TWI242593B - Adhesive tape for semiconductor apparatus - Google Patents
Adhesive tape for semiconductor apparatus Download PDFInfo
- Publication number
- TWI242593B TWI242593B TW092131052A TW92131052A TWI242593B TW I242593 B TWI242593 B TW I242593B TW 092131052 A TW092131052 A TW 092131052A TW 92131052 A TW92131052 A TW 92131052A TW I242593 B TWI242593 B TW I242593B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- mass
- resin
- thermosetting
- thickness
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 66
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 55
- 238000003860 storage Methods 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 38
- 150000001412 amines Chemical class 0.000 claims description 23
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000000539 dimer Substances 0.000 claims description 11
- 239000005011 phenolic resin Substances 0.000 claims description 11
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 10
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 10
- 239000009719 polyimide resin Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 235000020778 linoleic acid Nutrition 0.000 claims description 5
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 claims description 5
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- 239000010408 film Substances 0.000 description 29
- 239000000243 solution Substances 0.000 description 28
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- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
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- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002325431A JP3811120B2 (ja) | 2002-11-08 | 2002-11-08 | 半導体装置用接着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200420702A TW200420702A (en) | 2004-10-16 |
TWI242593B true TWI242593B (en) | 2005-11-01 |
Family
ID=32804661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092131052A TWI242593B (en) | 2002-11-08 | 2003-11-06 | Adhesive tape for semiconductor apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3811120B2 (ko) |
KR (1) | KR100526624B1 (ko) |
CN (1) | CN1296979C (ko) |
TW (1) | TWI242593B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5470690B2 (ja) * | 2007-09-04 | 2014-04-16 | 株式会社デンソー | ベアチップの実装構造 |
JP5083070B2 (ja) * | 2007-11-19 | 2012-11-28 | 日立化成工業株式会社 | 封止用フィルム |
CN101527178B (zh) * | 2008-03-04 | 2012-05-23 | 上海均达科技发展有限公司 | 热收缩薄膜交织布绝缘保护带 |
US20110272185A1 (en) | 2009-01-28 | 2011-11-10 | Akiko Kawaguchi | Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06181227A (ja) * | 1992-12-14 | 1994-06-28 | Hitachi Chem Co Ltd | 接着剤及び半導体装置 |
KR19990067623A (ko) * | 1995-11-28 | 1999-08-25 | 가나이 쓰도무 | 반도체장치와 그 제조방법 및 실장기판 |
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
JP2001081438A (ja) * | 1999-09-14 | 2001-03-27 | Sony Chem Corp | 接続材料 |
JP3371894B2 (ja) * | 1999-09-17 | 2003-01-27 | ソニーケミカル株式会社 | 接続材料 |
-
2002
- 2002-11-08 JP JP2002325431A patent/JP3811120B2/ja not_active Expired - Lifetime
-
2003
- 2003-11-06 TW TW092131052A patent/TWI242593B/zh not_active IP Right Cessation
- 2003-11-06 KR KR10-2003-0078257A patent/KR100526624B1/ko active IP Right Grant
- 2003-11-06 CN CNB2003101240714A patent/CN1296979C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20040041030A (ko) | 2004-05-13 |
JP2004158798A (ja) | 2004-06-03 |
CN1296979C (zh) | 2007-01-24 |
TW200420702A (en) | 2004-10-16 |
JP3811120B2 (ja) | 2006-08-16 |
CN1523651A (zh) | 2004-08-25 |
KR100526624B1 (ko) | 2005-11-08 |
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