchors for operation in an in-plane contour mode |
| JP5807381B2 (ja) * | 2011-05-20 | 2015-11-10 | セイコーエプソン株式会社 | 物理量センサー、および電子機器 |
| US9705450B2 (en) * | 2011-06-24 | 2017-07-11 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and methods for time domain measurement of oscillation perturbations |
| US20130001710A1 (en) * | 2011-06-29 | 2013-01-03 | Invensense, Inc. | Process for a sealed mems device with a portion exposed to the environment |
| EP2544370B1 (en) * | 2011-07-06 | 2020-01-01 | Nxp B.V. | MEMS resonator |
| US10914584B2 (en) | 2011-09-16 | 2021-02-09 | Invensense, Inc. | Drive and sense balanced, semi-coupled 3-axis gyroscope |
| US9863769B2 (en) | 2011-09-16 | 2018-01-09 | Invensense, Inc. | MEMS sensor with decoupled drive system |
| US8833162B2 (en) * | 2011-09-16 | 2014-09-16 | Invensense, Inc. | Micromachined gyroscope including a guided mass system |
| US9714842B2 (en) * | 2011-09-16 | 2017-07-25 | Invensense, Inc. | Gyroscope self test by applying rotation on coriolis sense mass |
| US9170107B2 (en) * | 2011-09-16 | 2015-10-27 | Invensense, Inc. | Micromachined gyroscope including a guided mass system |
| US8739627B2 (en) | 2011-10-26 | 2014-06-03 | Freescale Semiconductor, Inc. | Inertial sensor with off-axis spring system |
| DE102011056971A1 (de) * | 2011-12-23 | 2013-06-27 | Maxim Integrated Products, Inc. | Mikromechanischer Coriolis-Drehratensensor |
| TWI453371B (zh) | 2011-12-30 | 2014-09-21 | Ind Tech Res Inst | 一種具振盪模組的微機電系統裝置 |
| DE102012200132A1 (de) | 2012-01-05 | 2013-07-11 | Robert Bosch Gmbh | Drehratensensor und Verfahren zum Betrieb eines Drehratensensors |
| US8984942B2 (en) * | 2012-02-10 | 2015-03-24 | Hewlett-Packard Development Company, L.P. | Suspended masses in micro-mechanical devices |
| JP5708535B2 (ja) * | 2012-03-13 | 2015-04-30 | 株式会社デンソー | 角速度センサ |
| US9212908B2 (en) | 2012-04-26 | 2015-12-15 | Analog Devices, Inc. | MEMS gyroscopes with reduced errors |
| US9194704B2 (en) | 2013-03-13 | 2015-11-24 | Freescale Semiconductor, Inc. | Angular rate sensor having multiple axis sensing capability |
| WO2015042700A1 (en) | 2013-09-24 | 2015-04-02 | Motion Engine Inc. | Mems components and method of wafer-level manufacturing thereof |
| EP3019442A4 (en) | 2013-07-08 | 2017-01-25 | Motion Engine Inc. | Mems device and method of manufacturing |
| EP3028007A4 (en) | 2013-08-02 | 2017-07-12 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
| US9709595B2 (en) | 2013-11-14 | 2017-07-18 | Analog Devices, Inc. | Method and apparatus for detecting linear and rotational movement |
| US9599471B2 (en) | 2013-11-14 | 2017-03-21 | Analog Devices, Inc. | Dual use of a ring structure as gyroscope and accelerometer |
| JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積memsシステム |
| US9958271B2 (en) | 2014-01-21 | 2018-05-01 | Invensense, Inc. | Configuration to reduce non-linear motion |
| JP2015184009A (ja) | 2014-03-20 | 2015-10-22 | セイコーエプソン株式会社 | 振動素子、電子機器、および移動体 |
| US20170030788A1 (en) | 2014-04-10 | 2017-02-02 | Motion Engine Inc. | Mems pressure sensor |
| WO2015184531A1 (en) | 2014-06-02 | 2015-12-10 | Motion Engine Inc. | Multi-mass mems motion sensor |
| JP6481294B2 (ja) | 2014-09-05 | 2019-03-13 | セイコーエプソン株式会社 | 物理量センサー素子、物理量センサー、電子機器および移動体 |
| JP2016057073A (ja) | 2014-09-05 | 2016-04-21 | セイコーエプソン株式会社 | 物理量センサー素子、物理量センサー、電子機器および移動体 |
| JP6481293B2 (ja) | 2014-09-05 | 2019-03-13 | セイコーエプソン株式会社 | 物理量センサー素子、物理量センサー、電子機器および移動体 |
| WO2016040018A1 (en) | 2014-09-08 | 2016-03-17 | Invensense Incorporated | System and method for hierarchical sensor processing |
| US10746548B2 (en) | 2014-11-04 | 2020-08-18 | Analog Devices, Inc. | Ring gyroscope structural features |
| CA3004760A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
| US10231337B2 (en) | 2014-12-16 | 2019-03-12 | Inertial Sense, Inc. | Folded printed circuit assemblies and related methods |
| CA3004763A1 (en) | 2015-01-15 | 2016-07-21 | Motion Engine Inc. | 3d mems device with hermetic cavity |
| KR101659207B1 (ko) | 2015-02-05 | 2016-09-22 | 삼성전기주식회사 | 각속도 센서 |
| EP3257074A1 (en) | 2015-02-11 | 2017-12-20 | InvenSense, Inc. | 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT |
| US9869552B2 (en) * | 2015-03-20 | 2018-01-16 | Analog Devices, Inc. | Gyroscope that compensates for fluctuations in sensitivity |
| KR101915954B1 (ko) * | 2016-06-29 | 2018-11-08 | 주식회사 신성씨앤티 | 멤스 기반의 3축 가속도 센서 |
| US10192850B1 (en) | 2016-09-19 | 2019-01-29 | Sitime Corporation | Bonding process with inhibited oxide formation |
| JP6639377B2 (ja) | 2016-12-08 | 2020-02-05 | 株式会社東芝 | 振動装置 |
| DE102017200725A1 (de) | 2017-01-18 | 2018-07-19 | Robert Bosch Gmbh | Mikromechanischer Sensor |
| US10466053B2 (en) * | 2017-04-04 | 2019-11-05 | Invensense, Inc. | Out-of-plane sensing gyroscope robust to external acceleration and rotation |
| US11656077B2 (en) | 2019-01-31 | 2023-05-23 | Analog Devices, Inc. | Pseudo-extensional mode MEMS ring gyroscope |
| EP3696503B1 (en) * | 2019-02-15 | 2022-10-26 | Murata Manufacturing Co., Ltd. | Vibration-robust multiaxis gyroscope |
| US11060866B2 (en) * | 2019-02-15 | 2021-07-13 | Murata Manufacturing Co., Ltd. | Balanced multiaxis gyroscope |
| DE102020205372A1 (de) * | 2020-04-28 | 2021-10-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für einen Drehratensensor und entsprechendes Herstellungsverfahren |
| US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
| US11714102B2 (en) | 2021-06-08 | 2023-08-01 | Analog Devices, Inc. | Fully differential accelerometer |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5359893A (en) * | 1991-12-19 | 1994-11-01 | Motorola, Inc. | Multi-axes gyroscope |
| DE4414237A1 (de) * | 1994-04-23 | 1995-10-26 | Bosch Gmbh Robert | Mikromechanischer Schwinger eines Schwingungsgyrometers |
| DE19523895A1 (de) * | 1995-06-30 | 1997-01-02 | Bosch Gmbh Robert | Beschleunigungssensor |
| US5992233A (en) | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
| JPH1038578A (ja) * | 1996-07-17 | 1998-02-13 | Tokin Corp | 角速度センサ |
| US6122961A (en) | 1997-09-02 | 2000-09-26 | Analog Devices, Inc. | Micromachined gyros |
| JP3882973B2 (ja) * | 1998-06-22 | 2007-02-21 | アイシン精機株式会社 | 角速度センサ |
| JP3106395B2 (ja) * | 1998-07-10 | 2000-11-06 | 株式会社村田製作所 | 角速度センサ |
| US6481283B1 (en) | 1999-04-05 | 2002-11-19 | Milli Sensor Systems & Actuators, Inc. | Coriolis oscillating gyroscopic instrument |
| AU7049000A (en) | 1999-04-21 | 2000-11-21 | Regents Of The University Of California, The | Micro-machined angle-measuring gyroscope |
| US6189381B1 (en) * | 1999-04-26 | 2001-02-20 | Sitek, Inc. | Angular rate sensor made from a structural wafer of single crystal silicon |
| US6487907B1 (en) | 1999-07-08 | 2002-12-03 | California Institute Of Technology | Microgyroscope with integrated vibratory element |
| US6508122B1 (en) | 1999-09-16 | 2003-01-21 | American Gnc Corporation | Microelectromechanical system for measuring angular rate |
| KR100343211B1 (ko) | 1999-11-04 | 2002-07-10 | 윤종용 | 웨이퍼 레벨 진공 패키징이 가능한 mems의 구조물의제작방법 |
| WO2001071364A1 (en) | 2000-03-17 | 2001-09-27 | Microsensors, Inc. | Method of canceling quadrature error in an angular rate sensor |
| JP2002148048A (ja) * | 2000-11-08 | 2002-05-22 | Murata Mfg Co Ltd | 角速度検出素子 |
| US6480320B2 (en) | 2001-02-07 | 2002-11-12 | Transparent Optical, Inc. | Microelectromechanical mirror and mirror array |
| US6513380B2 (en) | 2001-06-19 | 2003-02-04 | Microsensors, Inc. | MEMS sensor with single central anchor and motion-limiting connection geometry |
| US6629460B2 (en) * | 2001-08-10 | 2003-10-07 | The Boeing Company | Isolated resonator gyroscope |
| KR100436367B1 (ko) | 2001-12-14 | 2004-06-19 | 삼성전자주식회사 | 수직 진동 질량체를 갖는 멤스 자이로스코프 |
| KR100431004B1 (ko) | 2002-02-08 | 2004-05-12 | 삼성전자주식회사 | 회전형 비연성 멤스 자이로스코프 |
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| US6892575B2 (en) | 2005-05-17 |
| JP2007509346A (ja) | 2007-04-12 |
| EP1676096A4 (en) | 2009-11-18 |
| EP1676096A2 (en) | 2006-07-05 |
| TWI247896B (en) | 2006-01-21 |
| WO2005043079A2 (en) | 2005-05-12 |
| TW200526961A (en) | 2005-08-16 |
| US20050081633A1 (en) | 2005-04-21 |
| WO2005043079A3 (en) | 2005-08-11 |
| EP1676096B1 (en) | 2017-06-07 |
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