TW200420702A - Adhesive tape for semiconductor apparatus - Google Patents
Adhesive tape for semiconductor apparatusInfo
- Publication number
- TW200420702A TW200420702A TW092131052A TW92131052A TW200420702A TW 200420702 A TW200420702 A TW 200420702A TW 092131052 A TW092131052 A TW 092131052A TW 92131052 A TW92131052 A TW 92131052A TW 200420702 A TW200420702 A TW 200420702A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- semiconductor apparatus
- thermosetting adhesive
- adhesive tape
- mpa
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 5
- 229920001187 thermosetting polymer Polymers 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Abstract
An adhesive tape for a semiconductor apparatus comprises an insulating film and a thermosetting adhesive layer, and when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and loss modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 0.25 Mpa/μ m, superior wire bonding characteristics are obtained. Furthermore, when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and storage modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 1 Mpa/μ m, the adhesive tape for a semiconductor apparatus exhibits more superior wire bonding characteristics.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002325431A JP3811120B2 (en) | 2002-11-08 | 2002-11-08 | Adhesive tape for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200420702A true TW200420702A (en) | 2004-10-16 |
TWI242593B TWI242593B (en) | 2005-11-01 |
Family
ID=32804661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092131052A TWI242593B (en) | 2002-11-08 | 2003-11-06 | Adhesive tape for semiconductor apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3811120B2 (en) |
KR (1) | KR100526624B1 (en) |
CN (1) | CN1296979C (en) |
TW (1) | TWI242593B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5470690B2 (en) * | 2007-09-04 | 2014-04-16 | 株式会社デンソー | Bare chip mounting structure |
JP5083070B2 (en) * | 2007-11-19 | 2012-11-28 | 日立化成工業株式会社 | Sealing film |
CN101527178B (en) * | 2008-03-04 | 2012-05-23 | 上海均达科技发展有限公司 | Heat shrinkage film interwoven fabric insulating protection belt |
JP5921800B2 (en) | 2009-01-28 | 2016-05-24 | 日立化成株式会社 | Prepreg, film with resin, metal foil with resin, metal foil-clad laminate and printed wiring board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06181227A (en) * | 1992-12-14 | 1994-06-28 | Hitachi Chem Co Ltd | Adhesive and semiconductor device |
US6404049B1 (en) * | 1995-11-28 | 2002-06-11 | Hitachi, Ltd. | Semiconductor device, manufacturing method thereof and mounting board |
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
JP2001081438A (en) * | 1999-09-14 | 2001-03-27 | Sony Chem Corp | Connecting material |
JP3371894B2 (en) * | 1999-09-17 | 2003-01-27 | ソニーケミカル株式会社 | Connecting material |
-
2002
- 2002-11-08 JP JP2002325431A patent/JP3811120B2/en not_active Expired - Lifetime
-
2003
- 2003-11-06 CN CNB2003101240714A patent/CN1296979C/en not_active Expired - Lifetime
- 2003-11-06 KR KR10-2003-0078257A patent/KR100526624B1/en active IP Right Grant
- 2003-11-06 TW TW092131052A patent/TWI242593B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004158798A (en) | 2004-06-03 |
KR100526624B1 (en) | 2005-11-08 |
KR20040041030A (en) | 2004-05-13 |
CN1296979C (en) | 2007-01-24 |
CN1523651A (en) | 2004-08-25 |
JP3811120B2 (en) | 2006-08-16 |
TWI242593B (en) | 2005-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |