TW200420702A - Adhesive tape for semiconductor apparatus - Google Patents

Adhesive tape for semiconductor apparatus

Info

Publication number
TW200420702A
TW200420702A TW092131052A TW92131052A TW200420702A TW 200420702 A TW200420702 A TW 200420702A TW 092131052 A TW092131052 A TW 092131052A TW 92131052 A TW92131052 A TW 92131052A TW 200420702 A TW200420702 A TW 200420702A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
semiconductor apparatus
thermosetting adhesive
adhesive tape
mpa
Prior art date
Application number
TW092131052A
Other languages
Chinese (zh)
Other versions
TWI242593B (en
Inventor
Toshio Fujii
Kiyoshi Unno
Nobuko Kobayashi
Akinori Sei
Hitoshi Narushima
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of TW200420702A publication Critical patent/TW200420702A/en
Application granted granted Critical
Publication of TWI242593B publication Critical patent/TWI242593B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

An adhesive tape for a semiconductor apparatus comprises an insulating film and a thermosetting adhesive layer, and when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and loss modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 0.25 Mpa/μ m, superior wire bonding characteristics are obtained. Furthermore, when a product of the reciprocal number of the thickness of the thermosetting adhesive layer and storage modulus of the thermosetting adhesive layer at 200 DEG C after curing is larger than 1 Mpa/μ m, the adhesive tape for a semiconductor apparatus exhibits more superior wire bonding characteristics.
TW092131052A 2002-11-08 2003-11-06 Adhesive tape for semiconductor apparatus TWI242593B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002325431A JP3811120B2 (en) 2002-11-08 2002-11-08 Adhesive tape for semiconductor devices

Publications (2)

Publication Number Publication Date
TW200420702A true TW200420702A (en) 2004-10-16
TWI242593B TWI242593B (en) 2005-11-01

Family

ID=32804661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131052A TWI242593B (en) 2002-11-08 2003-11-06 Adhesive tape for semiconductor apparatus

Country Status (4)

Country Link
JP (1) JP3811120B2 (en)
KR (1) KR100526624B1 (en)
CN (1) CN1296979C (en)
TW (1) TWI242593B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5470690B2 (en) * 2007-09-04 2014-04-16 株式会社デンソー Bare chip mounting structure
JP5083070B2 (en) * 2007-11-19 2012-11-28 日立化成工業株式会社 Sealing film
CN101527178B (en) * 2008-03-04 2012-05-23 上海均达科技发展有限公司 Heat shrinkage film interwoven fabric insulating protection belt
JP5921800B2 (en) 2009-01-28 2016-05-24 日立化成株式会社 Prepreg, film with resin, metal foil with resin, metal foil-clad laminate and printed wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06181227A (en) * 1992-12-14 1994-06-28 Hitachi Chem Co Ltd Adhesive and semiconductor device
US6404049B1 (en) * 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
JP2001081438A (en) * 1999-09-14 2001-03-27 Sony Chem Corp Connecting material
JP3371894B2 (en) * 1999-09-17 2003-01-27 ソニーケミカル株式会社 Connecting material

Also Published As

Publication number Publication date
JP2004158798A (en) 2004-06-03
KR100526624B1 (en) 2005-11-08
KR20040041030A (en) 2004-05-13
CN1296979C (en) 2007-01-24
CN1523651A (en) 2004-08-25
JP3811120B2 (en) 2006-08-16
TWI242593B (en) 2005-11-01

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent